Murata Manufacturing Co., Ltd. patent applications on December 19th, 2024
Patent Applications by Murata Manufacturing Co., Ltd. on December 19th, 2024
Murata Manufacturing Co., Ltd.: 30 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01G4/30 (6), H01G4/012 (6), H01G4/12 (5), H01G4/232 (5), H01G4/008 (4) H01G4/012 (4), H05K3/361 (2), H04B1/0078 (2), H01M10/0562 (2), A61B5/02125 (1)
With keywords such as: portion, layer, region, circuit, between, surface, substrate, direction, connected, and middle in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Toru SHIMUTA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): A61B5/021, A61B5/00, A61B5/024
CPC Code(s): A61B5/02125
Abstract: a method of estimating a peripheral blood pressure and a biological data measurement system are provided by which the magnitude of a blood pressure in a capillary or an arteriole at a periphery may be estimated in a simple and non-invasive manner. acquiring a photoplethysmographic signal from a capillary or an arteriole at a periphery of a user who is a subject by using a photoplethysmographic sensor; and calculating a peripheral blood pressure index based on the steepness of the rising edge of the photoplethysmographic signal are performed at the biological data measurement system, the peripheral blood pressure index serving as an index of the magnitude of a blood pressure in the capillary or the arteriole at the periphery. the magnitude of the blood pressure in the capillary or the arteriole at the periphery is estimated based on the peripheral blood pressure index.
Inventor(s): Yuuki ISHII of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Noritaka KISHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hitoshi SAKAGUCHI of Nagaokakayo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G02B27/00, G02B7/02, G02B13/00, H04N23/55
CPC Code(s): G02B27/0006
Abstract: the present disclosure provides an optical device that reduces stress concentration on a vibrator while removing foreign matter adhering to a light-transparent body covering the exterior of the optical device with vibrations, and to provide an image pickup unit including the optical device. an optical device includes an outermost-layer lens, a housing, a vibrator, and a piezoelectric device. the outermost-layer lens is transparent to light of a predetermined wavelength. the housing holds the outermost-layer lens. the vibrator is in contact with the outermost-layer lens held by the housing. the piezoelectric device is disposed on the vibrator to vibrate the vibrator. the vibrator is a tubular body, and includes a connector that is in contact with the outermost-layer lens, a vibrating portion on which a piezoelectric device is disposed, and a supporter that connects the connector and the vibrating portion to each other and that has a curved cross-sectional shape.
20240420882. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tarou TSUJIBAYASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masashi MIYAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F27/30, H01F27/24, H01F27/29, H01F27/32
CPC Code(s): H01F27/306
Abstract: in an inductor component, the winding return portions of multilayer winding portions that are embedded in a resin coating member present at positions that face a surface other than a winding core top surface of a winding core portion, and, of turns of a wire that constitute a first layer of each of the multilayer winding portions that is closest to the peripheral surface of the winding core portion, adjacent turns of the wire that are located between adjacent winding portions of the multilayer winding portions are in contact with each other or form a gap that is equal to or smaller than the radius of the wire.
20240420888. MUTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Makoto NISHIKORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/005, H01G4/232, H01G4/30
CPC Code(s): H01G4/005
Abstract: a multilayer ceramic capacitor includes first, second, third, and fourth regions each adjacent to a corresponding one of end surfaces, a first middle region between the first and second regions, located closer to an outside of a multilayer body, and having higher coverage, a second middle region between the third and fourth regions, located closer to the outside of the multilayer body, and having higher coverage, a first sloped portion coupling the first region and the first middle region, a second sloped portion coupling the second region and the first middle region, a third sloped portion coupling the third region and the second middle region, and a fourth sloped portion coupling the fourth region and the second middle region.
Inventor(s): Sota YANAI of Nagaokako-shi (JP) for murata manufacturing co., ltd., Masaki NAGATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuhiro SHIMIZU of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/008
CPC Code(s): H01G4/008
Abstract: a capacitor that includes: a substrate with conductivity; a plurality of fiber-shaped conductive members on the substrate and electrically connected to the substrate; a dielectric layer covering a surface of the plurality of fiber-shaped conductive members; and a conductor layer covering a surface of the dielectric layer, where the plurality of fiber-shaped conductive members includes a proximal half present proximally to the surface of the substrate and a distal half present distally to the surface of the substrate, and one of the proximal half and the distal half is higher in the number density of the plurality of fiber-shaped conductive members and larger in the thickness of the dielectric layer than the other of the proximal half and the distal half.
