QUALCOMM Incorporated patent applications on January 18th, 2024
Patent Applications by QUALCOMM Incorporated on January 18th, 2024
QUALCOMM Incorporated: 80 patent applications
QUALCOMM Incorporated has applied for patents in the areas of H04L5/00 (19), H04W72/1268 (15), H04L5/0048 (10), H04W24/10 (10), H04W72/23 (10)
With keywords such as: based, wireless, transmission, uplink, user, network, information, communication, signal, and transmit in patent application abstracts.
Patent Applications by QUALCOMM Incorporated
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Yuxiang PENG of Sunnyvale CA (US) for qualcomm incorporated, Ning LUO of Cupertino CA (US) for qualcomm incorporated, Bo ZHENG of Sunnyvale CA (US) for qualcomm incorporated
IPC Code(s): G01C21/30, G08G1/0962, B60W50/14
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Umesh Phuyal of San Diego CA (US) for qualcomm incorporated, Le Liu of San Jose CA (US) for qualcomm incorporated, Chiranjib Saha of San Diego CA (US) for qualcomm incorporated, Wanshi Chen of San Diego CA (US) for qualcomm incorporated, Masato Kitazoe of Tokyo (JP) for qualcomm incorporated, Bharat Shrestha of San Diego CA (US) for qualcomm incorporated, Xiao Feng Wang of San Diego CA (US) for qualcomm incorporated, Alberto Rico Alvarino of San Diego CA (US) for qualcomm incorporated, Changhwan Park of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G01S1/18, G08G5/00, B64C39/02
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Weimin DUAN of San Diego CA (US) for qualcomm incorporated, Alexandros MANOLAKOS of Escondido CA (US) for qualcomm incorporated, Jing LEI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G01S5/02, H04W64/00, G01S5/10, G01S5/06, G01S7/00, G01S13/87, G01S7/40
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Sven FISCHER of Nuremberg (DE) for qualcomm incorporated, Stephen William EDGE of Escondido CA (US) for qualcomm incorporated, Alexandros MANOLAKOS of Escondido CA (US) for qualcomm incorporated, Sony AKKARAKARAN of Poway CA (US) for qualcomm incorporated
IPC Code(s): G01S5/02, G01S5/00, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Marwen ZORGUI of San Diego CA (US) for qualcomm incorporated, Srinivas YERRAMALLI of San Diego CA (US) for qualcomm incorporated, Taesang YOO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G01S5/02
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Uri LEVY of Zichron Yaakov, Ha (IL) for qualcomm incorporated, Ariel Yaakov SAGI of Haifa, HA (IL) for qualcomm incorporated, Evyatar HEMO of Kiryat Bialik, HA (IL) for qualcomm incorporated, Evgeny LEVITAN of Haifa, HA (IL) for qualcomm incorporated
IPC Code(s): G01S13/524, G01S7/288, G01S13/931, G01S13/58, G01S13/42
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jean-Philippe MONTEUUIS of Northborough MA (US) for qualcomm incorporated, Jonathan PETIT of Wenham MA (US) for qualcomm incorporated, Mohammad Raashid ANSARI of Lowell MA (US) for qualcomm incorporated, Cong CHEN of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G06F11/07
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Richard Barron FRANKLIN of San Diego CA (US) for qualcomm incorporated, Christopher Alan PAGNOTTA of Carlsbad CA (US) for qualcomm incorporated, Justin Joseph Rosen GAGNE of San Diego CA (US) for qualcomm incorporated, Jeffrey PAYNE of Lakeside CA (US) for qualcomm incorporated, Stephen James POTTER of San Diego CA (US) for qualcomm incorporated, Bengt Stefan GUSTAVSSON of Rancho Santa Fe CA (US) for qualcomm incorporated
IPC Code(s): G06F16/687, H04R3/00, G06F16/68
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Debasmit DAS of San Diego CA (US) for qualcomm incorporated, Shubhankar Mangesh BORSE of San Diego CA (US) for qualcomm incorporated, Hyojin PARK of San Diego CA (US) for qualcomm incorporated, Kambiz AZARIAN YAZDI of San Diego CA (US) for qualcomm incorporated, Hong CAI of San Diego CA (US) for qualcomm incorporated, Risheek GARREPALLI of San Diego CA (US) for qualcomm incorporated, Fatih Murat PORIKLI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G06T7/11
