Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on February 27th, 2025
Murata Manufacturing Co., Ltd.: 36 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03H9/02 (4), H01M10/0525 (4), H03F1/02 (3), H03H9/13 (3), H03F3/24 (3) H01M10/0562 (3), H03F1/0227 (2), C01B32/921 (1), H01Q3/36 (1), H05K1/185 (1)
With keywords such as: surface, electrode, layer, circuit, voltage, core, component, than, device, and electronic in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Hiroki SAKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): C01B32/921, C08K3/14
CPC Code(s): C01B32/921
Abstract: a conductive two-dimensional particle of a layered material, comprising: one or plural layers, wherein the one or plural layers include a layer body represented by: tix, wherein x is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal t exists on a surface of the layer body, wherein t is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, and an atomic ratio of al to ti is 0 atom % to 0.10 atom %.
20250067521. WICK AND HEAT TRANSPORT DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiroyuki MORITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akimaro YANAGIMACHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki KONO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeshi TORITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): F28D15/04
CPC Code(s): F28D15/046
Abstract: a wick used for heat transport, the wick including a material containing a nanofiber and/or a two-dimensional substance represented by: mqo, wherein m is at least one element selected from groups 3, 4, 5, 6, or 7, q is at least one element selected from groups 12, 13, 14, 15, or 16, and excluding o, a is more than 0 but not more than 2, and b is more than 0 but not more than 2.
20250067612. PRESSURE SENSOR DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Gou SAITOU of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G01L19/00, G01L9/00
CPC Code(s): G01L19/0046
Abstract: a pressure sensor device that includes: a base substrate; a detecting element mounted on an upper surface of the base substrate and that includes a detecting portion that detects pressure; a resin package on the upper surface of the base substrate and that has an exposure hole that exposes the detecting portion, the detecting element being embedded in the resin package; and an on-off valve disposed so as to close the exposure hole, the on-off valve including: a membrane having an outer surface facing an outside of the pressure sensor device, and a communication path that is partly formed by an inner surface of the membrane and allows the detecting portion to communicate with the outside of the pressure sensor device, the inner surface being opposite the outer surface, and wherein the inner surface closes the communication path when the membrane is flexed by pressure acting upon the outer surface.
Inventor(s): Vivek SARAF of Austin TX (US) for murata manufacturing co., ltd., Vishnu SRINVASAN of Austin TX (US) for murata manufacturing co., ltd.
IPC Code(s): G01N33/00, G01K7/20, G01L19/00, G01N27/22, H01L23/34
CPC Code(s): G01N33/0031
Abstract: novel integrated circuit environmental and temperature sensors in combination with measurement circuitry fully integrated as part of an asic die, which may be co-packaged with a pressure sensor integrated circuit to create a compact yet sensitive environment monitoring product. embodiments may include one or more integrated local heating elements and control circuitry that are power supply independent, make efficient use of battery power, include an accurate in-built temperature detection capability, and provide digital close-loop control of the heating elements.
Inventor(s): Chukhung CHAN of Hong Kong (CN) for murata manufacturing co., ltd., Chuipong LIU of Hong Kong (CN) for murata manufacturing co., ltd., Kwokwai LO of Hong Kong (CN) for murata manufacturing co., ltd.
IPC Code(s): G01R31/42, G01R19/12, G01R19/165
CPC Code(s): G01R31/42
Abstract: a method of performing a failure detection on an ac input voltage includes comparing the ac input voltage with first and second reference voltages, determining that the ac input voltage is normal, if an absolute value of the ac input voltage is greater than the first reference voltage, determining that the ac input voltage has failed, if a duration of the absolute value of the ac input voltage being less than the second reference voltage is greater than a threshold duration, and determining that the ac input voltage has failed, if the absolute value of the ac input voltage is not less than the second reference voltage and not greater than the first reference voltage, and a duration of an absolute value of a change rate of the ac input voltage being less than a voltage change rate threshold is greater than a predetermined time delay.
