Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
Patent Applications by Murata Manufacturing Co., Ltd. on September 19th, 2024
Murata Manufacturing Co., Ltd.: 26 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01G4/30 (6), H01G4/012 (5), H01G4/232 (4), H01G4/12 (4), H03F3/24 (3) H01G4/30 (3), A61M16/024 (2), H01G4/012 (2), H03F3/195 (1), H04N23/52 (1)
With keywords such as: electrode, direction, power, portion, body, side, capacitor, supply, surface, and circuit in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Yu TAKEHARA of Kyoto (JP) for murata manufacturing co., ltd., Masayuki SHIRAI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): A61M16/00, A61M16/06, A61M16/08, A61M16/10
CPC Code(s): A61M16/024
Abstract: a cpap device includes a blower, a tube heater, a humidifier, and a controller that controls power supply to these components. the controller calculates each of first supply power to the blower, second supply power to the tube heater, and third supply power to the humidifier. the controller provides the first supply power to the blower and the second supply power to the tube heater. in contrast, the controller provides, to the humidifier, lower one of the third supply power and remainder power obtained by subtracting the first supply power and the second supply power from the predetermined upper limit. if the sum total of the first supply power to the third supply power exceeds the upper limit, the controller decreases the second supply power until the sum total decreases to or below the upper limit.
Inventor(s): Masayuki SHIRAI of Kyoto (JP) for murata manufacturing co., ltd., Takanori HAYASHI of Kyoto (JP) for murata manufacturing co., ltd., Hiroki JINNOUCHI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): A61M16/00, G16H40/63
CPC Code(s): A61M16/024
Abstract: a cpap system includes a cpap device and a reception part. the cpap device is capable of executing a determination process, a first transmission process, and a second transmission process. the determination process is a process in which a determination about whether a respiratory therapy with the cpap device has been performed within a predetermined fixed period is made. the first transmission process is a process in which execution completion information is transmitted to the reception part in response to a determination in the determination process. the second transmission process is a process in which non-execution information is transmitted to the reception part in response to a determination in the determination process. the reception part is capable of executing a surmise process in which a non-therapy period in which the respiratory therapy has not been performed is surmised based on the execution completion information and the non-execution information.
Inventor(s): Shinichiro BANBA of Kyoto (JP) for murata manufacturing co., ltd., Akihiro MURANAKA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F41/04, H01F5/06, H01F27/32
CPC Code(s): H01F41/041
Abstract: a coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. a method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. in the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.
Inventor(s): Tomohiro SASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/248, H01G4/30, H01G4/40
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes a multilayer body including first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second inner electrode layers on laminated dielectric layers and extending to the first and second end surfaces, first and second outer electrodes respectively on the first and second end surfaces, a third outer electrode on the first side surface, and a fourth outer electrode on the second side surface. the first inner electrode layers each have a first opposing portion facing the second inner electrode layers, a first extended portion extending from the first opposing portion to the first end surface, and a second extended portion extending from the first opposing portion to the second end surface. the second inner electrode layers each include first and second extension portions that are partially or entirely bent toward the second main surface.
20240312710. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshiyuki NOMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/008, H01G4/12, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. the external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. the conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. an abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.
20240312712. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Daiki FUKUNAGA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hideaki TANAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masahiro WAKASHIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Daisuke HAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Satoshi MAENO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryota ASO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koji MORIYAMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro TSURU of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/12, H01G4/008, H01G4/012, H01G4/224, H01G4/232, H01G4/30
CPC Code(s): H01G4/1227
Abstract: an electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. a side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. an outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.
20240312721. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Satoshi YOKOMIZO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shinobu CHIKUMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yohei MUKOBATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G2/06, H01G4/232, H01G4/248
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. when a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as x a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as x a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as x, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as x; x>x and x>x are satisfied.
20240312722. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yukihiro FUJITA of Nagaokakyo-Shi (JP) for murata manufacturing co., ltd., Ryutaro YAMATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/012, H01G4/12, H01G4/232
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a capacitor body including dielectric layers and first and second inner electrodes that are laminated, a first via conductor inside the capacitor body and electrically connected to the first inner electrodes, and a second via conductor inside the capacitor body and electrically connected to the second inner electrodes. in a lamination direction in which the dielectric layers, the first inner electrodes, and the second inner electrodes are laminated, a dimension of the multilayer ceramic capacitor is the same or substantially the same as the dimension of the capacitor body.
Inventor(s): Satoshi YOKOMIZO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shinobu CHIKUMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yohei MUKOBATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G2/06, H01G4/008, H01G4/012, H01G4/12, H01G4/232
CPC Code(s): H01G4/30
Abstract: a method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.