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Debasmit DAS of San Diego CA (US) for qualcomm incorporated, Shubhankar Mangesh BORSE of San Diego CA (US) for qualcomm incorporated, Hyojin PARK of San Diego CA (US) for qualcomm incorporated, Kambiz AZARIAN YAZDI of San Diego CA (US) for qualcomm incorporated, Hong CAI of San Diego CA (US) for qualcomm incorporated, Risheek GARREPALLI of San Diego CA (US) for qualcomm incorporated, Fatih Murat PORIKLI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G06T7/168
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Hong CHENG of Basking Ridge NJ (US) for qualcomm incorporated, Shailesh PATIL of San Diego CA (US) for qualcomm incorporated, Arthur GUBESKYS of San Diego CA (US) for qualcomm incorporated, Gene Wesley MARSH of San Diego CA (US) for qualcomm incorporated, Kapil GULATI of Belle Mead NJ (US) for qualcomm incorporated, Ahmed Kamel SADEK of San Diego CA (US) for qualcomm incorporated, Sivaramakrishna VEEREPALLI of San Diego CA (US) for qualcomm incorporated, Jeremiah GOLSTON of San Diego CA (US) for qualcomm incorporated
IPC Code(s): G06T19/00, G06Q20/32, H04W76/10
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jonghae KIM of San Diego CA (US) for qualcomm incorporated, Je-Hsiung LAN of San Diego CA (US) for qualcomm incorporated, Kai LIU of Phoenix AZ (US) for qualcomm incorporated, Ranadeep DUTTA of Del Mar CA (US) for qualcomm incorporated
IPC Code(s): H01F17/00, H01F27/28
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jay Scott Salmon of San Diego CA (US) for qualcomm incorporated, Anirudh Bhat of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H01L23/552, H01L21/48, H01L21/56, H01L23/14, H01L23/367, H01L23/498, H01L23/66, H01L23/00, H01L25/065
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Xia Li of San Diego CA (US) for qualcomm incorporated, Bin Yang of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H01L25/07, H01L25/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Julio ZEGARRA of La Jolla CA (US) for qualcomm incorporated, Peter LIEN of Carlsbad CA (US) for qualcomm incorporated, Sang-June PARK of San Diego CA (US) for qualcomm incorporated, Darryl Sheldon JESSIE of San Diego CA (US) for qualcomm incorporated, Alberto CICALINI of Tortona (IT) for qualcomm incorporated, Sean OAK of Lakeside CA (US) for qualcomm incorporated, Neil BURNS of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H01Q23/00, H01Q1/52, H01Q1/48, H05K1/18
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Zaid ABOUSH of Chandler AZ (US) for qualcomm incorporated, Noshir Behli DUBASH of Phoenix AZ (US) for qualcomm incorporated, Abhijeet PAUL of San Diego CA (US) for qualcomm incorporated, Peter Graeme CLARKE of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H03F3/24, H03F1/22, H03F1/02
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Evgeny LEVITAN of Haifa (IL) for qualcomm incorporated, Evyatar HEMO of Kiryat Bialik (IL) for qualcomm incorporated, Moshe BINO of Tirat Carmel (IL) for qualcomm incorporated, Ariel SAGI of Haifa (IL) for qualcomm incorporated, Ilia ANTSIFEROV of Netanya (IL) for qualcomm incorporated, Amichai SANDEROVICH of Atlit (IL) for qualcomm incorporated
IPC Code(s): H04B1/04, H04L25/03
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Vasanthan RAGHAVAN of West Windsor Township NJ (US) for qualcomm incorporated, Mohammad Ali TASSOUDJI of San Diego CA (US) for qualcomm incorporated, Raghu Narayan CHALLA of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04B1/401, H04B7/08, H04B7/06
