Qualcomm incorporated (20240203820). PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract
Contents
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
Organization Name
Inventor(s)
Youmin Yu of Escondido CA (US)
Guoping Xu of San Diego CA (US)
Nader Nikfar of San Diego CA (US)
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203820 titled 'PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
Simplified Explanation: The patent application describes a package consisting of a substrate, an integrated device, and a lid structure with a thermal interface material. The substrate contains dielectric layers and interconnects.
Key Features and Innovation:
- Package includes substrate, integrated device, and lid structure with thermal interface material.
- Substrate has dielectric layers and interconnects for connectivity.
- Lid structure has a compartment with side and inner top surfaces for thermal management.
Potential Applications: This technology can be used in various electronic devices requiring efficient thermal management, such as computers, smartphones, and servers.
Problems Solved: This technology addresses the issue of heat dissipation in electronic devices, ensuring optimal performance and longevity.
Benefits:
- Improved thermal management for electronic devices.
- Enhanced performance and reliability.
- Longer lifespan of electronic components.
Commercial Applications: Potential commercial applications include consumer electronics, telecommunications equipment, and industrial machinery where thermal management is critical for operation.
Questions about the Technology: 1. How does the thermal interface material improve heat dissipation in the package? 2. What are the specific advantages of using dielectric layers and interconnects in the substrate for connectivity?
Frequently Updated Research: Ongoing research in thermal management techniques and materials could further enhance the efficiency of this technology in electronic devices.
Original Abstract Submitted
a package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. the substrate includes at least one dielectric layer and a plurality of interconnects.
