Mitsubishi electric corporation (20240319453). INTEGRATED OPTICAL MODULE simplified abstract
Contents
INTEGRATED OPTICAL MODULE
Organization Name
mitsubishi electric corporation
Inventor(s)
Satoshi Kajiya of Isahaya-Shi (JP)
Yudai Imai of Isahaya-Shi (JP)
INTEGRATED OPTICAL MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319453 titled 'INTEGRATED OPTICAL MODULE
The abstract of this patent application describes a mounting surface of a housing for an integrated optical module. This surface includes two bonding regions for different bonding materials, with a bonding material outflow blocking part provided between them.
- The mounting surface of the housing has a first bonding region for bonding a loading part with light emitting elements and a second bonding region for bonding an optical multiplexer.
- A bonding material outflow blocking part is provided between the first and second bonding regions to prevent bonding material from flowing out.
- The bonding material outflow blocking part extends in a direction intersecting with the incident direction of an optical signal, with increasing distance from the loading part's bonding surface along the incident direction.
Potential Applications: - This technology can be used in integrated optical modules for various applications such as telecommunications, data transmission, and sensing systems. - It can also be applied in optical networking equipment, fiber optic communication systems, and high-speed data transmission devices.
Problems Solved: - Prevents bonding material outflow between different bonding regions on the mounting surface. - Ensures secure bonding of different components in the integrated optical module. - Improves the overall performance and reliability of the optical module.
Benefits: - Enhanced stability and durability of the integrated optical module. - Improved signal transmission efficiency and accuracy. - Simplified manufacturing process for optical components.
Commercial Applications: - This technology can be utilized by manufacturers of optical communication equipment, data centers, and telecommunications infrastructure. - It has potential applications in the development of advanced optical networking solutions for commercial and industrial use.
Questions about the Technology: 1. How does the bonding material outflow blocking part contribute to the overall performance of the integrated optical module? 2. What are the specific advantages of using different bonding materials for the loading part and the optical multiplexer in this technology?
Original Abstract Submitted
a mounting surface of a housing of an integrated optical module includes a first bonding region to which a first bonding material for bonding a loading part on which a plurality of light emitting elements are loaded is to be applied, and a second bonding region to which a second bonding material for bonding an optical multiplexer is to be applied. on the mounting surface, a bonding material outflow blocking part for blocking bonding material outflow is provided between the first bonding region and the second bonding region. the bonding material outflow blocking part extends in a direction intersecting with but not orthogonal to an incident direction of an optical signal, and in advancement along the extending direction thereof, the distance from a side of a bonding surface of the loading part along the incident direction of the optical signal increases.
