Murata manufacturing co., ltd. (20240295582). CAPACITIVE MEMS DEVICE simplified abstract

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CAPACITIVE MEMS DEVICE

Organization Name

murata manufacturing co., ltd.

Inventor(s)

Matti Liukku of Helsinki (FI)

CAPACITIVE MEMS DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240295582 titled 'CAPACITIVE MEMS DEVICE

The patent application describes a MEMS structure with a mechanical layer containing a static electrode and a movable electrode that form a capacitor varying in capacitance based on their overlap.

  • The MEMS structure includes a first silicon layer and a second silicon layer directly bonded to each other.
  • The movable electrode is in the first silicon layer, while the static electrode is in the second silicon layer.
  • The movable electrode is separated from the static electrode by a gap in the interface between the first and second silicon layers.

Potential Applications: - Micro-electromechanical systems (MEMS) - Sensing devices - Actuators - Microphones - Accelerometers

Problems Solved: - Providing a MEMS structure with improved performance and reliability - Enhancing the sensitivity and accuracy of sensing devices - Enabling precise control of actuators in small-scale applications

Benefits: - Increased efficiency in MEMS devices - Enhanced performance in sensing and actuation applications - Improved durability and longevity of the technology

Commercial Applications: Title: Advanced MEMS Structures for High-Performance Sensors and Actuators This technology can be utilized in various industries such as consumer electronics, automotive, healthcare, and aerospace for developing advanced sensors, actuators, and other micro-scale devices.

Prior Art: Readers can explore prior research on MEMS structures, capacitors, and silicon bonding techniques to gain a deeper understanding of the technology's background and evolution.

Frequently Updated Research: Stay updated on the latest advancements in MEMS technology, silicon-based devices, and microfabrication techniques to enhance the development and application of similar innovations.

Questions about MEMS Structures: 1. How do MEMS structures differ from traditional sensors and actuators? MEMS structures are miniaturized devices that integrate mechanical and electrical components on a microscopic scale, offering higher sensitivity and precision compared to traditional counterparts.

2. What are the key challenges in manufacturing MEMS structures with complex electrode configurations? Manufacturing MEMS structures with intricate electrode patterns requires advanced fabrication techniques and precise control over the bonding process to ensure optimal performance and reliability.


Original Abstract Submitted

a mems structure is provided that includes a mechanical layer that extends parallel to a reference device plane. the mechanical layer is patterned to include a static electrode and a movable electrode configured to move in relation to the static electrode parallel to the reference device plane. the static electrode and the movable electrode are connected to form a capacitor having capacitance that varies according to an overlap of the static electrode and the movable electrode. the mechanical layer includes a first silicon layer and a second silicon layer. parts of the first silicon layer and the second silicon layer are directly bonded to each other. the movable electrode is in the first silicon layer and the static electrode is in the second silicon layer. the movable electrode is separated from the static electrode by a first gap in the interface between the first and second silicon layers.