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Sameer VERMANI of San Diego CA (US) for qualcomm incorporated, Bin TIAN of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04B7/024, H04L5/00, H04B7/0452, H04W72/044, H04B7/0417, H04W84/12, H04W72/29
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Alexandros MANOLAKOS of Escondido CA (US) for qualcomm incorporated, June NAMGOONG of San Diego CA (US) for qualcomm incorporated, Taesang YOO of San Diego CA (US) for qualcomm incorporated, Naga BHUSHAN of San Diego CA (US) for qualcomm incorporated, Jay Kumar SUNDARARAJAN of San Diego CA (US) for qualcomm incorporated, Pavan Kumar VITTHALADEVUNI of San Diego CA (US) for qualcomm incorporated, Krishna Kiran MUKKAVILLI of San Diego CA (US) for qualcomm incorporated, Hwan Joon KWON of San Diego CA (US) for qualcomm incorporated, Tingfang JI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04B7/0417
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Makesh Pravin JOHN WILSON of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04B7/06, H04L5/00, H04L25/02, H04B7/024, H04W72/0446, H04W72/044, H04W72/23
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Tianyang Bai of Somerville NJ (US) for qualcomm incorporated, Hua Wang of Basking Ridge NJ (US) for qualcomm incorporated, Junyi Li of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04B7/08, H04W72/08, H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Lianghai JI of San Diego CA (US) for qualcomm incorporated, Jun MA of San Diego CA (US) for qualcomm incorporated, Qiang WU of San Diego CA (US) for qualcomm incorporated, Liangping MA of San Diego CA (US) for qualcomm incorporated, Huilin XU of Temecula CA (US) for qualcomm incorporated, Mohamad SAYED HASSAN of Paris (FR) for qualcomm incorporated, Mehmet Izzet GURELLI of San Diego CA (US) for qualcomm incorporated, Weimin DUAN of San Diego CA (US) for qualcomm incorporated, Karthik ANANTHA SWAMY of La Jolla CA (US) for qualcomm incorporated, Onur SENEL of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04B7/185, H04W56/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Kannan MUTHURAMAN of Mission Viejo CA (US) for qualcomm incorporated, Francesco GRILLI of La Jolla CA (US) for qualcomm incorporated
IPC Code(s): H04B7/185
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): David Yunusov of Holon (IL) for qualcomm incorporated, Gideon Shlomo Kutz of Ramat Hasharon (IL) for qualcomm incorporated
IPC Code(s): H04L1/00, H03M13/11
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Arnaud MEYLAN of San Diego CA (US) for qualcomm incorporated, Levent AYDIN of San Diego CA (US) for qualcomm incorporated, Ashok MANTRAVADI of San Diego CA (US) for qualcomm incorporated, Brian Clarke BANISTER of San Diego CA (US) for qualcomm incorporated, Leena ZACHARIAS of San Jose CA (US) for qualcomm incorporated, Sitaramanjaneyulu KANAMARLAPUDI of San Diego CA (US) for qualcomm incorporated, Hobin KIM of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L1/1829, H04W72/232, H04W76/28
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Idan Michael Horn of Hod Hasharon (IL) for qualcomm incorporated, Shay Landis of Hod Hasharon (IL) for qualcomm incorporated, Yehonatan Dallal of Kfar Saba (IL) for qualcomm incorporated
IPC Code(s): H04L5/00, H04W8/24
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Muhammad Nazmul ISLAM of Littleton MA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated, Sundar SUBRAMANIAN of San Diego CA (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated, Juergen CEZANNE of Ocean Township NJ (US) for qualcomm incorporated
IPC Code(s): H04L5/00, H04W72/044, H04W72/23, H04L1/08, H04W72/1263
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Saeid SAHRAEI of San Diego CA (US) for qualcomm incorporated, Muhammad Sayed Khairy ABDELGHAFFAR of San Jose CA (US) for qualcomm incorporated, Renqiu WANG of San Diego CA (US) for qualcomm incorporated, Joseph Patrick BURKE of San Diego CA (US) for qualcomm incorporated, Tingfang JI of San Diego CA (US) for qualcomm incorporated, Vijay KUMARAVELU of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L5/00, H04B7/06