20250069792. COMMON MODE CHOKE COIL_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Ken HAYASHII of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kaori TAKEZAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryota HASHIMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F17/04, H01F17/00, H01F27/28, H01F27/29
CPC Code(s): H01F17/04
Abstract: a winding core part includes a two-layer winding region, consisting of a first layer in which a first wire is wound around the winding core part and a second layer in which a second wire is wound around the first layer, and a non-contact winding region in which the first and second wires are wound without contacting each other. the non-contact winding region located is between the first flange part and the two-layer winding region, and the two-layer winding region includes switching parts that are for switching the axial direction positional relationship between turns of the first and second wires in the two-layer winding region and are parts in which the first and second wires cross each other. in the non-contact winding region, the first wire has a longer wire length than the second wire. the first wire has a longer coil length than the second wire through both regions.
Inventor(s): Yasuhiro ITANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryo NARAHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Seiji KARIMORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F41/082, H01F41/07
CPC Code(s): H01F41/082
Abstract: a coil component manufacturing apparatus for winding a twisted portion of wires at a desired position of a core. a coil component manufacturing apparatus including a nozzle through which a plurality of wires can be inserted, a wire twisting mechanism that holds a core, rotates the core relative to the nozzle in a direction of twisting the wires, and forms a twisted portion in which the wires are twisted between the nozzle and the core, a wire winding mechanism that holds the core, rotates the core relative to the nozzle in a direction of winding the twisted portion is wound around the core, and winds the twisted portion around the core, and a guide member positioned closer to the core than the nozzle. the guide member guides the twisted portion to a predetermined position of the core when the twisted portion is wound around the core.
Inventor(s): Naoki IWAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuto YAMAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Isao KIMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akio MASUNARI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G2/14, H01G4/002
CPC Code(s): H01G2/14
Abstract: a capacitor that includes: a metal base material; a dielectric layer on the metal base material; a conductive layer on the dielectric layer; an oxide layer between the metal base material and the dielectric layer; and an oxygen barrier layer between the oxide layer and the dielectric layer, wherein the oxide layer includes: a first oxidized region containing a metal of the metal base material; and a second oxidized region containing an atom of the oxygen barrier layer and a metal of the metal base material, and a thickness of the first oxidized region is 3 nm or less and is 0% to 50% of a thickness of the second oxidized region.
Inventor(s): Mitsuhiro OKUBO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/12, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a three-terminal multilayer ceramic capacitor includes first to sixth extended electrode portions. the first and second extended electrode portions are connected to a first outer electrode at different portions of a first end surface. the third extended electrode portion is connected to the first outer electrode at a position spaced away from the first end surface on a second side surface. the fourth extended electrode portion is connected to a second outer electrode on a second end surface. the fifth extended electrode portion is connected to the second outer electrode at a position spaced away from the second end surface on the first side surface. the sixth extended electrode portion is connected to the second outer electrode at a position spaced away from the second end surface on the second side surface.
20250069811. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Kazuhisa UCHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/12, H01G4/012, H01G4/232, H01G4/30
CPC Code(s): H01G4/1227
Abstract: a multilayer ceramic capacitor includes a multilayer body including the dielectric ceramic layers and the internal electrode layers which are laminated, and external electrodes connected to the internal electrode layers. the multilayer body includes segregation including si as a main component in a vicinity of an end of the internal electrode layer in a width direction. an average particle size of the dielectric particles in the vicinity of the end of the internal electrode layer in the width direction in the dielectric ceramic layer is smaller than an average particle size of a dielectric particles in a central portion of the internal electrode layer in the width direction in the dielectric ceramic layer.
20250070037. RADIO FREQUENCY MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshihito OTSUBO of Kyoto (JP) for murata manufacturing co., ltd., Hiroki YOSHIMORI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/538, H01L23/552, H01L25/16
CPC Code(s): H01L23/5386
Abstract: in a radio frequency module, a magnetic core included in an inductor is disposed inside a through hole of a core board. an axis of winding of a coil is perpendicular to a thickness direction defined for the core board. a magnetic core has a first side surface and a second side surface intersecting with the axis of winding of the coil. a first shield portion includes a first feedthrough ground via conductor provided for the core board. a second shield portion includes a second feedthrough ground via conductor provided for the core board. the first feedthrough ground via conductor and the second feedthrough ground via conductor are arranged to interpose the magnetic core between the first feedthrough ground via conductor and the second feedthrough ground via conductor in a direction aligned with the axis of winding of the coil.
