Murata Manufacturing Co., Ltd. patent applications on February 6th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on February 6th, 2025
Murata Manufacturing Co., Ltd.: 18 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03F1/02 (2), H03F3/24 (2), H01F27/28 (2), H01F27/24 (2), H03H9/02 (2) A61K33/00 (1), H03F3/245 (1), H05K1/0271 (1), H05K1/0206 (1), H03H9/6483 (1)
With keywords such as: surface, layer, electrode, region, direction, main, substrate, terminal, circuit, and piezoelectric in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Yuki KIMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yusuke KOBAYASHI of Yokohama-shi (JP) for murata manufacturing co., ltd., Hiromichi WAKUI of Yokohama-shi (JP) for murata manufacturing co., ltd., Kengo AZUSHIMA of Yokohama-shi (JP) for murata manufacturing co., ltd., Kouichi TAMURA of Yokohama-shi (JP) for murata manufacturing co., ltd., Hajime TAKASE of Yokohama-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): A61K33/00, A61K9/16, A61P9/12, A61P13/12
CPC Code(s): A61K33/00
Abstract: a pharmaceutical composition for adsorbing a disease-causing substance by oral administration, the pharmaceutical composition including two-dimensional particles having one or plural layers, the one or plural layers having a layer body represented by: mx, wherein m is at least one metal of group 3, 4, 5, 6, or 7, x is a carbon atom, a nitrogen atom, or a combination thereof, n is not less than 1 and not more than 4, m is more than n but not more than 5, and a modifier or terminal t exists on a surface of the layer body, wherein tis at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom.
20250044170. STRAIN SENSOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takayoshi OBATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tomoki OUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toru YABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koji TANAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G01L1/22
CPC Code(s): G01L1/22
Abstract: a device may include a substrate which is configured to be stretchable and contractible and includes a major surface. a device may include a first wire and a second wire which are disposed on or in the major surface. a device may include in a plan view from a normal direction of the major surface, the substrate includes a sensing region which is configured to be stretchable and contractible in a first direction, and a first region and a second region that face each other in the first direction across the sensing region, the first wire and the second wire extend over the first region, the sensing region, and the second region; and the first wire and the second wire are electrically isolated from each other and are arranged in the sensing region at a distance from each other in a second direction that is orthogonal to the first direction.
Inventor(s): Lee FRANCIS of Milton Keynes (GB) for murata manufacturing co., ltd., William JARVIS of Milton Keynes (GB) for murata manufacturing co., ltd., Takayuki TANGE of Milton Keynes (GB) for murata manufacturing co., ltd.
IPC Code(s): H01F27/28, H01F27/02, H01F27/24, H01F41/02, H01F41/04, H01F41/064, H01F41/12, H02P27/08
CPC Code(s): H01F27/2823
Abstract: a magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.
20250046513. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Akio IGARASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shogo NISHIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F27/32, H01F27/24, H01F27/28, H01F27/30
CPC Code(s): H01F27/325
Abstract: in a winding portion of a first wire and a winding portion of a second wire wound around a winding core portion in a state of being adjacent to each other, insulating coatings include large-diameter portions and small-diameter portions having an outer diameter smaller than an outer diameter of the large-diameter portions. the large-diameter portions and the small-diameter portions are distributed over a plurality of parts in a direction in which the wires extend. spaces are formed between the first winding portion and the second winding portion due to a difference in size in a radial direction between the large-diameter portions and the small-diameter portions and contribute to a reduction of electrostatic capacity.
20250046517. CERAMIC STRUCTURE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takehito TAGUCHI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G2/24, H01F17/00, H01G4/12, H01G4/30, H03H1/00, H03H1/02
CPC Code(s): H01G2/24
Abstract: a ceramic structure including a crack-resistant identification mark. a ceramic structure includes a first ceramic layer including a first main surface and a second main surface opposite to the first main surface; and an identification mark made of ceramics on the first main surface of the first ceramic layer, wherein in a cross section of the identification mark in a direction perpendicular to the first main surface, the identification mark includes multiple continuous sections and a discontinuous section between the continuous sections.
