Nippon telegraph and telephone corporation (20240121886). WIRING BOARD simplified abstract

WIRING BOARD

Organization Name

nippon telegraph and telephone corporation

Inventor(s)

Miwa Muto of Tokyo (JP)

Hideaki Matsuzaki of Tokyo (JP)

WIRING BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240121886 titled 'WIRING BOARD

Simplified Explanation

The abstract describes a wiring board with specific components arranged in a particular configuration.

• Dielectric substrate
• Ground layer on one surface of the dielectric substrate
• First conductor line and first ground plane on the other surface of the dielectric substrate
• Second conductor line below the first ground plane in the dielectric substrate

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1. 1. 1. Potential Applications

The technology described in this patent application could be applied in various electronic devices and systems that require efficient signal transmission and grounding.

1. 1. 1. Problems Solved

This technology helps in improving signal integrity, reducing electromagnetic interference, and enhancing overall performance of electronic circuits.

1. 1. 1. Benefits

- Enhanced signal transmission - Reduced electromagnetic interference - Improved overall performance of electronic circuits

1. 1. 1. Potential Commercial Applications
         1. Optimizing Signal Transmission and Grounding in Electronic Devices

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1. 1. 1. Possible Prior Art

There may be prior art related to wiring boards with similar configurations and components, but specific examples are not provided in this article.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this wiring board compare to traditional circuit board designs?

The article does not provide a direct comparison between this wiring board and traditional circuit board designs in terms of performance, cost, or manufacturing processes.

1. 1. 1. 1. What are the specific industries or applications that could benefit the most from this technology?

The article does not mention specific industries or applications where this technology could have the most significant impact or be most valuable.

Original Abstract Submitted

a wiring board includes a dielectric substrate, a ground layer disposed on one surface of the dielectric substrate, a first conductor line and a first ground plane that are disposed apart from each other on the other surface opposing the one surface of the dielectric substrate, and a second conductor line disposed immediately below the first ground plane in the dielectric substrate.