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mostafa Khoshnevisan of San Diego CA (US) for qualcomm incorporated, Ahmed Abdelaziz Ibrahim Abdelaziz Zewail of San Diego CA (US) for qualcomm incorporated, Jing Sun of San Diego CA (US) for qualcomm incorporated, Xiaoxia Zhang of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L5/00, H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Yuwei REN of Beijing (CN) for qualcomm incorporated, Huilin XU of Temecula CA (US) for qualcomm incorporated, Jing LEI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L5/00, H04W56/00, H04W72/1268
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Qian ZHANG of Basking Ridge NJ (US) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Muhammad Sayed Khairy ABDELGHAFFAR of San Jose CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated, Abdelrahman Mohamed Ahmed Mohamed IBRAHIM of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L5/14, H04W8/24
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Simone MERLIN of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L25/02, H04W24/10, H04B17/318
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jung Ho RYU of Fort Lee NJ (US) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04L41/0677, H04W24/08, H04L43/16, H04W8/22, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Nan Zhang of Beijing (CN) for qualcomm incorporated, Yongjun Xu of Beijing (CN) for qualcomm incorporated
IPC Code(s): H04N13/351, G06T15/00, G06T5/00, G06T7/10, G06T7/593, G06V40/16, H04M1/02
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Han Huang of San Diego CA (US) for qualcomm incorporated, Yan Zhang of San Diego CA (US) for qualcomm incorporated, Vadim Seregin of San Diego CA (US) for qualcomm incorporated, Marta Karczewicz of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04N19/137, H04N19/80, H04N19/176, H04N19/70
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Reza POURREZA of San Diego CA (US) for qualcomm incorporated, Taco Sebastiaan COHEN of Amsterdam (NL) for qualcomm incorporated
IPC Code(s): H04N19/59, G06N3/063, G06N3/088, G06N3/045
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Nan ZHANG of Beijing (CN) for qualcomm incorporated, Yu CHEN of Beijing (CN) for qualcomm incorporated, Xia ZHAO of Beijing (CN) for qualcomm incorporated
IPC Code(s): H04N21/43, H04N21/4363
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Yavuz YAPICI of Florham Park NJ (US) for qualcomm incorporated, Igor GUTMAN of Hod HaSharon (IL) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W12/08, H04W12/12, H04L9/40
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Shanyu Zhou of San Diego CA (US) for qualcomm incorporated, Jelena Damnjanovic of Del Mar CA (US) for qualcomm incorporated, Tao Luo of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W24/02, H04W16/18
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jelena DAMNJANOVIC of Del Mar CA (US) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W24/10, H04L5/00, H04W16/28
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Lior Uziel of Hod Hasharon (IL) for qualcomm incorporated, Guy Wolf of Rosh Haayin (IL) for qualcomm incorporated, Assaf Touboul of Netanya (IL) for qualcomm incorporated
IPC Code(s): H04W24/10, H04W24/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Fang YUAN of Beijing (CN) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W24/10, H04W52/36
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Srikant KUPPA of Fremont CA (US) for qualcomm incorporated, Sandip HOMCHAUDHURI of San Jose CA (US) for qualcomm incorporated, Yongchun XIAO of Fremont CA (US) for qualcomm incorporated, Hao-Jen CHENG of San Jose CA (US) for qualcomm incorporated
