Nvidia corporation (20240222213). EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract
EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
Organization Name
Inventor(s)
Ronilo Boja of Santa Clara CA (US)
Padam Jain of Santa Clara CA (US)
EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222213 titled 'EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
The abstract describes an integrated circuit package with a package substrate containing a monolithic core, a device module embedded in a through-cavity, and one or more silicon-based passive or active device components.
- Monolithic core with a through-cavity
- Device module embedded in the through-cavity
- Silicon-based passive or active device components
- First module side aligned with the first substrate side
- Second module side aligned with the second substrate side
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuit design
Problems Solved: - Enhanced integration of device components - Improved thermal management - Increased reliability of integrated circuits
Benefits: - Higher performance - Compact design - Enhanced functionality
Commercial Applications: Title: Advanced Integrated Circuit Packages for High-Performance Electronics This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics, catering to industries requiring compact, reliable, and high-functioning integrated circuits.
Questions about Integrated Circuit Package Technology: 1. How does the through-cavity design improve the performance of the integrated circuit package?
The through-cavity design allows for better thermal management and integration of device components, leading to enhanced performance and reliability.
2. What are the key advantages of using silicon-based passive or active device components in the device module?
Silicon-based components offer high performance, reliability, and compatibility with existing semiconductor manufacturing processes.
Original Abstract Submitted
an integrated circuit package including a package substrate including a monolithic core, the monolithic core having a first substrate side, a second substrate side opposite the first substrate side, a thickness in a range from 800 to 2000 microns and a through-cavity that passes through the first and second substrate sides. the package includes a device module, the device module having a first module side and a second module side opposite the first module side. the device module is embedded in the through-cavity, the first module side is aligned with the first substrate side, the second module side is aligned with the second substrate side, and the device module includes one or more silicon-based passive or silicon-based active device component. a method of manufacture of the integrated circuit package is also disclosed.
