Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
Patent Applications by Murata Manufacturing Co., Ltd. on July 25th, 2024
Murata Manufacturing Co., Ltd.: 29 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03H9/02 (4), H01G4/012 (3), H01G4/30 (3), H01M4/38 (2), H01M4/46 (2) A61B7/04 (1), H01M4/366 (1), H03H9/105 (1), H03H9/02228 (1), H03H9/02157 (1)
With keywords such as: electrode, layer, surface, including, terminal, substrate, body, material, direction, and main in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Shohei MORIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirofumi WATANABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiyoshi KANAGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiyotaka ASAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): A61B7/04, A61B5/00, A61B5/0205, A61B5/259, A61B5/282, A61B7/00
CPC Code(s): A61B7/04
Abstract: a biological information acquisition device includes a main body including a facing surface facing a living body when mounted, a first biosensor provided in the main body such that at least a portion of the first biosensor protrudes from the facing surface of the main body and including a first contact surface contactable with the living body, and an adhesive tape attached to the facing surface of the main body and having a thickness less than a protrusion amount of the first biosensor from the facing surface.
Inventor(s): Ryosuke NIWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): B81B7/00, G01L9/00
CPC Code(s): B81B7/0029
Abstract: a pressure sensor structure includes a sensor body including a diaphragm plate defining and functioning as a sense electrode, a base electrode facing the diaphragm plate, and a sidewall layer maintaining a gap between the diaphragm plate and the base electrode, and a conductive base substrate supporting the sensor body. the sidewall layer includes a guard electrode layer and upper and lower guard electrode insulating layers electrically insulating the guard electrode layer. surfaces of an outer side portion of each of the diaphragm plate and the sidewall layer are covered with an electrical insulating film that includes a contact region at which a portion of the guard electrode layer communicates with outside air.
Inventor(s): Shunsuke OTOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroyuki MASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): C08J5/18, C09K19/38, C09K19/52, C09K19/54
CPC Code(s): C08J5/18
Abstract: a liquid crystal polymer film that includes: a liquid crystal polymer; and an inorganic filler, wherein a relative permittivity of the liquid crystal polymer film is 5 to 10, and an average value of distances between barycentric coordinates of particles of the inorganic filler in the liquid crystal polymer film is 0.5 �m to 2.0 �m.
Inventor(s): Vishnu Srinivasan of Austin TX (US) for murata manufacturing co., ltd., Ion Opris of San Jose CA (US) for murata manufacturing co., ltd., Keith Bargroff of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): G01L9/12, B81B7/00, G01L9/02, H03M3/00
CPC Code(s): G01L9/12
Abstract: methods and devices to mitigate time varying impairments in sensors are described. the application of such methods and devices to pressure sensors facing time varying parasitic capacitances due to water droplets is detailed. benefits of auto-zeroing technique as adopted in disclosed devices is also described.
Inventor(s): Rikiya SANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G03F7/004, C03C3/091, C03C8/02, C03C8/14, H01B1/22
CPC Code(s): G03F7/0048
Abstract: a photosensitive paste contains an inorganic powder containing an element that forms a polyvalent metal ion; an alkali-soluble polymer; a photosensitive monomer, and a photoinitiator. a dispersion of 1 wt % of the inorganic powder containing an element that forms a polyvalent metal ion in pure water has a conductivity of 170 ms/m or less at 10 minutes after dispersion.
Inventor(s): Kiyoyuki NAKAGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koichi IWAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G06K7/10, G06K19/077, G06Q10/087
CPC Code(s): G06K7/10366
Abstract: a method includes manufacturer-side steps and user-side steps, the manufacturer-side steps include preparing an electronic component accommodation reel including an rfid tag storing a unique id and storing electronic components, storing manufacturer-side information in association with the unique id in a manufacturer-side information storage area of a cloud, shipping the electronic components in the form of the electronic component accommodation reel. the user-side steps include receiving and loading the electronic component accommodation reel shipped from the manufacturer-side facility, reading the unique id stored in the rfid tag, and acquiring, based on the unique id read, manufacturer-side information stored in the manufacturer-side information storage area of the cloud.