Inventor(s): Satoru JOGAN of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/33, H01G4/224, H01G4/32, H01G13/00, H01G13/04
CPC Code(s): H01G4/33
Abstract: a film capacitor including: a laminate of a dielectric film; a first electrode; a second electrode; a terminal electrode including a connector electrically connected to the first electrode or the second electrode, and an extension extending in a substrate mounting direction along the first electrode or the second electrode from the connector; and an exterior material covering the laminate, the first electrode, the second electrode, the connector, and at least a part of the extension. the film capacitor has a columnar shape having a side surface, the side surface has a curved part, and at least a part of the extension is arranged at a position shifted from a position closest to the substrate in the curved part in a space between a region facing the substrate of the curved part and the substrate when the film capacitor is mounted on the substrate.
Inventor(s): Hiroki YOSHIMORI of Kyoto (JP) for murata manufacturing co., ltd., Tsuyoshi TAKAKURA of Kyoto (JP) for murata manufacturing co., ltd., Daisuke KINO of Kyoto (JP) for murata manufacturing co., ltd., Hideo NAKAGOSHI of Kyoto (JP) for murata manufacturing co., ltd., Takamitsu NAKAMURA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/31, H01L21/56, H01L23/00, H01L23/498, H01L25/16
CPC Code(s): H01L23/3107
Abstract: an electronic component package includes an electronic component and a sealing resin sealing the electronic component. in the electronic component package, one of main surfaces of the sealing resin defines a mounting surface used for mounting the electronic component package on a different substrate, and in a view of the mounting surface of the sealing resin, a land electrically connected to an electrode of an electronic component and a conductor made of solder or an alloy phase between the solder and another metal and surrounding at least a portion of an outer circumference of the land are exposed on the mounting surface.
Inventor(s): Jagar Singh of Clifton Park NY (US) for murata manufacturing co., ltd., Simon Edward Willard of Irvine CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L29/49, H01L21/28, H01L21/84, H01L27/12, H01L29/66, H01L29/78
CPC Code(s): H01L29/4966
Abstract: fet designs, and in particular nmosfet designs based on soi fabrication technology, that exhibit low leakage in the presence of the edge transistor phenomenon. embodiments include fets in which the threshold voltage vof the edge fets is increased to a level that is at least equal to the threshold voltage vof the central conduction channel fet using a novel dual work function configuration of a high dielectric constant (high-�) replacement metal gate (rmg) structure. one embodiment encompasses a fet including an rmg structure overlying a doped silicon region, the rmg structure including: an interface insulator formed over the doped silicon region; a high-� material formed over the interface insulator; an n-type work function material overlaying and in contact with a central portion of the high-� material; and a p-type work function material overlaying and in contact with at least one edge portion of the high-� material.
Inventor(s): Kengo ONAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshiki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q21/06, H01Q9/04, H01Q21/08
CPC Code(s): H01Q21/065
Abstract: an antenna module includes a first substrate, a power supply circuit, and an external connection terminal. transmission lines that transmit a control signal, an intermediate frequency signal, and a local signal and filter circuits are provided between the power supply circuit and the external connection terminal.
Inventor(s): Yoshiki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuri YAMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q21/22, H01Q1/24, H01Q1/38
CPC Code(s): H01Q21/22
Abstract: an antenna module includes substrates with different normal directions from each other, a radiating element disposed on the substrate, a radiating element disposed on the substrate, a hybrid coupler, and an rfic. the hybrid coupler includes input terminals (in, in), and output terminals (out, out). the rfic is connected to the input terminals (in, in) and supplies a radio-frequency signal to the radiating elements. the radiating elements are capable of radiating a radio wave in a first frequency band. the radiating element is connected to the output terminal (out), and the radiating element is connected to the output terminal (out). a phase difference between radio-frequency signals to be supplied to the input terminals (in, in) is adjusted to fall within a range of greater than −90� and less than 90�.
Inventor(s): Antony Christopher Routledge of Oakley (GB) for murata manufacturing co., ltd.
IPC Code(s): H02M1/088, H02M1/00, H02M1/36, H02M3/158
CPC Code(s): H02M1/088
Abstract: methods and circuits that enable parallel operation of power converters such that phase shedding is possible without excessively long startup times. more specifically, embodiments utilize reduced gate-drive (rgd) low-dropout (ldo) circuits within individual power converters to enable parallel power converter systems that support phase shedding while eliminating a “ping pong” effect (synchronization problems). the rgd capability of each parallel power converter allows each power converter to come online asynchronously without affecting other parallel power converters. in particular, the rgd capability allows full power up of the power converters with substantially reduced delays for full charge balancing and soft-start. for example, embodiments of the invention typically have delays for rgd charge balancing measured in hundreds of microseconds, not tens of milliseconds as with charge balancing in conventional, non-rgd power converters.
