Mitsubishi electric corporation (20240314943). SUBSTRATE JOINING STRUCTURE simplified abstract

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SUBSTRATE JOINING STRUCTURE

Organization Name

mitsubishi electric corporation

Inventor(s)

Hiromitsu Itamoto of Tokyo (JP)

SUBSTRATE JOINING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240314943 titled 'SUBSTRATE JOINING STRUCTURE

The abstract describes a patent application where solder joins a second conductive pattern of a flexible substrate with a third conductive pattern of a print substrate. Additionally, it joins a second ground pattern of the flexible substrate with a third ground pattern of the print substrate. A through hole passes through the flexible substrate and connects the first and second ground patterns together. In the extension direction of the second conductive pattern, the end portion of a solder joint portion between the second conductive pattern and the third conductive pattern is positioned corresponding to the through hole but shifted from the end portion of the through hole.

  • Solder is used to connect conductive patterns of flexible and print substrates.
  • Ground patterns of the substrates are also joined using solder.
  • A through hole facilitates the connection of ground patterns.
  • The solder joint portion is strategically positioned in relation to the through hole.
  • The innovation allows for secure and reliable connections between substrates.

Potential Applications: - Electronics manufacturing - Printed circuit board assembly - Flexible electronics production

Problems Solved: - Ensuring strong connections between different substrates - Facilitating efficient grounding in electronic devices

Benefits: - Improved reliability in electronic connections - Enhanced performance of electronic devices - Simplified manufacturing processes

Commercial Applications: Title: Advanced Soldering Technology for Electronics Manufacturing This technology can be utilized in the production of various electronic devices, such as smartphones, tablets, and wearables. It can streamline manufacturing processes and improve the overall quality and performance of electronic products.

Questions about the technology: 1. How does this soldering technology differ from traditional methods? 2. What are the specific advantages of using this innovative soldering technique?

Frequently Updated Research: Researchers are constantly exploring new materials and techniques to enhance soldering processes in electronics manufacturing. Stay updated on the latest advancements in soldering technology for improved electronic device performance.


Original Abstract Submitted

solder () joins together a second conductive pattern () of a flexible substrate () and a third conductive pattern () of a print substrate () and joins together a second gnd pattern () of the flexible substrate () and a third gnd pattern () of the print substrate (). a through hole () passes through the flexible substrate () and connects the first and second gnd patterns () together. in an extension direction in which the second conductive pattern () extends, an end portion of a solder joint portion between the second conductive pattern () and the third conductive pattern () is in a position corresponding to the through hole () and is shifted from an end portion of the through hole ().

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