IPC Code(s): H04W28/02, H04B1/713
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Linhai HE of San Diego CA (US) for qualcomm incorporated, Dario Serafino TONESI of San Diego CA (US) for qualcomm incorporated, Miguel GRIOT of La Jolla CA (US) for qualcomm incorporated, Gavin Bernard HORN of La Jolla CA (US) for qualcomm incorporated, Yuchul KIM of San Diego CA (US) for qualcomm incorporated, Huilin XU of Temecula CA (US) for qualcomm incorporated, Mickael MONDET of Louannec (FR) for qualcomm incorporated, Prashanth Haridas HANDE of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W28/06
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Prasad Reddy KADIRI of San Diego CA (US) for qualcomm incorporated, Xipeng ZHU of San Diego CA (US) for qualcomm incorporated, Umesh PHUYAL of San Diego CA (US) for qualcomm incorporated, Bharat SHRESTHA of San Diego CA (US) for qualcomm incorporated, Miguel GRIOT of La Jolla CA (US) for qualcomm incorporated, Haris ZISIMOPOULOS of London (GB) for qualcomm incorporated, Alberto RICO ALVARINO of San Diego CA (US) for qualcomm incorporated, Luis Fernando Brisson LOPES of Swindon (GB) for qualcomm incorporated, Dario Serafino TONESI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W36/00, H04W36/36
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Hao ZHANG of Shanghai (CN) for qualcomm incorporated, Fojian ZHANG of Shenzhen (CN) for qualcomm incorporated, Yi LIU of Shenzhen (CN) for qualcomm incorporated, Xianghua CHEN of Shenzhen (CN) for qualcomm incorporated, Wei HE of Shanghai (CN) for qualcomm incorporated, Yan WANG of Shanghai (CN) for qualcomm incorporated, Jian LI of Shanghai (CN) for qualcomm incorporated, Jing ZHOU of Shanghai (CN) for qualcomm incorporated
IPC Code(s): H04W36/00, H04W36/14
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Naeem AKL of Somerville NJ (US) for qualcomm incorporated, Navid ABEDINI of Basking Ridge NJ (US) for qualcomm incorporated, Karl Georg HAMPEL of Jersey City NJ (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W36/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Peng CHENG of Beijing (CN) for qualcomm incorporated, Gavin Bernard HORN of La Jolla CA (US) for qualcomm incorporated, Karthika PALADUGU of Hyderabad (IN) for qualcomm incorporated, Hong CHENG of Basking Ridge NJ (US) for qualcomm incorporated, Qing LI of Princeton Junction NJ (US) for qualcomm incorporated, Ozcan OZTURK of San Diego CA (US) for qualcomm incorporated, Soo Bum LEE of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W36/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mohamed Atef Abdelazim Shehata of Lannion (FR) for qualcomm incorporated, Jelena Damnjanovic of Del Mar CA (US) for qualcomm incorporated, Tao Luo of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W36/04, H04W36/00, H04W36/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Xiaojie WANG of Hillsborough NJ (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated, Piyush GUPTA of Bridgewater NJ (US) for qualcomm incorporated
IPC Code(s): H04W52/02, H04L5/00, H02J50/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Vasanthan RAGHAVAN of West Windsor Township NJ (US) for qualcomm incorporated, Jung Ho RYU of Fort Lee NJ (US) for qualcomm incorporated
IPC Code(s): H04W52/08, H04W72/12
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mahmoud Taherzadeh Boroujeni of San Diego CA (US) for qualcomm incorporated, Tao Luo of San Diego CA (US) for qualcomm incorporated, Peter Gaal of San Diego CA (US) for qualcomm incorporated, Jelena Damnjanovic of Del Mar CA (US) for qualcomm incorporated, Wooseok Nam of San Diego CA (US) for qualcomm incorporated, Juan Montojo of San Diego CA (US) for qualcomm incorporated, Junyi Li of Fairless Hills PA (US) for qualcomm incorporated, Yan Zhou of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W52/26, H04W52/36, H04L25/03