20240420890. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Akitaka DOI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/008, H01G4/012, H01G4/12, H01G4/30
CPC Code(s): H01G4/0085
Abstract: a multilayer ceramic capacitor includes dielectric layers including ba and ti, and internal electrode layers including ni. a dimension l in a length direction, a dimension t in a lamination direction, and a dimension w in a width direction satisfy 1.7≤l/t≤2.3 and 1.0≤w/t≤1.4. adjacent ends of the internal electrode layers have a positional deviation of about 5 �m or less in the width direction. segregation of sn with an atomic composition percentage of about 2 at % or higher occurs at an interface between the internal electrode layer and the dielectric layer. a dimension of each side gap portion in the width direction is ws, a dimension of each outer layer portion in the lamination direction is tg, and 0.3≤ws/tg≤0.6. for each internal electrode layer, a dimension in the width direction is wi, and t<wi.
20240420891. MUTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Makoto NISHIKORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/12, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes first and second counter portions. the first counter portion includes a first middle region and first and second regions. the second counter portion includes a second middle region, third and fourth regions. the first middle region has coverage higher than coverage of the first and second regions. the second middle region has coverage higher than coverage of the third and fourth regions. a dimension of each of the first and second middle regions is shorter than a distance between first and second external electrodes. a dimension at a center of an exposed portion in the length direction is longer that a maximum distance in a lamination direction between first and second covered portions, and shorter than a maximum distance in the lamination direction between both sides of the first and second external electrodes.
20240420892. MUTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Makoto NISHIKORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/008, H01G4/12, H01G4/33
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes a first counter portion including first and second regions, and a first middle region located between the first and second regions and including coverage higher than coverages thereof, a second counter portion including third and fourth regions, and a second middle region located between the third and fourth regions and including coverage higher than coverage thereof. a thickness of each of the first and second middle regions is about 101.6% or more and about 111.3% or less of a thickness of each of the first, second, third, and fourth regions, and a difference between coverage of each of the first and second middle regions and coverage of each of the first, second, third, and fourth regions is about 2.2 percentage points or more.
20240420893. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Toshimi OGUNI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mayumi YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tomoaki HIRAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeshi SUGATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/12, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes a first extension portion, a first counter portion, a second extension portion, and a second counter portion. the first extension portion includes a first external electrode-side region, a first counter portion-side region, and a first intermediate region. the second extension portion includes a second external electrode-side region, a second counter portion-side region, and a second intermediate region. a coverage of the first intermediate region and the second intermediate region is lower than a coverage of the first external electrode-side region and the second external electrode-side region. the coverage of the first intermediate region and the second intermediate region is lower than a coverage of the first counter portion and the second counter portion.
Inventor(s): Makoto NISHIKORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a ceramic capacitor includes a multilayer body, and first and second external electrodes including first and second based electrode layers. the first and second external electrodes are spaced from each other and provided on end surfaces of the multilayer body in a length direction. the first and second base electrode layers each include a metal portion and non-metal portions in the metal portion. in a cross sectional view perpendicular or substantially perpendicular to a width direction, an average area of the non-metal portions in a first population of the non-metal portions, each having a circularity of about 0.4 or less, is about 10 �mor more, and a proportion of the plurality of non-metal portions in each of the first and second base electrode layers is about 8.2% or more.
20240420896. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiroaki SUGITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/012, H01G4/12, H01G4/232
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a multilayer body including an active layer portion including internal electrode layers and dielectric layers opposed to each other in a height direction. the active layer portion includes first and second lateral surface-side active layer portions, and a middle active layer portion. an average thickness in the height direction of the dielectric layers inside the first and second lateral surface-side active layer portions is smaller than an average thickness in the height direction of the dielectric layers inside the middle active layer portion. an average particle size of a ceramic material in the dielectric layers inside the first and second lateral surface-side active layer portions is larger than an average particle size of the ceramic material in the dielectric layers inside the middle active layer portion.