20240249861. CERAMIC ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hirofumi OIE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01C1/04
CPC Code(s): H01C1/04
Abstract: to provide ceramic electronic component capable of suppressing breakage of identification mark and element body and intrusion of liquid into element body. ceramic electronic component includes element body including ceramic as main material, barrier layer formed on surface of element body and including ceramic as main material, and identification mark formed on surface of barrier layer. element body, barrier layer, and identification mark include glass material. proportion of glass material included in barrier layer is higher than proportion of glass material included in element body.
20240249873. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Ryota HASHIMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi SUKEGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F27/28, H01F17/00, H01F17/04
CPC Code(s): H01F27/2823
Abstract: a winding core includes, for example, four planes, that is, a top surface, a bottom surface, a first side surface, and a second side surface around its central axis. a first wire and a second wire are wound around the winding core in the same direction and have a twisted section. in the twisted section in a plurality of turns at the top surface, bottom surface, first side surface, and second side surface, both the first wire and the second wire are in close contact with each of the ridges between the top surface, bottom surface, first side surface, and second side surface.
Inventor(s): Lee FRANCIS of Milton Keynes (GB) for murata manufacturing co., ltd., William JARVIS of Milton Keynes (GB) for murata manufacturing co., ltd., Takayuki TANGE of Milton Keynes (GB) for murata manufacturing co., ltd., Shouhei HIROSE of Milton Keynes (GB) for murata manufacturing co., ltd.
IPC Code(s): H01F27/28, H01F17/06, H01F27/255
CPC Code(s): H01F27/2895
Abstract: a magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.
20240249881. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Junichi KAWASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shoji FUKUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes a multilayer body including dielectric layers and electrode layers laminated therein, and two external electrodes respectively provided on two end surfaces of the multilayer body. as seen in a plane including a width and a lamination direction in a middle portion in a length direction, among the internal electrode layers, end portions in the width direction of about 90% or more of internal electrode layers in a middle in the lamination direction are curved toward a second main surface.
Inventor(s): Naoki MIKATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tatsunori YASUDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/232, H01G4/012, H01G4/12, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer ceramic electronic component includes ceramic layers including ca and zr as main components, first and second external electrodes including a first base electrode layer and second base electrode layer, and a plated layer covering a portion of the first and second base electrode layers, the first and second base electrode layers include cu as a main component, a multilayer body includes at an edge portion in a lamination direction a first compound region extending to a first end surface and a second compound region extending to the second end surface, the first compound region is joined with the first base electrode layer, the second compound region is joined with the second base electrode layer, and the first compound region and second compound region are not joined to each other.
Inventor(s): Yasuhiro MISHIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G2/06, H01G4/008, H01G4/012, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a multilayer body including ceramic layers and internal electrode layers, and external electrodes at both end surfaces of the multilayer body and each including a base electrode layer, a conductive resin layer on the base electrode layer, and a plated layer. the conductive resin layer includes an end-surface-side conductive resin layer portion on both end surfaces, and an adjacent conductive resin layer portion extending from an end portion of the end-surface-side conductive resin layer portion to be located on both main surfaces and both lateral surfaces. a content ratio of a resin component included in the adjacent conductive resin layer portion is greater than a content ratio of a resin component included in the end-surface-side conductive resin layer portion, and the content ratio of the resin component in the end-surface-side conductive resin layer portion is at least about 10% and no more than about 60%.
Inventor(s): Motoji TSUDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiyoshi AIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiki MATSUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/498, H01L23/538, H01L23/552, H01L25/00, H01L25/10
CPC Code(s): H01L23/49838
Abstract: a radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. the second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. the second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. the first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. the second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. the second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.
Inventor(s): Tatsuya OHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L27/02, H01L27/06
CPC Code(s): H01L27/0255
Abstract: a transient voltage absorption element is provided that includes a semiconductor substrate, an epitaxial layer on a surface of the semiconductor substrate, p+ regions and n+ regions in the epitaxial layer, buried layers in the semiconductor substrate, and trenches. a plurality of diodes each including the epitaxial layer, the p+ region, and the n+ region are formed, the trenches extend to the buried layers from a surface side of the epitaxial layer to separate the diodes. the buried layers have an impurity concentration higher than the semiconductor substrate and are separated between the diodes adjacent to each other.
