Murata manufacturing co., ltd. (20240266240). MODULE simplified abstract
Contents
MODULE
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Akio Katsube of Nagaokakyo-shi, Kyoto-fu (JP)
Hideki Shinkai of Nagaokakyo-shi, Kyoto-fu (JP)
MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266240 titled 'MODULE
The abstract of the patent application describes a module consisting of a substrate, a first component, and a sealing resin. The first component is mounted on the substrate and sealed with the resin from a lateral side, with a projecting portion extending from the resin on the opposite side of the substrate.
- The module includes a substrate with a first surface.
- A first component is mounted on the first surface.
- The first component is sealed with a sealing resin from a lateral side.
- The first component has a projecting portion that extends from the resin on the opposite side of the substrate.
Potential Applications: - Electronic devices - Automotive components - Aerospace technology
Problems Solved: - Protection of components from environmental factors - Secure mounting of components on substrates
Benefits: - Enhanced durability and longevity of components - Improved performance in harsh conditions
Commercial Applications: Title: "Advanced Module Technology for Enhanced Component Protection" This technology can be used in various industries such as electronics, automotive, and aerospace for improved component reliability and performance in challenging environments.
Questions about the technology: 1. How does the sealing resin protect the first component in the module? 2. What are the specific advantages of the projecting portion of the first component?
Original Abstract Submitted
a module includes a substrate, a first component, and a sealing resin. the substrate is provided with a first surface. the first component is mounted on the first surface. the first component is sealed with the sealing resin at least from a lateral side. the first component includes a projecting portion. the projecting portion projects from the sealing resin on a side opposite to a side of the substrate.
