Murata manufacturing co., ltd. (20240297152). MODULE simplified abstract

MODULE

Organization Name

murata manufacturing co., ltd.

Inventor(s)

Yoshihito Otsubo of Nagaokakyo-shi (JP)

MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240297152 titled 'MODULE

The abstract of this patent application describes a module that includes two electronic components mounted on separate substrates, with the components facing each other and connected through wire bonding and face bonding.

• The module comprises a first electronic component with two surfaces, a second electronic component with two surfaces, a first substrate with two surfaces, and a second substrate with two surfaces.
• The second substrate overlaps the first substrate but is spaced from it, with the components facing each other.
• The second electronic component is partially inside an opening, mounted on the second substrate surface by face bonding, and wire-bonded to the fourth substrate surface.

Potential Applications: - This technology could be used in the manufacturing of electronic devices where compact and efficient component placement is crucial. - It may find applications in industries requiring precise electronic connections in limited spaces.

Problems Solved: - Enables efficient and compact placement of electronic components. - Facilitates secure and reliable connections between components.

Benefits: - Improved space utilization in electronic devices. - Enhanced reliability of electronic connections.

Commercial Applications: Title: Advanced Electronic Component Module for Compact Devices This technology could be utilized in the production of smartphones, tablets, wearables, and other compact electronic devices, enhancing their performance and reliability in a smaller form factor.

Questions about the technology: 1. How does the face bonding method used in this module differ from traditional mounting techniques? 2. What are the advantages of having the electronic components face each other in this module design?

Original Abstract Submitted

a module comprises: a first electronic component having a first component surface and a second component surface; a second electronic component having a third component surface and a fourth component surface; a first substrate having a first substrate surface and a second substrate surface; and a second substrate having a third substrate surface and a fourth substrate surface, the second substrate being disposed so as to overlap the first substrate while being spaced from the first substrate, the first electronic component and the second electronic component being disposed such that the second component surface and the third component surface face each other, at least a portion of the second electronic component being disposed inside an opening, the first electronic component being mounted on the second substrate surface by face bonding, the second electronic component being wire-bonded to the fourth substrate surface using a second connection terminal.