Inventor(s): Sami NURMI of Tuusula (FI) for murata manufacturing co., ltd., Teppo SYRJÄNEN of Helsinki (FI) for murata manufacturing co., ltd.
IPC Code(s): H01L23/544, H05K1/18
CPC Code(s): H01L23/544
Abstract: an electronic component is mounted on an external surface that defines a plane. the electronic component comprises at least one electronic chip housed within package. the electronic component includes one or more aligning structures, which aligning structure(s) are formed on an outer surface of the electronic component. the aligning structure(s) define at least two first aligning surface areas in a first direction and at least two second aligning surface areas in a second direction. the first aligning surface areas and the second aligning surface areas are formed and spaced from each other such that at least a rotation of the electronic component about an axis perpendicular to the plane defined by the surface is prevented, when the first aligning surface areas and the second aligning surface areas are provided against counter surfaces fixed on the surface and conforming at least partly to the form of the respective aligning surface areas.
Inventor(s): Laurence McGarry of Los Gatos CA (US) for murata manufacturing co., ltd., Michael Patrick Clark of Lunenburg MA (US) for murata manufacturing co., ltd., Takahiro Sugimura of Arlington MA (US) for murata manufacturing co., ltd., David Giuliano of Bedford NH (US) for murata manufacturing co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/367
CPC Code(s): H01L25/0657
Abstract: a power module includes a first board comprising a first surface and a second surface opposite to each other and perpendicular to a bottom surface of the power module for mounting the power module to a circuit board, the bottom surface providing electrical connections to the circuit board, a first charge pump assembly mounted on the first surface, the first charge pump assembly comprising a first power conversion circuit configured to convert an input voltage to an output voltage, and a first vertical heatsink structure arranged adjacent to the first charge pump assembly, the first charge pump assembly being placed between the first vertical heatsink structure and the first board.
Inventor(s): David Giuliano of Beford NH (US) for murata manufacturing co., ltd., Stephen John Allen of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/373, H01L23/48, H02M3/00, H02M3/07
CPC Code(s): H01L25/16
Abstract: disclosed embodiments may include a power converter package including devices stacked vertically. the devices include a first device and a second device. the first device includes a first switched capacitor circuit and provides first bottom bonding contacts on one surface and first top bonding contacts on another surface opposite the one surface, and one or more through-vias connecting corresponding one or more of the first bottom bonding contacts and corresponding one or more of the first top bonding contacts. the second device includes a second switched capacitor circuit and provides second bottom bonding contacts on one surface to be electrically connected to the first top bonding contacts of the first device. input terminals of the first and switched capacitor circuits are electrically connected to each other, and output terminals of the first and switched capacitor circuits are electrically connected to each other.
Inventor(s): Yuji KINTAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/056, H01M10/0525
CPC Code(s): H01M10/056
Abstract: an electrolyte including: a porous insulator having a pore; and a medium having two nitrile groups and a metal salt that are disposed in the pore, wherein the metal salt is at least one of an alkali metal salt and an alkaline earth metal salt, and a molar ratio of the medium to the metal salt (medium/metal salt) is 0.1 to 4.0.
Inventor(s): Yusuke TAKARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryohei TAKANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562, C04B35/488, H01M10/0525, H01M10/0585
CPC Code(s): H01M10/0562
Abstract: a solid electrolyte ceramic having a chemical composition represented by: abdowherein a represents one or more of li, ga, al, mg, zn, and sc, and a includes at least li; b represents one or more of la, ca, sr, ba, and lanthanoid elements, and b includes at least la; and d represents one or more of transition elements capable of being six-coordinate with oxygen and elements belonging to groups 12 to 15; and one or more of co, ni, mn, and fe, the solid electrolyte ceramic having a garnet-type crystal structure where: 139≤y<150 in a range of 330<x≤370 wherein x (mol %) represents a content of the li and y (mol %) represents a content of the one or more elements represented by b when a content of the one or more elements represented by d in the general formula is 100 mol %.
