Murata Manufacturing Co., Ltd. patent applications on February 13th, 2025

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Patent Applications by Murata Manufacturing Co., Ltd. on February 13th, 2025

Murata Manufacturing Co., Ltd.: 23 patent applications

Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01G4/30 (5), H01G4/012 (4), H01F27/29 (4), H02J7/00 (3), H01G4/008 (3) H01F27/2823 (3), H02J7/007194 (2), H01G4/30 (2), F16H27/06 (1), H02J7/007182 (1)

With keywords such as: electrode, layer, surface, portion, end, circuit, body, including, wire, and substrate in patent application abstracts.



Patent Applications by Murata Manufacturing Co., Ltd.

20250052304. DRIVE MECHANISM IN PARTICULAR FOR MAYTAGGING OPERATION_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Jaakko RUOHIO of Helsinki (FI) for murata manufacturing co., ltd.

IPC Code(s): F16H27/06, G01C19/38

CPC Code(s): F16H27/06



Abstract: a device includes multiple circular drive wheels rotationally connected, with two featuring drive pins. a drive motor, attached to one of these wheels, continuously rotates it, thereby rotating all connected wheels. the device has a driven wheel with two opposing radial slots that enable intermittent rotation around its axis as drive pins engage alternately, changing rotation direction in consecutive phases. the device also includes a first gearing wheel linked to the driven wheel and a second gearing wheel coupled to the first. a payload is connected to this second gearing wheel, which, with the payload, rotates 160-200 degrees in one direction when a drive pin engages one radial slot.


20250054681. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hayato TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuki KANBE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shingo NAKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F27/28, H01F27/24, H01F27/29, H01F27/30

CPC Code(s): H01F27/2823



Abstract: a coil component includes a core including a winding core extending in an axial direction and a first flange portion and a second flange portion provided on respective both end portions, in the axial direction, of the winding core; electrodes including a first electrode and a second electrode provided on the first flange portion and the second flange portion, respectively; and a first wire wound around the winding core and including a first end portion joined to the first electrode and a second end portion joined to the second electrode. the first electrode has a first joint surface to which the first end portion is joined, at least one protrusion is provided on the first joint surface, and the first end portion is joined to the first joint surface with the first wire passing over the at least one protrusion provided on the first joint surface.


20250054682. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Hayato TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuki KANBE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shingo NAKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Seiji KARIMORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masayuki ISHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F27/28, H01F17/04, H01F27/29

CPC Code(s): H01F27/2823



Abstract: a coil component includes a drum core including a core portion, first and second flange portions; first, second, third and fourth outer electrodes; and first and second wires. when the first wire is traced from a first wire end to a second wire end, a turn including a last point that makes contact with an outer surface of the core portion is referred to as an n-th turn. when the second wire is traced from a first wire end to a second wire end, a turn including a last point that makes contact with the outer surface of the core portion is referred to as an m-th turn. the m-th turn of the second wire and the n-th turn of the first wire do not include an intersection portion at which the m-th turn of the second wire and the n-th turn of the first wire intersect.


20250054683. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yuki KANBE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hayato TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shingo NAKAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Seiji KARIMORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masayuki ISHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F27/28, H01F27/24, H01F27/29, H01F27/30

CPC Code(s): H01F27/2823



Abstract: a coil component includes a drum core including a core portion and first and second flange portions; first, second, third and fourth outer electrodes; and first and second wires. the second wire includes first and second winding portions. the first winding portion is a portion including plural turns wound around an outer periphery of the first wire. the second winding portion is on a second wire end side relative to the first winding portion and includes less than 1.0 turn continuously wound around the outer periphery of the first wire. the first winding portion includes a first traverse portion, which runs across the first wire without running in the same layer as the first wire in one turn immediately preceding an end portion of the first winding portion where the end portion is the closest to the second wire end in the first winding portion.