20240420899. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomoyuki ASHIMINE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Satoshi SHINDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koshi HIMEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G9/10, H01G9/012, H01G9/025
CPC Code(s): H01G9/10
Abstract: an electronic component that includes: a sealing body having a first plate, a cover part spaced form the first plate, and a sealing metal layer; a functional part spaced from the first plate and in an airtight internal space of the sealing body; a filling resin part filling a space between the sealing body and the functional part; and a via conductor in a first through hole extending through the first plate and in a second through hole extending through the filling resin part and communicating with the first through hole, the via conductor being electrically connected to a pair of electrodes of the functional part. a water vapor transmission rate of the cover part is less than or equal to one-tenth of a water vapor transmission rate of the filling resin part having the same film thickness, or the cover part is made of glass or metal.
20240421225. High-Performance LDMOS Structures_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Jagar Singh of Clifton Park NY (US) for murata manufacturing co., ltd., Anil Kumar of San Diego CA (US) for murata manufacturing co., ltd., Sinan Goktepeli of Austin TX (US) for murata manufacturing co., ltd., Hiroshi Yamada of San Diego CA (US) for murata manufacturing co., ltd., Akira Fujihara of San Diego CA (US) for murata manufacturing co., ltd., Tsunekazu Saimei of San Diego CA (US) for murata manufacturing co., ltd., Kazuhiko Shibata of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L29/78, H01L29/417, H01L29/66
CPC Code(s): H01L29/7835
Abstract: high-voltage transistors that may be fabricated in a standard low-voltage process. embodiments include integrated circuits that combine, in a unitary structure, an ldmos fet device that includes one or more dummy polysilicon structures (dps's) overlying a drift region and comparable in configuration to the fet gate, and interstitial implant resistance pockets (irp) formed within the drift region between the gate and an adjacent dps and between each pair of adjacent dps's. the irps may be augmented with floating contacts to remove heat from the drift region and provide additional shielding of the drain contact from the nearest edge of the gate. the irps may be biased to modulate the conductivity of the drift region. the dps's may be biased to modulate the conductivity of the drift region, and in such a way as to protect each dps from excessive and potentially destructive voltages.
Inventor(s): Daisuke ITO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562, H01M4/02, H01M4/04, H01M4/131, H01M4/133, H01M4/1391, H01M4/1393, H01M4/62, H01M10/0585
CPC Code(s): H01M10/0562
Abstract: an electrode for a solid-state battery is provided and includes active material particles, a resin, and an inorganic solid-state electrolyte. the resin includes at least one selected from the group consisting of polyimide, polyamide, and polyamideimide and includes a carbide in part. the inorganic solid-state electrolyte includes a lithium salt that includes at least one element selected from the group consisting of boron (b), carbon (c), sulfur (s), and chlorine (cl).
Inventor(s): Daisuke ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0562
CPC Code(s): H01M10/0562
Abstract: a solid-state electrolyte for a solid-state battery, the solid-state electrolyte including: a lithium salt solid-state electrolyte part; and a non-lithium compound part embedded in the lithium salt solid-state electrolyte part. preferably, the lithium salt solid-state electrolyte part has an antiperovskite structure, and the non-lithium compound part includes an inorganic insulating material.
Inventor(s): Hajime SHIJI of San Jose CA (US) for murata manufacturing co., ltd.
IPC Code(s): H02M3/158, H02M1/00
CPC Code(s): H02M3/1586
Abstract: a converter system includes a first bidirectional converter electrically connected between a first node and a second node and a second bidirectional converter electrically connected between the first node and the second node in parallel with the first bidirectional converter. current is shared between the first bidirectional converter and the second bidirectional converter based on a single current-sharing signal.
Inventor(s): Takaaki MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masaaki TAKATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Noritaka KISHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H02N2/14, H02N2/16
CPC Code(s): H02N2/145
Abstract: the present disclosure relates to a method of controlling a vibration device including a piezoelectric element via a control device. the method includes changing a frequency of a drive signal for driving the piezoelectric element, measuring a value related to an impedance of the piezoelectric element, and determining a driving frequency for driving the piezoelectric element based on a change in the measured value related to the impedance of the piezoelectric element. the changing of the frequency of the drive signal includes changing a clock width such that a clock width of a first portion of clocks among a plurality of clocks included in the drive signal and a clock width of a second portion of clocks among a plurality of clocks are different from each other.