Inventor(s): Yusuke TAKARA of Nagaokakyo-shi, Kyoto-fu (JP) for murata manufacturing co., ltd., Ryohei TAKANO of Nagaokakyo-shi, Kyoto-fu (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562, H01M10/0525
CPC Code(s): H01M10/0562
Abstract: a solid electrolyte ceramic having a chemical composition represented by a specific general formula, and further including one or more transition metal elements selected from co, ni, mn, and fe, and having a garnet-type crystal structure in which a content x of li and a content y of drepresenting one or more elements selected from ta, nb, and bi are each within specific ranges.
Inventor(s): Yuji KINTAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562
CPC Code(s): H01M10/0562
Abstract: an electrolyte including: a porous insulator having a pore; and a medium and a metal salt that are disposed in the pore, wherein the metal salt is at least one of an alkali metal salt and an alkaline earth metal salt, and a molar ratio of the medium to the metal salt (medium/metal salt) is 0.1 to 2.0.
Inventor(s): Yoshiaki SUZUKI of Kyoto (JP) for murata manufacturing co., ltd., Daisuke MORI of Kyoto (JP) for murata manufacturing co., ltd., Yuri NAKAYAMA of Kyoto (JP) for murata manufacturing co., ltd., Hideki KAWASAKI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0567, H01M10/054, H01M10/0569
CPC Code(s): H01M10/0567
Abstract: an electrolytic solution for a magnesium battery includes a solvent, an electrolyte salt, and an additive. the electrolyte salt includes a magnesium salt represented by formula (1). the additive includes at least one of a first magnesium compound represented by formula (2), a second magnesium compound represented by formula (3), or a polycyclic aromatic hydrocarbon.
Inventor(s): Yoshiaki SUZUKI of Kyoto (JP) for murata manufacturing co., ltd., Daisuke MORI of Kyoto (JP) for murata manufacturing co., ltd., Yuri NAKAYAMA of Kyoto (JP) for murata manufacturing co., ltd., Hideki KAWASAKI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0567, H01M10/054, H01M10/0569
CPC Code(s): H01M10/0567
Abstract:
mg[b(oc(r1))] (1)
Inventor(s): Yoshiaki SUZUKI of Kyoto (JP) for murata manufacturing co., ltd., Daisuke MORI of Kyoto (JP) for murata manufacturing co., ltd., Yuri NAKAYAMA of Kyoto (JP) for murata manufacturing co., ltd., Hideki KAWASAKI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0567, H01M10/054, H01M10/0569
CPC Code(s): H01M10/0567
Abstract:
mg[(n(si(r2))] (2)
Inventor(s): Yoshiaki SUZUKI of Kyoto (JP) for murata manufacturing co., ltd., Daisuke MORI of Kyoto (JP) for murata manufacturing co., ltd., Yuri NAKAYAMA of Kyoto (JP) for murata manufacturing co., ltd., Hideki KAWASAKI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0567, H01M10/054, H01M10/0569
CPC Code(s): H01M10/0567
Abstract:
mg(r3) (3)
20250070268. SECONDARY BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Daiki NISHIIE of Kyoto (JP) for murata manufacturing co., ltd., Moriaki OKUNO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0587, H01M10/0525, H01M50/109
CPC Code(s): H01M10/0587
Abstract: a secondary battery having higher reliability is provided. the secondary battery includes a battery device and an outer package member. the battery device includes a first electrode and a second electrode that are stacked with a separator interposed between the first electrode and the second electrode, and are wound around a winding axis extending in a first direction. the outer package member contains the battery device. the second electrode includes a second electrode current collector, an inner side second electrode active material layer, and an outer side second electrode active material layer. the second electrode current collector has an inward second electrode surface and an outward second electrode surface. the inward second electrode surface faces a side of the winding axis. the outward second electrode surface is on an opposite side to the inward second electrode surface. the inner side second electrode active material layer is provided on the inward second electrode surface. the outer side second electrode active material layer is provided on the outward second electrode surface. an area density of the outer side second electrode active material layer is higher than an area density of the inner side second electrode active material layer over a region from an inner winding side end part of the battery device to an outer winding side end part of the battery device. the inner side second electrode active material layer is opposed to the outer side second electrode active material layer with the second electrode current collector interposed between the inner side second electrode active material layer and the outer side second electrode active material layer.