20250054686. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takeru OZAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01F27/29, H01F27/32

CPC Code(s): H01F27/292



Abstract: an inductor component includes an element body including an insulator; a coil inside the element body; and a first outer electrode electrically connected to the coil. the element body includes first and second end surfaces opposed to each other in a length direction, first and second main surfaces opposed to each other in a height direction perpendicular to the length direction, and first and second side surfaces opposed to each other in a width direction perpendicular to the length and height directions. the first end surface intersects the first main surface on a first ridge line. the second end surface intersects the first main surface on a second ridge line. the first outer electrode includes a first electrode layer embedded in the element body such that at least part of the first electrode layer is exposed from the element body.


20250054694. MULTILAYER CERAMIC ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Kazunori USUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi SAWADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G4/012, H01G4/232, H01G4/30

CPC Code(s): H01G4/012



Abstract: a multilayer ceramic electronic component includes a multilayer body including laminated ceramic layers and internal electrode layers. the internal electrode layers include a first internal electrode layer laminated alternately with the ceramic layers and exposed at a first and second end and a second internal electrode layer laminated alternately with the ceramic layers and exposed at a first and second side surface, the multilayer ceramic electronic component further includes a dummy electrode spaced apart from the first and second internal electrode layers and exposed at one of the first and second end surfaces and the first and second side surfaces. a line coverage of a conductive component is smaller than about 50% in a region separated from an exposed portion of the dummy electrode toward a center of the multilayer body by about 50% or more.


20250054695. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takahiro KOJIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G4/18, H01G4/12, H01G4/232, H01G4/30

CPC Code(s): H01G4/18



Abstract: a multilayer ceramic capacitor includes hydrophilic and hydrophobic portions in a surface of a multilayer body. the hydrophilic portion includes first and second main surface-side hydrophilic portions including a hydroxyl group, and first and second lateral surface-side hydrophilic portions including a hydroxyl group. the hydrophobic portion includes first and second main surface-side hydrophobic portions including at least one of fluorine and silicone, and first and second lateral surface-side hydrophobic portions including at least one of fluorine and silicone.


20250054698. MULTILAYER CERAMIC ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yasuhiro MISHIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G4/232, H01G4/008, H01G4/012, H01G4/30

CPC Code(s): H01G4/2325



Abstract: a multilayer ceramic capacitor includes first and second external electrodes. the first external electrode includes a first base electrode layer, a first electrically conductive resin layer on the first base electrode layer and including a thermosetting resin and a metal component, and a first ni plated layer on the first electrically conductive resin layer. the second external electrode includes a second base electrode layer, a second electrically conductive resin layer on the second base electrode layer and including a thermosetting resin and a metal component, and a second ni plated layer on the second electrically conductive resin layer. tensile stress is provided as internal stress inside the first and second ni plated layers.


20250054703. THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takashi SAWADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kazunori USUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G4/30, H01G2/06, H01G4/008, H01G4/012, H01G4/12

CPC Code(s): H01G4/30



Abstract: a through-type multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, inner electrode layers laminated on the dielectric layers, first and second inner electrode layer, a first outer electrode on a first end surface of the multilayer body and connected to the first inner electrode layer, a second outer electrode on a second end surface of the multilayer body and connected to the first inner electrode layer, a third outer electrode on a first side surface of the multilayer body and connected to the second inner electrode layer, and a fourth outer electrode on a second side surface of the multilayer body and connected to the second inner electrode layer. the first outer electrode includes a first plating layer and a first charging electrode, and the second outer electrode includes a second plating layer and a second charging electrode.


20250054704. MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Kazunori USUI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi SAWADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G4/30, H01G2/06, H01G4/008, H01G4/012, H01G4/12

CPC Code(s): H01G4/30



Abstract: a multilayer ceramic electronic component includes a multilayer body with laminated ceramic layers and internal electrode layers, a first and second main surface opposing each other in a lamination direction, a first and second side surface opposing each other in a width direction, a first and second end surface opposing each other in a length direction, and external electrodes. the internal electrode layers include first and second internal electrode layers alternately laminated with the ceramic layers and exposed to the first and second end surfaces and first and second side surfaces. each of the first and second external electrodes includes a dense region, and where an area ratio of a conductive component is high and a sparse region where an area ratio of the conductive component is lower than the dense region, and the dense region is located closer to a multilayer body side than the sparse region.


