Nvidia corporation (20240250054). BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE simplified abstract
Contents
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Malcolm Gutenburg of San Francisco CA (US)
David Haley of Beaverton OR (US)
Yunseok Kim of Pleasanton CA (US)
Amit Kulkarni of San Jose CA (US)
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250054 titled 'BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE
The abstract of the patent application describes an electronic device that includes a printed circuit board, an integrated circuit connected to the board on one side, a thermal solution on the other side, a thermal interface material between the integrated circuit and the thermal solution, and an electrically insulative barrier seal around the integrated circuit.
- The electronic device features a printed circuit board.
- An integrated circuit is connected to the printed circuit board on one side.
- A thermal solution is present on the other side of the printed circuit board.
- A thermal interface material is placed between the integrated circuit and the thermal solution.
- An electrically insulative barrier seal surrounds the integrated circuit.
Potential Applications: - This technology can be used in electronic devices such as smartphones, laptops, and tablets. - It can also be applied in industrial equipment that requires efficient thermal management.
Problems Solved: - Ensures effective heat dissipation from the integrated circuit. - Provides electrical insulation for the integrated circuit.
Benefits: - Improves the overall performance and longevity of electronic devices. - Enhances thermal management capabilities. - Reduces the risk of overheating and component failure.
Commercial Applications: Title: Enhanced Thermal Management Technology for Electronic Devices This technology can be utilized in the consumer electronics industry to improve the thermal performance of devices, leading to better user experience and increased product reliability. It can also find applications in the industrial sector for enhancing the efficiency of electronic equipment.
Questions about the technology: 1. How does the thermal interface material contribute to the overall performance of the electronic device? 2. What are the potential cost savings associated with implementing this thermal management technology in electronic devices?
Original Abstract Submitted
an electronic device comprises: a printed circuit board; an integrated circuit that is coupled to the printed circuit board on a first side and a thermal solution on a second side; a thermal interface material that is disposed between the integrated circuit and the thermal solution; and a first barrier seal that is disposed around a perimeter of the integrated circuit and is electrically insulative.