Inventor(s): Hideyuki MORIMOTO of Nagaokakyo-shi, Kyoto (JP) for murata manufacturing co., ltd., Kengo ONAKA of Nagaokakyo-shi, Kyoto (JP) for murata manufacturing co., ltd., Masato IEMURA of Nagaokakyo-shi, Kyoto (JP) for murata manufacturing co., ltd., Izumi MORI of Nagaokakyo-shi, Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q3/36, H01Q9/04, H01Q21/24
CPC Code(s): H01Q3/36
Abstract: an antenna module includes antenna groups, hybrid couplers, dividers, and an rfic. the antenna group includes radiating elements. the antenna group includes radiating elements. each hybrid coupler has input terminals and output terminals. the rfic supplies a high frequency signal to each radiating element. each divider splits the high frequency signal from the rfic in two directions. the divider splits a first signal from the rfic to the input terminal of each hybrid coupler. the divider splits a second signal from the rfic to the input terminal of each hybrid coupler. the output terminals of the hybrid coupler are respectively connected to the radiating elements. the output terminals of the hybrid coupler are respectively connected to the radiating elements. in each hybrid coupler, a phase difference between the high frequency signals supplied to the input terminals is set to 90�.
Inventor(s): David Giuliano of Bedford NH (US) for murata manufacturing co., ltd.
IPC Code(s): H02M3/07, H03H19/00
CPC Code(s): H02M3/072
Abstract: disclosed embodiments may include an apparatus including a first device layer including first switches, a second device layer including second switches, and a third device layer disposed between the first device layer and the second device layer. the third device layer includes first capacitors. the first switches and the second switches are interconnected with the first capacitors to form a switched capacitor circuit. the switched capacitor circuit is configured to transition between at least two states in response to switching of the first switches and the second switches.
Inventor(s): John HOVERSTEN of Waltham MA (US) for murata manufacturing co., ltd., David Perreault of Waltham MA (US) for murata manufacturing co., ltd., Yevgeniy Tkachenko of Waltham MA (US) for murata manufacturing co., ltd., Takeshi Kogure of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuki Fukuda of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiki Matsui of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuma Noguchi of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiichiro Takenaka of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/213
CPC Code(s): H03F1/0205
Abstract: an amplifier circuit is provided for amplifying a radio frequency signal within one frame of a radio frequency signal by using multiple discrete voltages supplied from the tracker circuit. the amplifier circuit includes a power amplifier and an rc series circuit including a resistor and a capacitor that are connected in series between the ground and a voltage supply path between the tracker circuit and the power amplifier.
Inventor(s): John HOVERSTEN of Waltham MA (US) for murata manufacturing co., ltd., David PERREAULT of Waltham MA (US) for murata manufacturing co., ltd., Yevgeniy TKACHENKO of Waltham MA (US) for murata manufacturing co., ltd., Takeshi KOGURE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiki MATSUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuki FUKUDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H02M3/158, H03F3/00, H03F3/24
CPC Code(s): H03F1/0227
Abstract: a tracker circuit includes a pre-regulator circuit configured to convert an input voltage into a regulated voltage using a power inductor, a switched-capacitor circuit configured to generate a plurality of discrete voltages, based on the regulated voltage, and a power modulation circuit configured to select at least one voltage from the plurality of discrete voltages and output the at least one voltage to a first output terminal. further, the tracker circuit includes one or more bypass paths configured to bypass at least the switched-capacitor circuit and the power modulation circuit, and to provide a second supply voltage from the pre-regulator circuit to a second output terminal, the second supply voltage is output by the second output terminal.