20250054705. CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Akitomo TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01G9/012, H01G9/048, H01G9/07, H01G9/10, H01G9/15

CPC Code(s): H01G9/012



Abstract: a capacitor that includes: a capacitor layer including a first electrode layer and a second electrode layer facing each other in a thickness direction with a dielectric layer interposed therebetween; and a coaxial through-hole conductor penetrating through the capacitor layer in the thickness direction, wherein the coaxial through-hole conductor includes: a first through-hole conductor electrically coupled to an end surface of the first electrode layer; and a second through-hole conductor inside the first through-hole conductor and electrically coupled to the second electrode layer, wherein the first through-hole conductor and the second through-hole conductor are insulated from each other.


20250054944. NEGATIVE ELECTRODE AND SECONDARY BATTERY_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yuichi SANO of Kyoto (JP) for murata manufacturing co., ltd.

IPC Code(s): H01M4/134, H01M4/02, H01M4/38, H01M4/66

CPC Code(s): H01M4/134



Abstract: a negative electrode and a secondary battery capable of improving cycle characteristics are provided. the negative electrode includes a negative electrode current collector, a negative electrode active material layer, a first layer provided between the negative electrode current collector and the negative electrode active material layer, and a second layer provided on the negative electrode active material layer. the negative electrode current collector contains at least one or more of copper, nickel, and iron, the negative electrode active material layer contains silicon, the first layer contains silicon, a metal element constituting the negative electrode current collector, and at least one or more of titanium, nickel, zinc, silver, iron, boron, indium, and germanium, and the second layer contains silicon and at least one or more of titanium, nickel, zinc, silver, iron, boron, indium, and germanium.


20250055176. ELECTRONIC COMPONENT MODULE AND WIRELESS COMMUNICATION DEVICE COMPRISING SAME_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yoshinori YAMAWAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Noboru KATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryosuke WASHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoichi SAITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masaki KASAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01Q1/22, H01Q1/02, H01Q9/06

CPC Code(s): H01Q1/2283



Abstract: an electronic component module includes a first substrate, a coupling electrode and a second substrate. the coupling electrode is provided on a first surface of the first substrate, the coupling electrode is configured to be electromagnetically coupled with a conductor pattern on an antenna member. the second substrate is provided on the first surface of the first substrate, the second substrate covers the coupling electrode. a first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.


20250055197. TRANSMISSION LINE, AND ANTENNA MODULE AND COMMUNICATION DEVICE INCLUDING THE SAME_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yoshiki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H01Q13/08, H01Q21/06

CPC Code(s): H01Q13/08



Abstract: a transmission line includes a ground electrode, a first line, and a second line, and transfers a radio frequency signal. the first line is disposed to face the ground electrode and constitutes a microstrip line together with the ground electrode. the second line faces the first line and is disposed along the first line. the second line constitutes a resonator for the first line. the first line is disposed between the second line and the ground electrode.


20250055300. POWER CONVERTERS AND METHODS FOR CHARGING AND DISCHARGING A BATTERY_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): David GIULIANO of Bedford NH (US) for murata manufacturing co., ltd.

IPC Code(s): H02J7/00, H02M3/07, H02M3/158

CPC Code(s): H02J7/007182



Abstract: a power converter for use with a programmable power supply circuit includes a charging circuit and a battery. the charging circuit is electrically coupled to the programmable power supply circuit, the programmable power supply circuit being configured to provide a regulated dc input voltage. the charging circuit includes a first dc-dc converter electrically coupled to the programmable power supply circuit and configured to convert the regulated dc input voltage to a system output voltage at an output node. the battery is electrically coupled to the first dc-dc converter, and configured to be charged or discharged, directly or indirectly via the output node. the charging circuit further includes a second dc-dc converter electrically coupled in series between the programmable power supply circuit and the battery. one of the first dc-dc converter and the second dc-dc converter is an unregulated converter.