Inventor(s): Yoshiki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kengo ONAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q1/48, H01Q5/307
CPC Code(s): H01Q1/48
Abstract: an antenna module includes a dielectric substrate including a plurality of dielectric layers that are laminated, and a radiation element, a ground electrode, and peripheral electrodes that are formed in or on the dielectric substrate. the radiation element radiates radio waves in a first polarization direction. the ground electrode is placed so as to face the radiation element. the peripheral electrodes are formed in a plurality of layers between the radiation element and the ground electrode and are electrically connected to the ground electrode. the peripheral electrodes are placed at positions that are symmetrical with respect to at least either of a first direction parallel to the first polarization direction and a second direction orthogonal to the first polarization direction.
Inventor(s): Kota KINUGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hideki UEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takaya NEMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q3/36, H01Q9/04, H01Q21/24
CPC Code(s): H01Q3/36
Abstract: an antenna module includes radiating elements including a first element and a second element and an rfic and exchanges signals with a bbic. the rfic includes a transmission circuit that supplies radio frequency signals to the radiating elements and a reception circuit that receives radio frequency signals from the radiating elements. the rfic exchanges intermediate frequency signals with the bbic. a first intermediate frequency signal is used for communication between the transmission circuit and the bbic. a second intermediate frequency signal is used for communication between the reception circuit and the bbic. assuming a variation in the reception level of a radio frequency signal received by the reception circuit during transmission of a radio frequency signal from the transmission circuit exceeds a predetermined value, the rfic stops emission of radio waves from the first element.
Inventor(s): Kouta FURUHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H02J7/04, H02J7/00
CPC Code(s): H02J7/04
Abstract: a battery unit includes a first coupling terminal, a second coupling terminal configured to be coupled to a storage battery, a power converter coupled between the first coupling terminal and the second coupling terminal, and a controller configured to control the power converter and to measure a terminal voltage of the first coupling terminal and a current flowing from the power converter to the second coupling terminal. in a state that the current is flowing from the power converter to the second coupling terminal, the controller compares the terminal voltage and a first threshold value, and assuming the terminal voltage crosses the first threshold value, the controller controls the power converter to decrease the current flowing from the power converter to the second coupling terminal until the terminal voltage crosses the first threshold value again.
20250047244. POWER AMPLIFICATION DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tetsurou ASHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kensuke TAKIMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0288
Abstract: a power amplification device that includes a substrate having a surface; an integrated circuit including a carrier amplifier and a peak amplifier and disposed on the surface; a carrier balun connected to the carrier amplifier; a peak balun connected to the peak amplifier; and a surface mount device disposed on the surface. each of the carrier amplifier and the peak amplifier is a pair of differential amplifiers. the substrate includes multiple insulating layers arranged in a stacking direction. an electrode to which the surface mount device is soldered is provided on the surface. in a view from the stacking direction, the carrier balun, the electrode, and the peak balun, which are arranged in a second planar direction, are disposed on one side of the integrated circuit in a first planar direction.
20250047248. POWER AMPLIFIER CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshiaki SUKEMORI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/213
CPC Code(s): H03F3/213
Abstract: a power amplifier circuit includes a first transistor; a second transistor; and a third transistor on the semiconductor substrate; a first metal part that is electrically connected to an emitter of the first transistor and is disposed, in plan view of the semiconductor substrate, to overlap a first layout region in which the first transistor is disposed; and a second metal part that is electrically connected to the emitter of the third transistor. the third transistor is disposed to overlap the first metal part in the plan view.