Inventor(s): John HOVERSTEN of Waltham MA (US) for murata manufacturing co., ltd., David PERREAULT of Waltham MA (US) for murata manufacturing co., ltd., Yevgeniy TKACHENKO of Waltham MA (US) for murata manufacturing co., ltd., Takeshi KOGURE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuki FUKUDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiki MATSUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/00, H03F3/24
CPC Code(s): H03F1/0227
Abstract: in an exemplary aspect, a tracker circuit is provided that includes a first switch circuit configured to generate a plurality of discrete voltages, based on an input voltage, a second switch circuit configured to select at least a first voltage from the plurality of discrete voltages as a supply voltage, a filter circuit that is connected to the second switch circuit and is configured to filter the supply voltage and generate a filtered supply voltage that is provided to an amplifier via a voltage supply path between the filter circuit and the amplifier, and a third switch circuit including a capacitor and a switch that are connected in series between a ground and the voltage supply path.
20250070732. POWER AMPLIFYING CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masao KONDO of Kyoto (JP) for murata manufacturing co., ltd., Shinnosuke TAKAHASHI of Kyoto (JP) for murata manufacturing co., ltd., Shaojun MA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F3/24, H03F1/30
CPC Code(s): H03F3/245
Abstract: a power amplifying circuit includes an output transistor that amplifies a radio frequency signal and outputs an amplified signal, a bias circuit that supplies a bias current or voltage to the output transistor, and a bias control part connected to the bias circuit and includes a control circuit that increases the bias current or voltage when an ambient temperature is equal to or less than a predetermined value. in consecutive time periods of a first, a second, and a third time period, when output of the output transistor in the third time period is greater than output of the output transistor in the first and the second time period, the bias control part increases the bias current or voltage in the second time period as to become higher than the bias current or voltage of a case where the ambient temperature is higher than the predetermined threshold value.
20250070744. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Sho NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H10N30/853, H10N30/87, H10N30/88
CPC Code(s): H03H9/02031
Abstract: an acoustic wave device includes resonators including a support with a hollow portion, a piezoelectric layer, and a functional electrode. the piezoelectric layer is on one main surface of the support and includes first and second main surfaces. the functional electrode is on at least one main surface of the piezoelectric layer and partially matches the hollow portion as seen in a thickness direction of the piezoelectric layer. the resonators include first and second resonators. the functional electrode of the first resonator includes at least one pair of a first and second electrode on the same main surface of the piezoelectric layer. the functional electrode of the second resonator includes upper and lower surface electrodes on the first and second main surfaces of the piezoelectric layer.
Inventor(s): Toshiaki TAKATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/05, H03H9/02, H03H9/25, H03H9/64, H03H9/72
CPC Code(s): H03H9/0561
Abstract: a filter includes a series arm resonator, parallel arm resonators, a multilayer substrate including main surfaces, a piezoelectric substrate, and a bump electrode on the piezoelectric substrate. each of the parallel arm resonators include an idt electrode on the piezoelectric substrate. the bump electrode is connected to the idt electrode. the multilayer substrate includes a first planar electrode on a first of the main surfaces and bonded to the bump electrode, a second planar electrode on a second of the main surfaces and connected to a ground, and via conductors that connect the first and second planar electrodes. in a plan view of the first main surface, the bump electrode is between via conductors connected to the first planar electrode.
Inventor(s): Sho NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Junji YAMAUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/13, H03H9/02, H03H9/17, H03H9/56
CPC Code(s): H03H9/132
Abstract: an acoustic wave device includes a support including a space in a surface thereof, a piezoelectric layer on the surface of the support, and a functional electrode on at least one surface of the piezoelectric layer to at least partially overlap the space as viewed in a first direction. the functional electrode is an interdigital transducer electrode including first and second busbars, and first and second electrode fingers. at least one electrode finger of the first and second electrode fingers includes a portion with a width that linearly changes in a second direction. in the at least one electrode finger, when a ratio of a width at a proximal end to a minimum width between the proximal end and a distal end is 1+�:1−�, � is greater than or equal to about 0.01 and less than or equal to about 0.054.
Inventor(s): Viktor PLESSKI of Gorgier (CH) for murata manufacturing co., ltd., Soumya YANDRAPALLI of Amsterdam (NL) for murata manufacturing co., ltd., Robert B. HAMMOND of Rockville MD (US) for murata manufacturing co., ltd., Bryant GARCIA of Mississauga (CA) for murata manufacturing co., ltd., Patrick TURNER of Portola Valley CA (US) for murata manufacturing co., ltd., Jesson JOHN of Dublin CA (US) for murata manufacturing co., ltd., Ventsislav YANTCHEV of Sofia (BG) for murata manufacturing co., ltd.