Inventor(s): Sho OKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Muneharu KATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kouji YAMAGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H02M3/00, H05K1/14, H05K1/18
CPC Code(s): H02M3/003
Abstract: a power supply system is provided that includes a first board, a tracker module disposed at the first board, and a power inductor disposed at the first board. the tracker module includes a second board and at least one ic chip disposed at the second board. the at least one ic chip includes at least one switch included in a pre-regulator circuit, at least one switch included in a switched-capacitor circuit, and at least one switch included in a supply modulator. in a plan view in a thickness direction of the first board, the second board has a recess, and at least a portion of the power inductor is disposed in the recess.
Inventor(s): Sho OKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Muneharu KATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kouji YAMAGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0238
Abstract: a tracker module is provided that includes a board, an ic chip, and at least one capacitor included in a switched-capacitor circuit. the ic chip is disposed at the board. the switched-capacitor circuit is configured to generate a plurality of discrete voltages based on an input voltage. the ic chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. the supply modulator selectively outputs at least one of the plurality of discrete voltages to a power amplifier. the at least one capacitor is stacked on the ic chip.
Inventor(s): Tatsuya BANNO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Atsushi HIRONO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kazuto HIRAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/195, H01L23/66, H01L25/16, H03F3/24
CPC Code(s): H03F3/195
Abstract: a tracker module includes a module laminate, a first ic chip, and a second ic chip. the first ic chip is disposed on the module laminate. the second ic chip is configured to control a power amplifier. the first ic chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. the switched-capacitor circuit is configured to generate a plurality of discrete voltages based on an input voltage, and the supply modulator is configured to selectively output at least one of the plurality of discrete voltages to the power amplifier. the second ic chip is disposed on the module laminate and coupled to the first ic chip.
Inventor(s): Yuri HONDA of Kyoto (JP) for murata manufacturing co., ltd., Takayuki KAWANO of Kyoto (JP) for murata manufacturing co., ltd., Fumitoshi DERIHA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/24, H03F1/56, H03F3/45
CPC Code(s): H03F3/245
Abstract: a power amplifier circuit includes a first amplifier that amplifies a first signal that is one of balanced signals and outputs a first amplified signal from a first output terminal, a second amplifier that amplifies a second signal that is another of the balanced signals and outputs a second amplified signal from a second output terminal, a balun that generates a third signal from the first amplified signal and the second amplified signal, and a matching circuit that is provided between the first amplifier and the second amplifier, and the balun.
20240313724. AMPLIFICATION DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masao KONDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki TSUTSUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Satoshi GOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/45, H01P5/12
CPC Code(s): H03F3/45475
Abstract: a first differential amplifier circuit is in or on a substrate and includes a pair of differential input nodes to which differential signals are input and a pair of differential output nodes from which differential signals are output. ends of a secondary coil of a first transformer are connected to the pair of differential input nodes of the first differential amplifier circuit, and an intermediate point of the secondary coil is ac grounded. ends of a primary coil of a second transformer are connected to the pair of differential output nodes of the first differential amplifier circuit, and an intermediate point of the primary coil of the second transformer is ac grounded. a differential wire pair connects the ends of the secondary coil of the first transformer to the pair of differential input nodes of the first differential amplifier circuit.
20240313737. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Daisuke ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H9/145, H03H9/25
CPC Code(s): H03H9/02992
Abstract: an acoustic wave device includes a piezoelectric body layer having a crystal axis and an idt electrode on the piezoelectric body layer. when an acoustic wave propagation direction is a first direction and an orthogonal or substantially orthogonal direction is a second direction, the crystal axis of the piezoelectric body layer is inclined in the second direction with respect to a thickness direction. the idt electrode includes first and second busbars that oppose each other, and first and second electrode fingers and each including one end connected to any one of the first and second busbars. a region where the adjacent electrode fingers overlap each other in the first direction is a cross region which includes a central region positioned on a center side in the second direction, and first and second edge regions that oppose each other with the central region interposed therebetween in the second direction.
20240313741. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Sho NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/17, H03H9/02, H03H9/05, H03H9/10
CPC Code(s): H03H9/178
Abstract: an acoustic wave device includes first and second piezoelectric layers and an idt electrode. the second piezoelectric layer is located above the first piezoelectric layer in a first direction. the idt electrode includes first and second busbar electrodes and first and second electrode fingers. the first and second busbar electrodes oppose each other. the first electrode finger is provided to the first busbar electrode and extends toward the second busbar electrode. the second electrode finger is provided to the second busbar electrode and extends toward the first busbar electrode. the first and second electrode fingers are sandwiched between the first and second piezoelectric layers in the first direction. the first and second electrode fingers extend in a second direction which intersects with the first direction and are located to overlap each other as seen in a third direction perpendicular or substantially perpendicular to the second direction.