Inventor(s): Shingo YONEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takaaki MIYASAKO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tadasu HOSOKURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Eisuke TOKUMITSU of Nomi-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L29/51, H01L29/78
CPC Code(s): H01L29/516
Abstract: a ferroelectric film that includes: hafnium oxide having a fluorite structure; a metal oxide having one or more elements selected from la, ce and bi; and less than 5 mol % of carbon, wherein the ferroelectric film is a polycrystalline body having an average particle size of less than 10 nm.
Inventor(s): Junjie GUO of Shanghai (CN) for murata manufacturing co., ltd., Li WANG of Shanghai (CN) for murata manufacturing co., ltd., Yan Zhou of Shanghai (CN) for murata manufacturing co., ltd., Yuli LI of Shanghai (CN) for murata manufacturing co., ltd., Kazumasa TAKESHI of Shanghai (CN) for murata manufacturing co., ltd.
IPC Code(s): H01M4/36, H01M4/38, H01M4/46, H01M4/48, H01M10/0525
CPC Code(s): H01M4/366
Abstract: a composite silicon-based negative electrode material, a preparation method therefor, a negative electrode sheet comprising same, and a lithium-ion secondary battery are provided. the composite silicon-based negative electrode material comprises a silicon-based material core layer and a metal material shell layer, wherein the metal material shell layer coats the silicon-based material core layer, and the silicon-based material core layer comprises a permeation area formed by the permeation of the metal material shell layer into the silicon-based material core layer. by means of the composite silicon-based negative electrode material and the preparation method therefor of the present application, the conductivity of the negative electrode material is improved, the expansion rate of the core layer formed by the silicon-based material is limited, and the consumption of lithium ions caused by a reaction between an electrolyte and the surface of the silicon-based material is effectively reduced. therefore, the first-time coulombic efficiency and cycle performance of the lithium-ion secondary battery formed from the composite silicon-based negative electrode material of the present application are improved.
Inventor(s): Yuki YOSHIMURA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M4/62, H01M4/02, H01M10/0525
CPC Code(s): H01M4/622
Abstract: a secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. the negative electrode includes a polyrotaxane and an organic fiber compound.
Inventor(s): Ryohei TAKANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Makoto YOSHIOKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akisuke ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeo ISHIKURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562, H01M4/02, H01M4/38, H01M4/46, H01M50/431, H01M50/434
CPC Code(s): H01M10/0562
Abstract: a solid electrolyte that includes a lithium ion conductive material having a garnet-type structure, a lithium ion conductive material having a lisicon-type structure, and a compound containing li and b.
Inventor(s): Masaaki SUGIYAMA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/6551, H01M50/213, H01M50/224, H01M50/227
CPC Code(s): H01M10/6551
Abstract: provided is a battery pack with improved thermal conductivity to a battery holder. the battery pack includes a battery unit including one or a plurality of cells, an exterior case that accommodates the battery unit, and a battery holder made from resin. the battery holder has a cell accommodating portion that accommodates the cells, a metal plate is interposed between an inner surface of the cell accommodating portion and the cell, and the metal plate is attached to the cell so as to cover a part of a peripheral surface of the cell.
20240250372. BATTERY PACK AND WEARABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiromitsu SENNAMI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M50/284, H01M10/42, H01M50/202, H01M50/247, H04R1/10, H05K1/02
CPC Code(s): H01M50/284
Abstract: provided is a battery pack including: a battery including an electrode portion and having a cylindrical shape; and a circuit board disposed on a circumferential side surface of the battery, in which the circuit board includes a circuit component mounting portion and a wiring part, the circuit component mounting portion includes a reinforcing portion, and the wiring part includes a flexible printed substrate.
20240250428. RING-TYPE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takahiro NAGAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tatsuya HOSOTANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q7/06, H01Q1/24, H01Q1/38
CPC Code(s): H01Q7/06
Abstract: a ring-type device includes a wireless power receiver circuit, a radio communication circuit, and a ring-shaped structure. the wireless power receiver circuit includes a power receiver circuit, and a loop coil. the radio communication circuit operates with the loop coil serving as an antenna. the power receiver circuit and the radio communication circuit include an electronic component, and a flexible circuit board to which the electronic component is mounted. the ring-shaped structure has a lateral ring face, a top ring face, and a bottom ring face. the loop coil is disposed along the top ring face. the flexible circuit board is planar in structure in its developed condition, and is disposed in a curved configuration along the lateral ring face of the ring-shaped structure.