IPC Code(s): H03H9/56, H03H3/02, H03H9/02, H03H9/13, H03H9/17, H10N30/87
CPC Code(s): H03H9/568
Abstract: a filter device is provided that includes a substrate; a piezoelectric layer coupled to the substrate either directly or via one or more intermediate layers; a first interdigital transducer (idt) of a first bulk acoustic resonator device on the piezoelectric layer and having interleaved fingers over a first cavity the first bulk acoustic resonator device; a second idt of a second bulk acoustic resonator device on the piezoelectric layer and having interleaved fingers over a second cavity of the second bulk acoustic resonator device; a first dielectric layer having a first thickness disposed between the interleaved fingers of the first idt; and a second dielectric layer having a second thickness disposed between the interleaved fingers of the second idt. the first thickness is greater than the second thickness.
Inventor(s): Luke Myers of Santa Barbara CA (US) for murata manufacturing co., ltd., Wei Yang of Goleta CA (US) for murata manufacturing co., ltd., Andrew Guyette of San Mateo CA (US) for murata manufacturing co., ltd., Greg Dyer of Santa Barbara CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03H9/60, H03H9/13, H03H9/205
CPC Code(s): H03H9/605
Abstract: a bandpass filter is provided that includes a ladder filter circuit with at least one shunt transversely-excited film bulk acoustic resonators (xbar) and at least one series xbar. each of the xbars includes a diaphragm having an ln-equivalent thickness greater than or equal to 360 nm, and each of the xbars includes a diaphragm having an ln-equivalent thickness less than or equal to 375 nm.
20250070761. N-PATH FILTER_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hajime KANDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H19/00, H03H7/01, H03H7/42
CPC Code(s): H03H19/002
Abstract: an n-path filter includes first signal paths connected in parallel with each other between signal terminals and second signal paths. each of the first signal paths includes first and second switches connected to the signal terminals, and a base filter connected between the first and second switches. each of the second signal paths includes a third switch connected to a signal terminal. the base filter includes a series arm element including a reactance component. the first and second switches modulate an input signal with a phase that completes one cycle across the signal paths, and the third switch modulates the input signal with a phase that completes one cycle across the signal paths. a phase of a drive signal to drive the second switch is opposite to a phase of a drive signal to drive the third switch.
20250070805. RADIO FREQUENCY MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshihito OTSUBO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/04, H04B1/16, H05K1/02, H05K1/16
CPC Code(s): H04B1/0458
Abstract: a radio frequency module includes a wiring board, a first electronic component and a second electronic component, and a third electronic component connected to a matching circuit. the wiring board includes a core board having not only a first principal surface and a second principal surface but also a through hole, a first buildup layer stacked on the first principal surface, and a second buildup layer stacked on the second principal surface. at least one of the first electronic component or the second electronic component is disposed partially inside the through hole. the third electronic component is disposed on the first buildup layer. the second electronic component is stacked on one side, where the third electronic component is located, of the first electronic component in a thickness direction defined for the core board. the second electronic component is a constituent component of the matching circuit.
20250070809. RADIO FREQUENCY MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshihito OTSUBO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/16, H01Q1/22, H04B1/036, H04B1/40
CPC Code(s): H04B1/1607
Abstract: provided is a radio frequency module which may not only reduce the height of the overall module but also ensure a sufficient degree of planarity as well. in a radio frequency module, a first electronic component is disposed on a wiring board. a second electronic component is built in the wiring board. a core board has a through hole. the first electronic component is arranged on a first buildup layer to overlap with the through hole of the core board when viewed in plan in a thickness direction defined for the core board. the second electronic component is disposed inside the through hole of the core board. thickness of the second electronic component is greater than thickness of the core board when measured in the thickness direction defined for the core board. the second electronic component is electrically connected to the first electronic component via the first buildup layer.