20240421775. DOHERTY AMPLIFICATION CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Kenji TAHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kae YAMAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0288
Abstract: a doherty amplification circuit includes a carrier amplifier, a peak amplifier, a phase shift circuit, a phase shift circuit connected to an output end of the peak amplifier, a transformer including an input terminal connected to an output end of the carrier amplifier, and output terminals, and a transformer including input terminals, which are respectively connected to the output terminals of the transformer, and an output terminal connected to an antenna connection terminal, in which the phase shift circuit is connected between the output terminal of the transformer and the input terminal of the transformer, and the peak amplifier and the phase shift circuit are connected between the output terminal of the transformer and the input terminal of the transformer.
Inventor(s): Phanindra YERRAMILLI of SAN DIEGO CA (US) for murata manufacturing co., ltd., Emre AYRANCI of COSTA MESA CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03F3/19
CPC Code(s): H03F3/19
Abstract: methods and devices to mitigate the detrimental effects of highly capacitive output routes of multiple gain low noise amplifiers on the overall performance of the circuit are disclosed. the disclosed methods and devices implement the same inductive element across the output load in both the low gain and high gain operational modes. furthermore, such devices implement switches to control the selection of different signal paths for the high gain and low gain mode. the implemented switches are also used to selectively adjust the isolation of the output stage of the lna.
20240421795. ELECTRONIC MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Mari SAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi YAMANE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/05, H03H3/08, H03H9/08, H03H9/10, H03H9/25
CPC Code(s): H03H9/0542
Abstract: a semiconductor element having a structure in which a wiring layer, an element formation layer, and a first insulating layer are stacked is mounted on a first surface of a module substrate in a state where the wiring layer faces the module substrate. the electronic component is mounted on the first surface of the module substrate. a resin layer is on the first surface of the module substrate. first and second recessed portions are in the resin layer, a semiconductor element is in the first recessed portion, and the electronic component is in the second recessed portion. when the first surface is set as a height reference, an upper surface of the resin layer includes a region which is higher than or equal to heights of an upper surface of the semiconductor element and an upper surface of the electronic component, around the semiconductor element and the electronic component.
Inventor(s): Taiki GOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroshi KUMANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kaiza MAKINO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi HASE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuhiro YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/19, H03H3/02, H03H9/10
CPC Code(s): H03H9/19
Abstract: a quartz vibration element that includes: a quartz plate having first and second principal surfaces; first and second driving electrodes on the first and second principal surfaces, respectively, wherein when an x-axis, a y-axis, and a z-axis are defined as crystallographic axes of a quartz crystal of the quartz plate, an x′-axis and a y′-axis are obtained by rotating the x-axis and the y-axis about the z-axis by a rotation angle �, and a y″-axis and a z′-axis are obtained by rotating the y′-axis and the z-axis about the x′-axis by a rotation angle �, the first and second principal surfaces are perpendicular to the y″-axis, and when one of the first or second principal surfaces is viewed in plan and an angle � is between the x-axis and a long side of the quartz plate, the quartz plate satisfies both �=����� and −0.0165−0.016≤�≤−0.0165+0.016 or +0.0165−0.016≤�≤+0.0165+0.016.
Inventor(s): Robert Mark ENGLEKIRK of Littleton CO (US) for murata manufacturing co., ltd., Keith RAMPMEIER of San Diego CA (US) for murata manufacturing co., ltd., Arpita Moghe CHADHA of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03K17/693, G06F13/40, G06F13/42, H03K19/0944, H03K19/17736
CPC Code(s): H03K17/693
Abstract: circuits and methods for determining the characteristics of swappable pins in a peripheral in a 1-wire or similar single-conductor system, thereby allowing each one of two pins to be either an i/o pin (connected to an i/o line) or a cap pin (connected to a storage capacitor). embodiments may utilize a hybrid buffer circuit that utilizes an effectively bi-directional pfet pull-up device coupled between the swappable pins a and b. two open-drain nfets pull-down devices are used, one on either side of the pfet and coupled to a respective pin (a or b), but with only one nfet being selected to be operable based on pin-determination flag signals from the pin detection circuitry. such a hybrid buffer circuit would consume significantly less ic area than two complete conventional buffers, resulting in less leakage and less yield loss.
