OSCPS MOTION SENSING INC. (20240230901). LIDAR-GYROSCOPE CHIP ASSEMBLIES simplified abstract
Contents
LIDAR-GYROSCOPE CHIP ASSEMBLIES
Organization Name
Inventor(s)
Ramanand Tewari of Ottawa (CA)
LIDAR-GYROSCOPE CHIP ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240230901 titled 'LIDAR-GYROSCOPE CHIP ASSEMBLIES
The present disclosure introduces a lidar-gyroscope chip assembly, known as GIDAR, designed for autonomous vehicle navigation applications. This chip assembly integrates both inertial and lidar sensing capabilities onto a single chip, enhancing efficiency and reducing size and power consumption for small drones and robots.
- Silicon substrate forms the base of the chip assembly.
- Lidar chip assembly and gyroscope are integrated onto the substrate.
- Silicon nitride is used to create components for both lidar and gyroscope.
- Full integration onto one chip reduces sensitivity to environmental disturbances.
- Power, weight, and size reduction benefits for autonomous vehicle navigation applications.
Potential Applications: - Autonomous vehicles - Small drones - Small robots
Problems Solved: - Size and power consumption limitations for small vehicles - Efficiency and integration challenges in sensor technology
Benefits: - Enhanced efficiency and performance - Reduced size and power consumption - Improved resilience to environmental disturbances
Commercial Applications: Title: Integrated Lidar-Gyroscope Chip Assembly for Autonomous Vehicle Navigation This technology can be utilized in the development of autonomous vehicles, small drones, and robots for various industries such as transportation, agriculture, and surveillance.
Questions about Lidar-Gyroscope Chip Assembly: 1. How does the integration of lidar and gyroscope onto a single chip benefit autonomous vehicle navigation? 2. What are the potential challenges in implementing this technology in small drones and robots?
Original Abstract Submitted
the present disclosure provides a lidar-gyroscope chip assembly (also referred to as gidar) for autonomous vehicle navigation application. the chip assembly includes a silicon substrate, a lidar chip assembly disposed on the substrate, and a gyroscope disposed on the substrate in order to form one integrated sensing chip performing both inertial and lidar sensing. the single chip integration can be improved by using silicon nitride to form the lidar chip assembly components and the components of the gyroscope. incorporating chip-based inertial measurement unit (imu) and lidar system onto a single chip, leads to power, weight, and size reduction for autonomous vehicles navigation applications, especially for small drones and small robots where the vehicle is limited to size and power consumption. due to the full integration of all elements onto one chip, the devices as described herein will be less sensitive to environmental perturbations such as shocks and vibrations compared to conventional devices.
