Qualcomm incorporated (20240162155). PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK simplified abstract
Contents
PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK
Organization Name
Inventor(s)
Jason Gonzalez of Solana Beach CA (US)
PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162155 titled 'PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK
Simplified Explanation
A device described in the patent application comprises a substrate with integrated devices and passive devices coupled to its surfaces, along with interconnects including a power interconnect. The devices are electrically coupled to the power interconnect through a first plurality of interconnects, which operate as an inductor.
- The device includes a substrate with integrated and passive devices.
- The substrate has interconnects, including a power interconnect.
- The devices are electrically coupled to the power interconnect through a first plurality of interconnects.
- The first plurality of interconnects operate as an inductor, including a via interconnect.
- Potential Applications
This technology could be applied in power electronics, integrated circuits, and electronic devices requiring efficient power distribution and management.
- Problems Solved
This technology solves the problem of efficient power distribution and management within electronic devices, improving overall performance and reliability.
- Benefits
The benefits of this technology include improved power efficiency, enhanced performance of electronic devices, and increased reliability due to optimized power distribution.
- Potential Commercial Applications
This technology could be commercially applied in the semiconductor industry, consumer electronics, automotive electronics, and telecommunications for improved power management solutions.
- Possible Prior Art
One possible prior art could be the use of inductors in electronic circuits for power distribution and management, but the specific configuration and integration described in this patent application may be novel.
- Unanswered Questions
- How does the size of the inductor affect the overall performance of the device?
The size of the inductor can impact the efficiency and power handling capabilities of the device. A larger inductor may provide better performance but could also increase the overall size of the device.
- What materials are used in the fabrication of the power interconnect and how does it affect the device's performance?
The materials used in the power interconnect can impact factors such as resistance, heat dissipation, and overall reliability of the device. Understanding the material properties and their effects on performance is crucial for optimizing the device design.
Original Abstract Submitted
a device comprising a substrate, a first integrated device coupled to a first surface of the substrate, a second integrated device coupled to the first surface of the substrate, a first passive device coupled to a second surface of the substrate and a second passive device coupled to the second surface of the substrate. the substrate comprises at least one dielectric layer and a plurality of interconnects. the plurality of interconnects include a power interconnect. the power interconnect is configured to be electrically coupled to power. the first integrated device, the first passive device, the second integrated device and the second passive device are configured to be electrically coupled to the power interconnect through a first plurality of interconnects from the plurality of interconnects. the first plurality of interconnects are configured to operate as an inductor, where the first plurality of interconnects include a via interconnect.