Inventor(s): Tatsuya OHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H02H9/00, H02H9/04
CPC Code(s): H02H9/005
Abstract: a transient voltage absorption element is provided that is connected to a signal line in series and to a shunt between the signal line and a reference potential. the transient voltage absorption element includes a base material, a first input and output terminal in the base material and connected to the signal line, a second input and output terminal in the base material and connected to the signal line, a reference potential connection terminal in the base material and connected to the reference potential, an internal signal line that is electrically connected between the first and second input and output terminals, and a surge absorption element connected between the internal signal line and the reference potential connection terminal. magnitude of an impedance of a parasitic capacitance component, in a frequency band of a signal propagating through the internal signal line is smaller than a resistance component of the signal line.
20240250643. DOHERTY AMPLIFIER_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Shohei IMAI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/21
CPC Code(s): H03F1/0288
Abstract: a doherty amplifier includes: a carrier amplifier that is formed on a semiconductor substrate and that includes amplifiers in one or more stages including a first amplifier in one stage to which a first bias current is inputted; a peak amplifier that is formed on the semiconductor substrate and that includes amplifiers in two or more stages including a second amplifier to which a second bias current smaller than the first bias current is inputted; and a first resistor that is inserted in series into a power supply path to the second amplifier.
Inventor(s): Kazuyuki MURAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takuya SATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Keisuke OGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H1/00, H03H7/01
CPC Code(s): H03H1/00
Abstract: a filter device includes a stacked body, an input terminal, an output terminal, a ground terminal, a ground electrode, first and second resonators, and a coupling electrode. the input, output and ground terminals are located on a lower surface of the stacked body. the first and second resonators are in a signal transmission path between the input and output terminals. the coupling electrode capacitively couples the first and second resonators. the first and second resonators respectively include first and second capacitor electrodes defining capacitors with the ground electrode. the coupling electrode is connected to the first capacitor electrode and defines a capacitor with the second capacitor electrode. the coupling electrode includes first and second electrodes. first ends of the first and second electrodes are connected to each other. second ends of the first and second electrodes are connected to the first capacitor electrode.
20240250656. FILTER AND FILTER MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Motoki OZASA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H7/38, H01F27/29, H03H7/01, H03H7/03, H03H9/64
CPC Code(s): H03H7/38
Abstract: a filter module includes an antenna connection terminal, filter elements, and inductors. the filter elements are connected to an antenna connection terminal. a first inductor is connected between the antenna connection terminal and the filter elements. a second inductor is connected between a transmission line, which connects the first inductor and the filter elements, and a ground reference potential. the filter elements are on an insulating multilayer substrate. the inductors include electrodes on the multilayer substrate. inductor electrodes of the first inductor and central cavities of the inductor electrodes are at positions different from other electrodes inside the multilayer substrate.
20240250657. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Sho NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02
CPC Code(s): H03H9/02157
Abstract: an acoustic wave device includes a support with a thickness in a first direction, a piezoelectric layer extending in the first direction, and a functional electrode on a main surface of the piezoelectric layer and including first electrode fingers extending in a second direction intersecting with the first direction, a first busbar electrode connected to the first electrode fingers, second electrode fingers facing any of the first electrode fingers in a third direction perpendicular or substantially perpendicular the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode fingers. the piezoelectric layer includes a first piezoelectric body in contact with the functional electrode and a second piezoelectric body with a different dielectric polarization than that of the first piezoelectric body, and a thickness of the first piezoelectric body is less than or equal to a thickness of the second piezoelectric body.
20240250658. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takuro OKADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kentaro NAKAMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takuya YABU of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H9/205
CPC Code(s): H03H9/02228
Abstract: an acoustic wave device includes a piezoelectric substrate including a piezoelectric layer, and idt electrodes on the piezoelectric substrate and including curved idt electrodes. a direction in which a portion of the electrode finger with a curved shape in the curved idt electrode is convex is an outer side direction. acoustic wave resonators include first and second acoustic wave resonators including first and second curved idt electrodes, respectively. the first and second acoustic wave resonators are connected without another acoustic wave resonator interposed therebetween. when one of the directions in which electrode fingers are arranged is a first direction and a direction opposite to the first direction is a second direction, the outer side direction in the first idt electrode is the first direction, and the outer side direction of the second idt electrode is the second direction.