Inventor(s): Hiroyuki KANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H04B1/04
CPC Code(s): H04B1/0078
Abstract: a radio-frequency module includes a first switch, a first filter, second filters, a power amplifier, and a low-noise amplifier. the first switch has a first terminal, a second terminal, and a third terminal. the first terminal is coupled to an antenna terminal. the first filter is coupled to the second terminal. the second filters are coupled to the third terminal. the first filter includes a common filter circuit and an additional filter circuit. the additional filter circuit is coupled between the power amplifier and the common filter circuit. the low-noise amplifier is coupled to a path that branches off from a path connecting between the common filter circuit and the additional filter circuit. the common filter circuit is coupled between the additional filter circuit and the first switch.
20240421836. RADIO-FREQUENCY CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Morio TAKEUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H04B1/04, H04B1/16
CPC Code(s): H04B1/0078
Abstract: a radio-frequency circuit includes first and second transfer circuits. the first transfer circuit supports reception of a cellular communication system and a satellite system. the second transfer circuit supports transmission and reception of the cellular communication system. the first transfer circuit includes a first filter circuit and a first low-noise amplifier circuit. the first filter circuit is connected to a first antenna connection terminal and has a pass band including a cellular receive band and a satellite receive band. the first low-noise amplifier circuit is connected to the first filter circuit. the second transfer circuit includes a second filter circuit, a power amplifier circuit, and a second low-noise amplifier circuit. the second filter circuit is connected to a second antenna connection terminal and has a pass band including the cellular receive band and a cellular transmit band corresponding to the cellular receive band.
Inventor(s): Shogo YANASE of Kyoto (JP) for murata manufacturing co., ltd., Nanami YUMURA of Kyoto (JP) for murata manufacturing co., ltd., Masaki TADA of Kyoto (JP) for murata manufacturing co., ltd., Yuusuke KISHI of Kyoto (JP) for murata manufacturing co., ltd., Ryoya SHIOMI of Kyoto (JP) for murata manufacturing co., ltd., Takanori UEJIMA of Kyoto (JP) for murata manufacturing co., ltd., Naru MORITO of Kyoto (JP) for murata manufacturing co., ltd., Masaki KIMURA of Kyoto (JP) for murata manufacturing co., ltd., Hiroyuki NAGAMORI of Kyoto (JP) for murata manufacturing co., ltd., Mizuki KINOSHITA of Kyoto (JP) for murata manufacturing co., ltd., Minoru IWANAGA of Kyoto (JP) for murata manufacturing co., ltd., Takuma KUROYANAGI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/40, H01Q1/22, H03H9/64, H03H9/72
CPC Code(s): H04B1/40
Abstract: a radio frequency module includes a substrate having a mounting surface, components for transmission and a component for transmission and reception that are disposed on the mounting surface, acoustic wave filters disposed between each of the components for transmission and the component for transmission and reception, and shield electrodes each formed on a corresponding one of side surfaces of the acoustic wave filters.
Inventor(s): Peter BACON of DERRY NH (US) for murata manufacturing co., ltd., Mark Edward MAGDALENO of ESCONDIDO CA (US) for murata manufacturing co., ltd., Yonghuang ZENG of SAN DIEGO CA (US) for murata manufacturing co., ltd., Young-Taek LEE of GYEONGGI-DO (KR) for murata manufacturing co., ltd.
IPC Code(s): H04L5/00, H04W28/06, H04W28/20
CPC Code(s): H04L5/0073
Abstract: systems and methods for better utilizing available resources within a wireless telecommunication system. one aspect of the present invention is user equipment (ue) configured to autonomously determine its maximum sensitivity degradation (msd) value for a particular ue configuration. the msd value is a function of (1) selected ue-specific parameters, such as those that are determined by the characteristics of the ue's rffe components and rffe architecture, and (2) selected standard parameters that may be dynamic or vary over time. another aspect of the present invention is to configure a ue to provide its determined msd value to a communications network, either as a raw value or as a computed indication of the msd value relative to a specified reference value. the determined msd value may then be used by a system controller to select a more efficient allocation of spectrum and network resources.
20240422913. CIRCUIT MODULE AND CIRCUIT BOARD_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Ryutatsu MIZUKAMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K1/14, H05K1/11
CPC Code(s): H05K1/144
Abstract: in a circuit module, a first signal electrode is electrically connected to a first signal conductor layer. a first branch electrode is electrically connected to a first branch conductor layer. a second signal electrode is electrically connected to a second signal conductor layer and is bonded to the first signal electrode by using a conductive bonding material. a second branch electrode is electrically connected to a second ground conductor layer and is bonded to the first branch electrode by using a conductive bonding material.