Inventor(s): Kenji TAHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryo WAKABAYASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kae YAMAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiki MATSUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/24, H03F1/02, H04B1/04
CPC Code(s): H03F3/245
Abstract: a radio frequency circuit that includes a carrier amplifier, a transmission line transformer having a main line and a sub line, a signal output terminal, a voltage supply terminal and a capacitor, wherein the main line has one end connected to an output end of a peak amplifier, the main line has another end connected to the signal output terminal, the sub line has one end connected to the one end of the main line, the sub line has another end connected to the voltage supply terminal, and the peak amplifier has the output end connected to the voltage supply terminal with the capacitor interposed therebetween.
Inventor(s): Masakazu MIMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H3/02
CPC Code(s): H03H9/02015
Abstract: an acoustic wave device includes a support including an energy confinement layer, a piezoelectric layer on one principal surface of the support and covering the energy confinement layer, a functional electrode on one principal surface of the piezoelectric layer and at least partially overlapping the energy confinement layer, and a dielectric film on a principal surface of the piezoelectric layer on an opposite side from the energy confinement layer. the piezoelectric layer includes a functional electrode portion including the functional electrode, and a portion other than the functional electrode portion. the dielectric film is provided in at least the functional electrode portion. a thickness of a portion of the dielectric film in the functional electrode portion is larger than a thickness of the dielectric film in the portion other than the functional electrode portion.
Inventor(s): Sean MCHUGH of Santa Barbara CA (US) for murata manufacturing co., ltd., Bryant GARCIA of Mississauga (CA) for murata manufacturing co., ltd., Ventsislav YANTCHEV of Sofia (BG) for murata manufacturing co., ltd., Greg DYER of Santa Barbara CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03H9/17, H03H9/13, H03H9/54
CPC Code(s): H03H9/17
Abstract: an acoustic resonator device is provided that includes a substrate; a piezoelectric plate having front and back surfaces, the back surface attached to the substrate; a decoupling dielectric layer on the front surface of the piezoelectric plate; and an interdigital transducer (idt) on the decoupling dielectric layer such that interleaved fingers of the idt are over a portion of the piezoelectric plate that is over a cavity. moreover, a thickness of the interleaved fingers is greater than or equal to 0.6 times a thickness of the piezoelectric plate and less than or equal to 1.7 times the thickness of the piezoelectric plate.
20250047260. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masashi OMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/205, H03H9/02, H03H9/56
CPC Code(s): H03H9/205
Abstract: an acoustic wave device includes a piezoelectric substrate including a piezoelectric layer including first and second main surfaces opposing each other, a first acoustic wave resonator including a first excitation electrode on the first main surface of the piezoelectric layer and a second excitation electrode on the second main surface, a second acoustic wave resonator sharing the piezoelectric substrate with the first acoustic wave resonator, and including a third excitation electrode provided on the first main surface of the piezoelectric layer and a fourth excitation electrode provided on the second main surface, and a wiring electrode on the first main surface of the piezoelectric layer. the first excitation electrode and the second excitation electrode oppose each other with the piezoelectric layer therebetween. a region of the piezoelectric layer between the first and second excitation electrodes is a first excitation region.
Inventor(s): Syunsuke KIDO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/64
CPC Code(s): H03H9/6483
Abstract: a filter includes a series arm resonator and parallel arm circuits, in which the parallel arm circuit has a parallel arm resonator and a frequency variable circuit connected in series to each other, the frequency variable circuit has a capacitor and a switch connected parallel to each other, the other parallel arm circuit has a capacitor and a switch connected in series to each other.
Inventor(s): Nobuo IKEMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Eiichi TAKATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kazuhiro YAMAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hideki UEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K1/02, H05K1/11
CPC Code(s): H05K1/0206
Abstract: in a multilayer board, conductor layers include a first conductor layer including a mounting electrode on a positive main surface of an insulator layer located farthest in a z-axis positive direction of insulator layers. one or more first interlayer connection conductors connect two of the conductor layers located on a positive main surface and a negative main surface of a first insulator layer. the one or more first interlayer connection conductors each include a first region and a second region with a lower thermal conductivity than the first region and located on a z-axis negative direction side of the first region. the one or more first interlayer connection conductors include one or more large-area first interlayer connection conductors with a larger area than a second interlayer connection conductor when viewed in a z-axis direction.
