Panasonic intellectual property management co., ltd. (20240250107). IMAGING DEVICE simplified abstract
Contents
IMAGING DEVICE
Organization Name
panasonic intellectual property management co., ltd.
Inventor(s)
TAKAYUKI Nishitani of Osaka (JP)
IMAGING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250107 titled 'IMAGING DEVICE
The abstract describes an imaging device with a semiconductor substrate, pixels arranged in a first direction, and a signal line above the substrate. Each pixel includes a photoelectric converter, a transistor with a gate connected to the signal line, and a capacitive element. In one pixel, part of the transistor overlaps the capacitive element, which does not cover the entire width of the signal line.
- Photoelectric converter converts light into signal charges
- Transistor with gate connected to signal line
- Capacitive element in each pixel
- Overlapping transistor and capacitive element in one pixel
- Capacitive element does not cover entire width of signal line
Potential Applications: - Digital cameras - Medical imaging devices - Surveillance systems
Problems Solved: - Improved image quality - Enhanced signal processing - Increased pixel sensitivity
Benefits: - Higher resolution images - Reduced noise in captured images - Enhanced low-light performance
Commercial Applications: Title: Advanced Imaging Technology for Enhanced Image Quality This technology can be used in digital cameras, medical imaging devices, and surveillance systems to improve image quality, signal processing, and sensitivity. The market implications include increased demand for high-quality imaging devices in various industries.
Questions about the technology: 1. How does the overlapping of the transistor and capacitive element improve image quality? 2. What are the specific advantages of having a capacitive element in each pixel?
Original Abstract Submitted
an imaging device includes: a semiconductor substrate; a plurality of pixels arrayed in a first direction on the semiconductor substrate; and a first signal line positioned above the semiconductor substrate. each of the plurality of pixels includes: a photoelectric converter that converts light into signal charges; a transistor that includes a gate electrically coupled to the first signal line; and a capacitive element. in a first pixel of the plurality of pixels, at least a part of the transistor overlaps the capacitive element in plan view, and the capacitive element does not overlap the entire width of the first signal line in plan view.