20240422918. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yui NAKAMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiromitsu ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K3/36
CPC Code(s): H05K3/361
Abstract: a stretchable device that includes: a first substrate; a stretchable first wiring on the first substrate; a second substrate facing the first substrate in a first direction that is a thickness direction of the first substrate; a second wiring on the second substrate and facing the first wiring in the first direction; a connection member electrically connecting the first wiring and the second wiring; and a first protective layer at least between the second substrate and the first wiring in the first direction.
20240422919. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiromitsu ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yui NAKAMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K3/36
CPC Code(s): H05K3/361
Abstract: a stretchable device including: a first substrate; a stretchable first wiring on the first substrate; a second substrate facing the first substrate in a thickness direction of the first substrate; a stretchable second wiring on the second substrate; a first protective layer covering a part of the first wiring; a second protective layer covering a part of the second wiring; and a connection member in contact with an outer surface at an end portion of each of the first and the second wirings and electrically connecting the first and the second wirings, and in contact with an end surface of each of the first and the second protective layers, wherein at least a pair out of (1) the first protective layer and the second wiring and (2) the second protective layer and the first wiring is separated from each other with the connection member interposed therebetween.
Inventor(s): Masataka FURUNO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K7/14, H05K7/12
CPC Code(s): H05K7/1412
Abstract: a lock mechanism is attachable to a rack-mountable exterior body for housing an electronic device, and includes a latch and a bumper. the latch has a first flat plate and a first protrusion). the first flat plate has a main surface. the first protrusion protrudes from the first flat plate to a side that the main surface faces. the bumper has a second flat plate in contact with the latch and a second protrusion. the second protrusion protrudes from the second flat plate to a side in the same direction as the first protrusion. a specific axis parallel to the main surface is a first axis, and an axis orthogonal to the first axis and parallel to the main surface is a second axis. the first protrusion has a latch surface perpendicular to the first axis. the second protrusion has a bumper surface perpendicular to the second axis.
Murata Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Murata Manufacturing Co., Ltd.
- A61B5/021
- A61B5/00
- A61B5/024
- CPC A61B5/02125
- Murata manufacturing co., ltd.
- G02B27/00
- G02B7/02
- G02B13/00
- H04N23/55
- CPC G02B27/0006
- H01F27/30
- H01F27/24
- H01F27/29
- H01F27/32
- CPC H01F27/306
- H01G4/005
- H01G4/232
- H01G4/30
- CPC H01G4/005
- H01G4/008
- CPC H01G4/008
- H01G4/012
- H01G4/12
- CPC H01G4/0085
- CPC H01G4/012
- H01G4/33
- CPC H01G4/30
- H01G9/10
- H01G9/012
- H01G9/025
- CPC H01G9/10
- H01L29/78
- H01L29/417
- H01L29/66
- CPC H01L29/7835
- H01M10/0562
- H01M4/02
- H01M4/04
- H01M4/131
- H01M4/133
- H01M4/1391
- H01M4/1393
- H01M4/62
- H01M10/0585
- CPC H01M10/0562
- H02M3/158
- H02M1/00
- CPC H02M3/1586
- H02N2/14
- H02N2/16
- CPC H02N2/145
- H03F1/02
- H03F3/24
- CPC H03F1/0288
- H03F3/19
- CPC H03F3/19
- H03H9/05
- H03H3/08
- H03H9/08
- H03H9/10
- H03H9/25
- CPC H03H9/0542
- H03H9/19
- H03H3/02
- CPC H03H9/19
- H03K17/693
- G06F13/40
- G06F13/42
- H03K19/0944
- H03K19/17736
- CPC H03K17/693
- H04B1/00
- H04B1/04
- CPC H04B1/0078
- H04B1/16
- H04B1/40
- H01Q1/22
- H03H9/64
- H03H9/72
- CPC H04B1/40
- H04L5/00
- H04W28/06
- H04W28/20
- CPC H04L5/0073
- H05K1/14
- H05K1/11
- CPC H05K1/144
- H05K3/36
- CPC H05K3/361
- H05K7/14
- H05K7/12
- CPC H05K7/1412