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Shanyu Zhou of San Diego CA (US) for qualcomm incorporated, Jelena Damnjanovic of Del Mar CA (US) for qualcomm incorporated, Tao Luo of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W56/00, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Stephen William EDGE of Escondido CA (US) for qualcomm incorporated, Sven FISCHER of Nuremberg (DE) for qualcomm incorporated, Rayman PON of Cupertino CA (US) for qualcomm incorporated
IPC Code(s): H04W64/00, H04W24/10, H04B7/08, G01S5/10, H04W4/029, H04B7/0413, H04B7/0452, H04B7/0417, G01S5/02, G01S1/04, H04L5/00, H04L1/02, H04L1/04, H04W16/28
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Navid ABEDINI of Basking Ridge NJ (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W68/02, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Ozcan Ozturk of San Diego CA (US) for qualcomm incorporated, Xiaoxia Zhang of San Diego CA (US) for qualcomm incorporated, Huilin Xu of Temecula CA (US) for qualcomm incorporated
IPC Code(s): H04W68/02, H04W52/02, H04W16/14, H04W74/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Abdelrahman Mohamed Ahmed Mohamed Ibrahim of San Diego CA (US) for qualcomm incorporated, Muhammad Sayed Khairy Abdelghaffar of San Jose CA (US) for qualcomm incorporated, Qian Zhang of Basking Ridge NJ (US) for qualcomm incorporated, Yan Zhou of San Diego CA (US) for qualcomm incorporated, Krishna Kiran Mukkavilli of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Chao WEI of Beijing (CN) for qualcomm incorporated, Chenxi HAO of Beijing (CN) for qualcomm incorporated, Gokul SRIDHARAN of Sunnyvale CA (US) for qualcomm incorporated, Sony AKKARAKARAN of Poway CA (US) for qualcomm incorporated
IPC Code(s): H04W72/044, H04W72/563, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mickael MONDET of Louannec (FR) for qualcomm incorporated, Prashanth Haridas HANDE of San Diego CA (US) for qualcomm incorporated, Peerapol TINNAKORNSRISUPHAP of San Diego CA (US) for qualcomm incorporated, Hyun Yong LEE of San Diego CA (US) for qualcomm incorporated, Ravi AGARWAL of San Diego CA (US) for qualcomm incorporated, Leena ZACHARIAS of San Jose CA (US) for qualcomm incorporated, Chih-Ping LI of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/12, H04W72/14, H04W4/20
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Huilin XU of Temecula CA (US) for qualcomm incorporated, Nicolas CORNILLET of Lannion (FR) for qualcomm incorporated, Jay Kumar SUNDARARAJAN of San Diego CA (US) for qualcomm incorporated, Yuchul KIM of San Diego CA (US) for qualcomm incorporated, Wilfred, Ilamthy DORE of Gennevilliers (FR) for qualcomm incorporated, Linhai HE of San Diego CA (US) for qualcomm incorporated, Yeliz TOKGOZ of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/12, H04W72/14, H04L1/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Yitao CHEN of San Diego CA (US) for qualcomm incorporated, Mostafa KHOSHNEVISAN of San Diego CA (US) for qualcomm incorporated, Xiaoxia ZHANG of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/12, H04L1/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Fang YUAN of Beijing (CN) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/1268, H04W72/232, H04W76/20, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Qiaoyu Li of Beijing (CN) for qualcomm incorporated, Yu Zhang of San Diego CA (US) for qualcomm incorporated, Hao Xu of Beijing (CN) for qualcomm incorporated
IPC Code(s): H04W72/1268, H04W72/231, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jing LEI of San Diego CA (US) for qualcomm incorporated, Wei YANG of San Diego CA (US) for qualcomm incorporated, Chao WEI of Beijing (CN) for qualcomm incorporated, Peter GAAL of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/1268, H04W72/53, H04W72/232, H04L5/14
