Mitsubishi electric corporation (20240347420). HEATSINK AND SEMICONDUCTOR DEVICE simplified abstract
Contents
HEATSINK AND SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
HEATSINK AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347420 titled 'HEATSINK AND SEMICONDUCTOR DEVICE
Simplified Explanation:
The patent application describes a heatsink with a base that dissipates heat from a heating element, along with a screw hole for securing the heatsink in place. A semiconductor device incorporating this heatsink and a semiconductor module is also mentioned.
- The heatsink has a base with a heat dissipation surface.
- The heat dissipation surface is thermally coupled to a heating element.
- The heatsink includes a screw hole for fastening it securely.
- A screw is used to secure the heatsink in place.
- The semiconductor device consists of the heatsink and a semiconductor module.
Potential Applications: The technology can be used in various electronic devices that require efficient heat dissipation, such as computers, servers, and power electronics.
Problems Solved: The technology addresses the issue of overheating in electronic devices, which can lead to performance degradation and even component failure.
Benefits: - Improved thermal management - Enhanced performance and reliability of electronic devices - Extended lifespan of electronic components
Commercial Applications: The technology can be applied in the manufacturing of electronic devices to improve their thermal performance, leading to better overall reliability and longevity.
Prior Art: Prior art related to this technology may include patents or research papers on heatsinks, semiconductor devices, and thermal management in electronics.
Frequently Updated Research: Researchers may be conducting studies on advanced materials for heatsinks, novel cooling techniques, and the integration of thermal management solutions in semiconductor devices.
'Questions about Heatsink Technology: 1. How does the heatsink design impact the overall thermal performance of electronic devices? 2. What are the key considerations when selecting a heatsink for a specific application?
2. Another relevant generic question, with a detailed answer: What are the potential challenges in implementing heatsink technology in high-power electronic devices?
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Original Abstract Submitted
a heatsink of the present disclosure includes a base having a heat dissipation surface that is thermally coupled to a heating element and dissipates heat from the heating element and a screw hole provided on the heat dissipation surface, and a screw screwed into the screw hole. a semiconductor device of the present disclosure includes the heatsink and a semiconductor module as the heating element.