Inventor(s): Takashi YAMANE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hisashi YAMAZAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/10, H03H3/02, H03H9/02, H03H9/05, H03H9/13, H03H9/17
CPC Code(s): H03H9/105
Abstract: an acoustic wave device includes a first substrate, a piezoelectric layer including one main surface facing the first substrate and another main surface facing a direction opposite to the one main surface, a functional electrode on at least one of the one and the other main surfaces, and a second substrate including a first main surface facing the other main surface of the piezoelectric layer, a second main surface facing a direction opposite to the first main surface, and a through-hole penetrating from the first main surface to the second main surface. an angle at which a side surface of the through-hole is inclined from the second main surface toward the first main surface is equal to or more than about 0� and equal to or less than about 5� based on a normal line with respect to the second main surface.
20240250700. MULTIPLEXER_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Norihiko NAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H03H9/02, H03H9/25, H03H9/64
CPC Code(s): H04B1/0057
Abstract: a multiplexer includes a common terminal, first and second input/output terminals, a filter connected between the common terminal and the first input/output terminals and having a pass band including a first frequency band, a filter that is connected between the common terminal and the second input/output terminal and having a pass band including a second frequency band lower than the first frequency band, and an additional circuit including a first end connected to the common terminal and a second end connected to portion of a path connecting the common terminal and the first input/output terminal, the portion excluding the common terminal. the additional circuit includes a resonator including idt electrodes on a piezoelectric substrate, and the idt electrode with a widest electrode finger pitch is connected to the common terminal.
Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Murata Manufacturing Co., Ltd.
- A61B7/04
- A61B5/00
- A61B5/0205
- A61B5/259
- A61B5/282
- A61B7/00
- CPC A61B7/04
- Murata manufacturing co., ltd.
- B81B7/00
- G01L9/00
- CPC B81B7/0029
- C08J5/18
- C09K19/38
- C09K19/52
- C09K19/54
- CPC C08J5/18
- G01L9/12
- G01L9/02
- H03M3/00
- CPC G01L9/12
- G03F7/004
- C03C3/091
- C03C8/02
- C03C8/14
- H01B1/22
- CPC G03F7/0048
- G06K7/10
- G06K19/077
- G06Q10/087
- CPC G06K7/10366
- H01C1/04
- CPC H01C1/04
- H01F27/28
- H01F17/00
- H01F17/04
- CPC H01F27/2823
- H01F17/06
- H01F27/255
- CPC H01F27/2895
- H01G4/012
- H01G4/30
- CPC H01G4/012
- H01G4/232
- H01G4/12
- CPC H01G4/2325
- H01G2/06
- H01G4/008
- CPC H01G4/30
- H01L23/498
- H01L23/538
- H01L23/552
- H01L25/00
- H01L25/10
- CPC H01L23/49838
- H01L27/02
- H01L27/06
- CPC H01L27/0255
- H01L29/51
- H01L29/78
- CPC H01L29/516
- H01M4/36
- H01M4/38
- H01M4/46
- H01M4/48
- H01M10/0525
- CPC H01M4/366
- H01M4/62
- H01M4/02
- CPC H01M4/622
- H01M10/0562
- H01M50/431
- H01M50/434
- CPC H01M10/0562
- H01M10/6551
- H01M50/213
- H01M50/224
- H01M50/227
- CPC H01M10/6551
- H01M50/284
- H01M10/42
- H01M50/202
- H01M50/247
- H04R1/10
- H05K1/02
- CPC H01M50/284
- H01Q7/06
- H01Q1/24
- H01Q1/38
- CPC H01Q7/06
- H02H9/00
- H02H9/04
- CPC H02H9/005
- H03F1/02
- H03F3/21
- CPC H03F1/0288
- H03H1/00
- H03H7/01
- CPC H03H1/00
- H03H7/38
- H01F27/29
- H03H7/03
- H03H9/64
- CPC H03H7/38
- H03H9/02
- CPC H03H9/02157
- H03H9/205
- CPC H03H9/02228
- H03H9/10
- H03H3/02
- H03H9/05
- H03H9/13
- H03H9/17
- CPC H03H9/105
- H04B1/00
- H03H9/25
- CPC H04B1/0057