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Tao LUO of San Diego CA (US) for qualcomm incorporated, Wanshi CHEN of San Diego CA (US) for qualcomm incorporated, Durga Prasad MALLADI of San Diego CA (US) for qualcomm incorporated, Yongbin WEI of La Jolla CA (US) for qualcomm incorporated, Naga BHUSHAN of San Diego CA (US) for qualcomm incorporated, Aleksandar DAMNJANOVIC of Del Mar CA (US) for qualcomm incorporated, Srinivas YERRAMALLI of San Diego CA (US) for qualcomm incorporated, Tingfang JI of San Diego CA (US) for qualcomm incorporated, Hao XU of Beijing (CN) for qualcomm incorporated, Peter GAAL of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/21, H04L5/00, H04L27/00, H04B7/0452, H04W74/08
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Sherif ELAZZOUNI of San Diego CA (US) for qualcomm incorporated, Ozcan OZTURK of San Diego CA (US) for qualcomm incorporated, Piyush GUPTA of Bridgewater NJ (US) for qualcomm incorporated, Jing SUN of San Diego CA (US) for qualcomm incorporated, Qing LI of Princeton Junction NJ (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04W72/14, H04L1/18
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Marwen ZORGUI of San Diego CA (US) for qualcomm incorporated, Ahmed Attia ABOTABL of San Diego CA (US) for qualcomm incorporated, Yi HUANG of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/14, H04W72/12
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Tianyang BAI of Somerville NJ (US) for qualcomm incorporated, Yan ZHOU of San Diego CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04W72/12, H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Ahmed Attia ABOTABL of San Diego CA (US) for qualcomm incorporated, Muhammad Sayed Khairy ABDELGHAFFAR of San Jose CA (US) for qualcomm incorporated, Abdelrahman Mohamed Ahmed Mohamed IBRAHIM of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/23, H04W72/1268, H04W72/1273
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mostafa KHOSHNEVISAN of San Diego CA (US) for qualcomm incorporated, Yitao CHEN of San Diego CA (US) for qualcomm incorporated, Xiaoxia ZHANG of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/23, H04L5/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Mahbod GHELICHI of San Diego CA (US) for qualcomm incorporated, James Francis GEEKIE of Carisbad CA (US) for qualcomm incorporated, Arnaud MEYLAN of San Diego CA (US) for qualcomm incorporated, Sivaram Srivenkata PALAKODETY of San Diego CA (US) for qualcomm incorporated, Bao Vinh NGUYEN of San Diego CA (US) for qualcomm incorporated, Michel CHAUVIN of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/23, H04W28/02, H04W74/08, H04W24/08, H04L1/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Kangqi LIU of San Diego CA (US) for qualcomm incorporated, Ruiming ZHENG of Beijing (CN) for qualcomm incorporated, Changlong XU of Beijing (CN) for qualcomm incorporated, Liangming WU of Beijing (CN) for qualcomm incorporated, Jian LI of Shanghai (CN) for qualcomm incorporated, Kexin XIAO of Shanghai (CN) for qualcomm incorporated, Hao XU of Beijing (CN) for qualcomm incorporated, Wei LIU of Beijing (CN) for qualcomm incorporated
IPC Code(s): H04W72/25, H04L1/00
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Kapil GULATI of Belle Mead NJ (US) for qualcomm incorporated, Hui GUO of Beijing (CN) for qualcomm incorporated, Sourjya DUTTA of San Diego CA (US) for qualcomm incorporated, Shuanshuan WU of San Diego CA (US) for qualcomm incorporated, Anantharaman BALASUBRAMANIAN of San Diego CA (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04W72/541, H04L5/14, H04W72/25
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Vasanthan RAGHAVAN of West Windsor Township NJ (US) for qualcomm incorporated, Mohammad Ali TASSOUDJI of San Diego CA (US) for qualcomm incorporated, Junyi LI of Fairless Hills PA (US) for qualcomm incorporated