Inventor(s): Nobuo IKEMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Eiichi TAKATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kazuhiro YAMAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hideki UEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K1/02, H05K1/03, H05K1/11, H05K1/18, H05K3/00, H05K3/42
CPC Code(s): H05K1/0271
Abstract: in a circuit module, a mounting electrode is located on a positive main surface of a resin layer positioned farther toward a positive side of a z axis than other resin layers. an inner conductive layer overlaps the mounting electrode. an end of a first interlayer connection conductor on the positive side contacts the mounting electrode. an end of the first interlayer connection conductor on a negative side of the z axis contacts the inner conductive layer. a product includes a connector bonded to the mounting electrode. the first interlayer connection conductor includes first and second regions provided in a direction toward the negative side in this order. a material of the first region is the same as that of the mounting electrode. a young's modulus of the second region is lower than that of the first region.
Inventor(s): Kouassi Sebastien KOUASSI of San Diego CA (US) for murata manufacturing co., ltd., Sinan GOKTEPELI of San Diego CA (US) for murata manufacturing co., ltd., Simon Edward WILLARD of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L29/06, H01L21/762, H01L27/06
CPC Code(s): H01L29/0688
Abstract: methods and structures for mitigating back-gate effects in a radio frequency (rf) silicon-on-insulator (soi) substrate, rf-soi, are presented. according to one aspect, a first implant or junction is formed in a region of a trap-rich layer (trl) of the rf-soi that is located below a first circuit/device to protect. the first implant or junction is fully contained within the trl. a planar surface area of the first implant and/or junction fully contains a projection of a planar surface area of the first circuit and/or device. the first implant or junction is biased via a through box contact (tbc) that penetrates the box layer at a shallow trench isolation region formed in the rf-soi. according to another aspect, a second implant or junction is formed in a region of the trl below a second circuit/device. the first and second implants or junctions are disjoint and separated by an undoped region of the trl.
Murata Manufacturing Co., Ltd. patent applications on February 6th, 2025
- Murata Manufacturing Co., Ltd.
- A61K33/00
- A61K9/16
- A61P9/12
- A61P13/12
- CPC A61K33/00
- Murata manufacturing co., ltd.
- G01L1/22
- CPC G01L1/22
- H01F27/28
- H01F27/02
- H01F27/24
- H01F41/02
- H01F41/04
- H01F41/064
- H01F41/12
- H02P27/08
- CPC H01F27/2823
- H01F27/32
- H01F27/30
- CPC H01F27/325
- H01G2/24
- H01F17/00
- H01G4/12
- H01G4/30
- H03H1/00
- H03H1/02
- CPC H01G2/24
- H01Q1/48
- H01Q5/307
- CPC H01Q1/48
- H01Q3/36
- H01Q9/04
- H01Q21/24
- CPC H01Q3/36
- H02J7/04
- H02J7/00
- CPC H02J7/04
- H03F1/02
- H03F3/24
- CPC H03F1/0288
- H03F3/213
- CPC H03F3/213
- H04B1/04
- CPC H03F3/245
- H03H9/02
- H03H3/02
- CPC H03H9/02015
- H03H9/17
- H03H9/13
- H03H9/54
- CPC H03H9/17
- H03H9/205
- H03H9/56
- CPC H03H9/205
- H03H9/64
- CPC H03H9/6483
- H05K1/02
- H05K1/11
- CPC H05K1/0206
- H05K1/03
- H05K1/18
- H05K3/00
- H05K3/42
- CPC H05K1/0271
- H01L29/06
- H01L21/762
- H01L27/06
- CPC H01L29/0688