20250055301. CONTROLLERS, CHARGING DEVICES, AND METHODS FOR CONTROLLING A CHARGING CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): David GIULIANO of Bedford NH (US) for murata manufacturing co., ltd., Ibrahim SEZAN of San Diego CA (US) for murata manufacturing co., ltd., Andrew BORJA of San Jose CA (US) for murata manufacturing co., ltd.

IPC Code(s): H02J7/00

CPC Code(s): H02J7/007194



Abstract: a method for controlling a charging circuit includes: receiving battery information of a battery from an electrical device to be charged; receiving one or more characteristic parameters from the electrical device; selecting, from multiple charging mode candidates, a target charging mode according to the battery information and the one or more characteristic parameters; and controlling a controller to adjust one or more operating parameters of the charging circuit based on the selected target charging mode for charging the electrical device.


20250055302. POWER CONVERTER, CONTROLLER, AND CHARGING CIRCUIT SYSTEMS AND METHODS_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): David Giuliano of Bedford NH (US) for murata manufacturing co., ltd., Ibrahim Sezan of San Diego CA (US) for murata manufacturing co., ltd., Andrew Borja of San Jose CA (US) for murata manufacturing co., ltd.

IPC Code(s): H02J7/00

CPC Code(s): H02J7/007194



Abstract: power converter, controller, and charging circuit systems and methods are provided. in one example, a power converter for use with a programmable power supply circuit includes a charging circuit and a battery. the charging circuit is configured to be coupled to the programmable power supply circuit. the programmable power supply circuit is configured to provide a regulated dc input voltage. the charging circuit includes a dc-dc converter configured to be coupled to the programmable power supply circuit and configured to convert the regulated dc input voltage to a system output voltage at a node. the battery is coupled to the dc-dc converter, and configured to be charged or discharged, directly or indirectly via the node. the charging circuit further includes a charge transistor coupled in series between the dc-dc converter and the battery via the node and configured to enable or disable charging or discharging of the battery.


20250055427. RADIO FREQUENCY AMPLIFICATION CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Takayuki TSUTSUI of Kyoto (JP) for murata manufacturing co., ltd., Shinnosuke TAKAHASHI of Kyoto (JP) for murata manufacturing co., ltd.

IPC Code(s): H03F3/213, H03F1/30

CPC Code(s): H03F3/213



Abstract: a radio frequency amplification circuit includes an amplification transistor, a first transistor, and a schottky barrier diode. the amplification transistor has a base to which a radio frequency signal is supplied and a collector from which the radio frequency signal amplified is outputted, and is made of a compound semiconductor. the first transistor has a base to which a first bias is supplied, and an emitter electrically coupled to the base of the amplification transistor and configured to supply a second bias to the base of the amplification transistor, and is made of the compound semiconductor. the schottky barrier diode has an anode electrically coupled to the base of the first transistor and a cathode electrically coupled to the emitter of the first transistor.


20250055439. EMBEDDED INTERDIGITAL TRANSDUCER FOR SOLIDLY-MOUNTED ACOUSTIC RESONATOR_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Bryant GARCIA of Mississauga (CA) for murata manufacturing co., ltd., Tetsuya Kimura of San Mateo CA (US) for murata manufacturing co., ltd., Toru Yamaji of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H03H9/17, H03H9/02, H03H9/56

CPC Code(s): H03H9/175



Abstract: an acoustic resonator is provided that included a substrate; a piezoelectric layer supported by the substrate; and an interdigital transducer (idt) on a surface of the piezoelectric layer that faces the substrate, with the idt including a plurality of interleaved fingers. moreover, the acoustic resonator includes an acoustic reflector, such as a bragg reflector, disposed between the substrate and the piezoelectric layer. the acoustic reflector includes acoustic impedance layers with one or more layers having a shape that conforms to the interleaved fingers disposed on the surface of the piezoelectric layer.


