Photogrammetry patent applications on February 8th, 2024

Patent Applications for Photogrammetry on February 8th, 2024

Number of patent applications containing 'Photogrammetry' or its variations: 4

20240045062. AUGMENTED ILLUMINATION AND 3D DIMENSIONING (AI3D) FROM 3D RECONSTRUCTION WITHIN A SINGLE-POSE IMAGE simplified abstract (KIHOMAC, Inc.)

Organization: KIHOMAC, Inc.

Inventor(s): Brian Stearmer of Vienna VA (US) for KIHOMAC, Inc.

IPC Code(s): G01S17/42, G06V10/44, H04N23/695

20240046446. METHODS TO AUTOMATICALLY ADJUST ONE OR MORE PARAMETERS OF A CAMERA SYSTEM FOR OPTIMAL 3D RECONSTRUCTION OF FEATURES FORMED WITHIN/ON A SEMICONDUCTOR SUBSTRATE simplified abstract (Tokyo Electron Limited)

Organization: Tokyo Electron Limited

Inventor(s): Mirko Vukovic of Albany NY (US) for Tokyo Electron Limited, Ryan Lloyd of Chaska MN (US) for Tokyo Electron Limited

IPC Code(s): G06T7/00, G06T7/80

20240046565. SYSTEMS AND METHODS FOR EMERGENCY RESPONSE MAPPING AND VISUALIZATION IN THREE DIMENSIONS simplified abstract (FNV IP)

Organization: FNV IP

Inventor(s): Michael Brian Wernau of Leesburg VA (US) for FNV IP, Justin Scott Richwagen of Frederick MD (US) for FNV IP, Azhar Saleh Ibrahim of Brunswick MD (US) for FNV IP, Zachery Edward Kurtz of Fairfield PA (US) for FNV IP, Guy William Meiron of Boonsboro MD (US) for FNV IP, Keith Owens of Boonsboro MD (US) for FNV IP

IPC Code(s): G06T17/05, G06T15/00

20240046575. Video See-Through Augmented Reality simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Organization: SAMSUNG ELECTRONICS CO., LTD.

Inventor(s): Yingen Xiong of Mountain View CA (US) for SAMSUNG ELECTRONICS CO., LTD.

IPC Code(s): G06T19/00, H04N13/239, G06T7/80, G06T7/593, H04N13/111