20250071906. SUBSTRATE AND MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Ryuichi KUBO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K1/18
CPC Code(s): H05K1/185
Abstract: a substrate includes a core substrate that has a first surface, a second surface facing away from the first surface, and a cavity portion therein, an electronic component and a metal post that are provided in the single cavity portion, and an encapsulating material that fills the cavity portion and has a third surface close to the first surface and a fourth surface close to the second surface, in which the metal post is exposed through a third surface and a fourth surface of the encapsulating material.
20250072062. Low Leakage FET_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Abhijeet Paul of Poway CA (US) for murata manufacturing co., ltd., Simon Edward Willard of Irvine CA (US) for murata manufacturing co., ltd., Alain Duvallet of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L29/06, H01L21/762, H01L29/10, H01L29/36, H01L29/423, H01L29/49, H01L29/66, H01L29/78
CPC Code(s): H01L29/0607
Abstract: fet designs that exhibit low leakage in the presence of the edge transistor phenomenon. embodiments includes nfet designs in which the work function �of the gate structure overlying the edge transistors of the nfet is increased by forming extra p+ implant regions within at least a portion of the gate structure, thereby increasing the vt of the edge transistors to a level that may exceed the vt of the central conduction channel of the nfet. in some embodiments, the gate structure of the nfet is modified to increase or “flare” the effective channel length of the edge transistors relative to the length of the central conduction channel of the fet. other methods of changing the work function �of the gate structure overlying the edge transistors are also disclosed. the methods may be adapted to fabricating pfets by reversing or substituting material types.
Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
- Murata Manufacturing Co., Ltd.
- C01B32/921
- C08K3/14
- CPC C01B32/921
- Murata manufacturing co., ltd.
- F28D15/04
- CPC F28D15/046
- G01L19/00
- G01L9/00
- CPC G01L19/0046
- G01N33/00
- G01K7/20
- G01N27/22
- H01L23/34
- CPC G01N33/0031
- G01R31/42
- G01R19/12
- G01R19/165
- CPC G01R31/42
- H01F17/04
- H01F17/00
- H01F27/28
- H01F27/29
- CPC H01F17/04
- H01F41/082
- H01F41/07
- CPC H01F41/082
- H01G2/14
- H01G4/002
- CPC H01G2/14
- H01G4/012
- H01G4/12
- H01G4/232
- H01G4/30
- CPC H01G4/012
- CPC H01G4/1227
- H01L23/538
- H01L23/552
- H01L25/16
- CPC H01L23/5386
- H01L23/544
- H05K1/18
- CPC H01L23/544
- H01L25/065
- H01L23/00
- H01L23/367
- CPC H01L25/0657
- H01L23/373
- H01L23/48
- H02M3/00
- H02M3/07
- CPC H01L25/16
- H01M10/056
- H01M10/0525
- CPC H01M10/056
- H01M10/0562
- C04B35/488
- H01M10/0585
- CPC H01M10/0562
- H01M10/0567
- H01M10/054
- H01M10/0569
- CPC H01M10/0567
- H01M10/0587
- H01M50/109
- CPC H01M10/0587
- H01Q3/36
- H01Q9/04
- H01Q21/24
- CPC H01Q3/36
- H03H19/00
- CPC H02M3/072
- H03F1/02
- H03F3/213
- CPC H03F1/0205
- H02M3/158
- H03F3/00
- H03F3/24
- CPC H03F1/0227
- H03F1/30
- CPC H03F3/245
- H03H9/02
- H10N30/853
- H10N30/87
- H10N30/88
- CPC H03H9/02031
- H03H9/05
- H03H9/25
- H03H9/64
- H03H9/72
- CPC H03H9/0561
- H03H9/13
- H03H9/17
- H03H9/56
- CPC H03H9/132
- H03H3/02
- CPC H03H9/568
- H03H9/60
- H03H9/205
- CPC H03H9/605
- H03H7/01
- H03H7/42
- CPC H03H19/002
- H04B1/04
- H04B1/16
- H05K1/02
- H05K1/16
- CPC H04B1/0458
- H01Q1/22
- H04B1/036
- H04B1/40
- CPC H04B1/1607
- CPC H05K1/185
- H01L29/06
- H01L21/762
- H01L29/10
- H01L29/36
- H01L29/423
- H01L29/49
- H01L29/66
- H01L29/78
- CPC H01L29/0607