20250055441. TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Patrick TURNER of Portola Valley CA (US) for murata manufacturing co., ltd., Mike EDDY of Santa Barbara CA (US) for murata manufacturing co., ltd., Andrew KAY of Irvine CA (US) for murata manufacturing co., ltd., Ventsislav YANTCHEV of Sofia (BG) for murata manufacturing co., ltd.

IPC Code(s): H03H9/25, H03H9/02, H03H9/10, H03H9/58, H03H9/64

CPC Code(s): H03H9/25



Abstract: a radio frequency filter includes bulk acoustic resonator chips that each include a substrate; a piezoelectric plate that includes multiple separate plates; and a conductor pattern on the piezoelectric layer and including an interdigitated transducer (idt) with interleaved fingers on the piezoelectric layer opposite the substrate. the filter further includes an interposer having a surface facing the piezoelectric layer of each of the plurality of bulk acoustic resonator chips; a conductor pattern on the surface of the interposer; a conductive metal bump between the piezoelectric layer and the interposer that electrically connects the plurality of bulk acoustic resonator chips to the interposer; and a cover bonded to the substrates of the plurality of bulk acoustic resonator chips and to the interposer, wherein the cover seals an interior of the plurality bulk acoustic resonator chips.


20250055487. RADIO FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Yuusuke SUZUKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masateru HIGASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takumi FUKUNAGA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.

IPC Code(s): H04B1/00, H04B1/04

CPC Code(s): H04B1/0078



Abstract: a radio frequency circuit includes a switch having selection terminals, a switch, a filter connected to the selection terminal, a filter connected to the selection terminal, and a filter. the switch is connected in series to and between the filter and a path connecting the selection terminal and the filter.


20250056729. SUBSTRATE_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Ryuichi KUBO of Kyoto (JP) for murata manufacturing co., ltd.

IPC Code(s): H05K1/18, H05K3/30

CPC Code(s): H05K1/185



Abstract: a substrate includes a core substrate that has a first surface, a second surface facing away from the first surface, and a cavity portion therein; at least two electronic components provided in the cavity portion; and an encapsulating material that is provided between the cavity portion and the at least two electronic components and between the at least two electronic components and includes a resin and fillers, in which an average of distances between the at least two electronic components is less than a shortest distance between a wall surface of the cavity portion and some of the electronic components that are adjacent to the wall surface.


20250056875. Efficient FET Body and Substrate Contacts_simplified_abstract_(murata manufacturing co., ltd.)

Inventor(s): Jagar Singh of New York NY (US) for murata manufacturing co., ltd., Simon Edward Willard of Irvine CA (US) for murata manufacturing co., ltd.

IPC Code(s): H01L27/092, H01L21/8238, H01L27/12, H01L29/08, H01L29/10, H01L29/66

CPC Code(s): H01L27/0922



Abstract: integrated circuit structures that significantly reduce the resistance associated with the body contact region and substrate region contact of a field-effect transistor (fet) compared to conventional designs. embodiments include a fet having a body contact region, and optionally a substrate region contact, that includes germanium (ge) alone or as an alloy with silicon (sige) and/or as a layered combination with silicon (e.g., a layer of ge on a layer of si). a first method includes fabricating a body contact region of a field-effect transistor by fabricating the field-effect transistor with an si body contact region, and diffusing or implanting ge within the si. a second method includes fabricating a body contact region of a field-effect transistor by fabricating the field-effect transistor with an si body contact region, etching away at least part of the si body contact region to form a well, and depositing ge within the well.


Murata Manufacturing Co., Ltd. patent applications on February 13th, 2025