Murata manufacturing co., ltd. (20240186066). CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
- 1 CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Glass-Free Ceramic Electronic Components Manufacturing
- 1.13 Original Abstract Submitted
CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Kota Zenzai of Nagaokakyo-shi (JP)
CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186066 titled 'CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a method for manufacturing a chip ceramic electronic component with an outer electrode that does not contain glass. A glass-free conductive paste is applied to a ceramic body, and after a heat treatment, a sintered metal body is formed.
- Glass-free conductive paste applied to ceramic body
- Heat treatment to sinter metal powder
- Formation of unified sintered metal body
Key Features and Innovation
- Method for manufacturing chip ceramic electronic components without glass in the outer electrode
- Use of glass-free conductive paste containing copper-containing metal powder and thermosetting resin
- Heat treatment process to sinter metal powder and form a unified sintered metal body
Potential Applications
- Electronic components manufacturing
- Semiconductor industry
- Automotive electronics
Problems Solved
- Eliminates the need for glass in outer electrodes of ceramic electronic components
- Provides a reliable and efficient method for manufacturing chip ceramic components
Benefits
- Improved reliability of electronic components
- Cost-effective manufacturing process
- Enhanced performance of ceramic electronic components
Commercial Applications
Glass-Free Ceramic Electronic Components Manufacturing
This technology can be utilized in the production of ceramic electronic components without the use of glass, catering to industries such as electronics, telecommunications, and automotive.
Prior Art
No prior art information available at the moment.
Frequently Updated Research
No frequently updated research available at the moment.
Questions about Glass-Free Ceramic Electronic Components Manufacturing
Question 1
How does the absence of glass in the outer electrode impact the performance of ceramic electronic components?
The absence of glass in the outer electrode can improve the reliability and longevity of ceramic electronic components by eliminating potential issues related to glass cracking or degradation over time.
Question 2
What are the key advantages of using a glass-free conductive paste in the manufacturing process?
The use of a glass-free conductive paste allows for a more streamlined and cost-effective manufacturing process, as it eliminates the need for glass materials and simplifies the sintering process.
Original Abstract Submitted
a method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. a glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400� c. higher than the curing temperature of the thermosetting resin. by the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.