IPC Code(s): H04W72/08, H04B17/345, H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Linhai HE of San Diego CA (US) for qualcomm incorporated, Yuchul KIM of San Diego CA (US) for qualcomm incorporated, Huilin XU of Temecula CA (US) for qualcomm incorporated
IPC Code(s): H04W72/12
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Jung Ho Ryu of Fort Lee NJ (US) for qualcomm incorporated, Sony Akkarakaran of Poway CA (US) for qualcomm incorporated, Tao Luo of San Diego CA (US) for qualcomm incorporated, Junyi Li of Fairless Hills PA (US) for qualcomm incorporated, Hua Wang of Basking Ridge NJ (US) for qualcomm incorporated, Gabi Sarkis of San Diego CA (US) for qualcomm incorporated, Tien Viet Nguyen of Bridgewater NJ (US) for qualcomm incorporated, Juan Montojo of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/10, H04W74/08, H04W72/04
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Diana MAAMARI of San Diego CA (US) for qualcomm incorporated, Ahmed ELSHAFIE of San Diego CA (US) for qualcomm incorporated, Mickael MONDET of Louannec (FR) for qualcomm incorporated, Wei YANG of San Diego CA (US) for qualcomm incorporated, Prashanth Haridas HANDE of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W72/12, H04L1/18
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Sony AKKARAKARAN of Poway CA (US) for qualcomm incorporated, Tao LUO of San Diego CA (US) for qualcomm incorporated, Ajay GUPTA of San Diego CA (US) for qualcomm incorporated, Sumeeth NAGARAJA of Los Altos CA (US) for qualcomm incorporated, Vinod MENON of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W74/08, H04W72/21
QUALCOMM Incorporated patent applications on January 18th, 2024
Organization: qualcomm incorporated
Inventor(s): Peng WU of Shanghai (CN) for qualcomm incorporated, Shailesh MAHESHWARI of San Diego CA (US) for qualcomm incorporated, Yong HOU of Beijing (CN) for qualcomm incorporated, Arun Prasanth BALASUBRAMANIAN of San Diego CA (US) for qualcomm incorporated
IPC Code(s): H04W76/15, H04L1/1607, H04W28/06
QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated
- G01C21/30
- G08G1/0962
- B60W50/14
- Qualcomm incorporated
- G01S1/18
- G08G5/00
- B64C39/02
- G01S5/02
- H04W64/00
- G01S5/10
- G01S5/06
- G01S7/00
- G01S13/87
- G01S7/40
- G01S5/00
- H04L5/00
- G01S13/524
- G01S7/288
- G01S13/931
- G01S13/58
- G01S13/42
- G06F11/07
- G06F16/687
- H04R3/00
- G06F16/68
- G06T7/11
- G06T7/168
- G06T19/00
- G06Q20/32
- H04W76/10
- H01F17/00
- H01F27/28
- H01L23/552
- H01L21/48
- H01L21/56
- H01L23/14
- H01L23/367
- H01L23/498
- H01L23/66
- H01L23/00
- H01L25/065
- H01L25/07
- H01L25/00
- H01Q23/00
- H01Q1/52
- H01Q1/48
- H05K1/18
- H03F3/24
- H03F1/22
- H03F1/02
- H04B1/04
- H04L25/03
- H04B1/401
- H04B7/08
- H04B7/06
- H04B7/024
- H04B7/0452
- H04W72/044
- H04B7/0417
- H04W84/12
- H04W72/29
- H04L25/02
- H04W72/0446
- H04W72/23
- H04W72/08
- H04W72/04
- H04B7/185
- H04W56/00
- H04L1/00
- H03M13/11
- H04L1/1829
- H04W72/232
- H04W76/28
- H04W8/24
- H04L1/08
- H04W72/1263
- H04W72/1268
- H04L5/14
- H04W24/10
- H04B17/318
- H04L41/0677
- H04W24/08
- H04L43/16
- H04W8/22
- H04N13/351
- G06T15/00
- G06T5/00
- G06T7/10
- G06T7/593
- G06V40/16
- H04M1/02
- H04N19/137
- H04N19/80
- H04N19/176
- H04N19/70
- H04N19/59
- G06N3/063
- G06N3/088
- G06N3/045
- H04N21/43
- H04N21/4363
- H04W12/08
- H04W12/12
- H04L9/40
- H04W24/02
- H04W16/18
- H04W16/28
- H04W52/36
- H04W28/02
- H04B1/713
- H04W28/06
- H04W36/00
- H04W36/36
- H04W36/14
- H04W36/04
- H04W36/08
- H04W52/02
- H02J50/00
- H04W52/08
- H04W72/12
- H04W52/26
- H04W4/029
- H04B7/0413
- G01S1/04
- H04L1/02
- H04L1/04
- H04W68/02
- H04W16/14
- H04W74/08
- H04W72/563
- H04W72/14
- H04W4/20
- H04W76/20
- H04W72/231
- H04W72/53
- H04W72/21
- H04L27/00
- H04L1/18
- H04W72/1273
- H04W72/25
- H04W72/541
- H04B17/345
- H04W72/10
- H04W76/15
- H04L1/1607
- H04L5/0048