Inventor(s): Kouji YAMAGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Sho OKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Muneharu KATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H19/00, H03H1/00, H03H7/01
CPC Code(s): H03H19/004
Abstract: a tracker module is provided that includes a module laminate, an ic chip disposed at the module laminate, and a filter circuit including a plurality of inductors. the ic chip includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. the plurality of inductors include a first inductor and a second inductor that are disposed at the module laminate. the first inductor and the second inductor are adjacent to each other. a magnetic flux direction of the first inductor and a magnetic flux direction of the second inductor are perpendicular to each other.
Inventor(s): David KOVAC of ARLINGTON HEIGHTS IL (US) for murata manufacturing co., ltd., Joseph GOLAT of CRYSTAL LAKE IL (US) for murata manufacturing co., ltd.
IPC Code(s): H03K17/687, H01L23/66, H03K19/003
CPC Code(s): H03K17/6872
Abstract: methods and devices used to cancel non-linear capacitances in high power radio frequency (rf) switches manufactured in bulk complementary metal-oxide-semiconductor (cmos) processes are disclosed. the methods and devices are also applicable to stacked switches and rf switches fabricated in silicon-on-insulator (soi) technology.
Inventor(s): Takahide NAKADOI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hitoshi SAKAGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Noritaka KISHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuki ISHII of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Rei HIGASHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04N23/52, B06B1/06
CPC Code(s): H04N23/52
Abstract: a vibration device includes an internal vibration body to amplify a vibration, a piezoelectric element connected to one end of the internal vibration body, and a light transmission body connected to an another end of the internal vibration body. the vibration device further includes an external vibration body including a first connection portion connected to the light transmission body and a second connection portion extending outward of the light transmission body from the first connection portion to attenuate the vibration.
20240315138. ULTRASONIC TRANSDUCER_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yasuhiro TADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tomoaki MATSUSHITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H10N30/88, B06B1/06, H10N30/853, H10N30/87
CPC Code(s): H10N30/883
Abstract: an ultrasonic transducer includes a case, a piezoelectric element, and a filler. the case has a bottomed cylindrical shape including a bottom portion and a side wall portion. the piezoelectric element is attached to the bottom portion of the case. the filler fills at least a portion in the case adjacent to or in a vicinity of the bottom portion and covers the piezoelectric element. a cavity is provided in a portion of the side wall portion adjacent to or in a vicinity of the bottom portion. the filler includes a foamed silicone resin with a closed-cell foam structure. the cavity is sealed with the filler.
Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
- Murata Manufacturing Co., Ltd.
- A61M16/00
- A61M16/06
- A61M16/08
- A61M16/10
- CPC A61M16/024
- Murata manufacturing co., ltd.
- G16H40/63
- H01F41/04
- H01F5/06
- H01F27/32
- CPC H01F41/041
- H01G4/012
- H01G4/248
- H01G4/30
- H01G4/40
- CPC H01G4/012
- H01G4/008
- H01G4/12
- H01G4/224
- H01G4/232
- CPC H01G4/1227
- H01G2/06
- CPC H01G4/30
- H01G4/33
- H01G4/32
- H01G13/00
- H01G13/04
- CPC H01G4/33
- H01L23/31
- H01L21/56
- H01L23/00
- H01L23/498
- H01L25/16
- CPC H01L23/3107
- H01L29/49
- H01L21/28
- H01L21/84
- H01L27/12
- H01L29/66
- H01L29/78
- CPC H01L29/4966
- H01Q21/06
- H01Q9/04
- H01Q21/08
- CPC H01Q21/065
- H01Q21/22
- H01Q1/24
- H01Q1/38
- CPC H01Q21/22
- H02M1/088
- H02M1/00
- H02M1/36
- H02M3/158
- CPC H02M1/088
- H02M3/00
- H05K1/14
- H05K1/18
- CPC H02M3/003
- H03F1/02
- H03F3/24
- CPC H03F1/0238
- H03F3/195
- H01L23/66
- CPC H03F3/195
- H03F1/56
- H03F3/45
- CPC H03F3/245
- H01P5/12
- CPC H03F3/45475
- H03H9/02
- H03H9/145
- H03H9/25
- CPC H03H9/02992
- H03H9/17
- H03H9/05
- H03H9/10
- CPC H03H9/178
- H03H19/00
- H03H1/00
- H03H7/01
- CPC H03H19/004
- H03K17/687
- H03K19/003
- CPC H03K17/6872
- H04N23/52
- B06B1/06
- CPC H04N23/52
- H10N30/88
- H10N30/853
- H10N30/87
- CPC H10N30/883
