Mitsubishi electric corporation (20240297104). POWER SEMICONDUCTOR DEVICE simplified abstract

From WikiPatents
Jump to navigation Jump to search

POWER SEMICONDUCTOR DEVICE

Organization Name

mitsubishi electric corporation

Inventor(s)

Daisuke Oya of Tokyo (JP)

Yukimasa Hayashida of Fukuoka (JP)

Tetsuo Motomiya of Tokyo (JP)

POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240297104 titled 'POWER SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a power semiconductor device that allows for a reduction in module size by optimizing the layout of its components.

  • The device includes emitter main electrodes in multiple semiconductor chips.
  • Main electrode emitter sense terminals are directly connected to the emitter main electrodes and are partially exposed outside the module.
  • The sense terminals are positioned diagonally to each other, with a shorter distance to the connected main electrodes compared to the distance between the sense terminals in a plan view outside the module.

Key Features and Innovation

  • Optimization of component layout for downsizing the module.
  • Direct connection of sense terminals to emitter main electrodes.
  • Diagonal positioning of sense terminals for efficient space utilization.

Potential Applications

The technology can be applied in various power semiconductor devices where size reduction is a priority, such as in automotive electronics, renewable energy systems, and industrial machinery.

Problems Solved

  • Enables downsizing of power semiconductor modules.
  • Improves efficiency in component layout design.
  • Enhances space utilization within the device.

Benefits

  • Compact and efficient power semiconductor devices.
  • Improved performance due to optimized layout.
  • Cost-effective manufacturing processes.

Commercial Applications

Potential commercial applications include power electronics for electric vehicles, solar inverters, and motor drives. The technology can benefit manufacturers looking to enhance the performance and reduce the size of their products.

Prior Art

Readers interested in prior art related to this technology can explore patents in the field of power semiconductor devices, particularly those focusing on module size reduction and component layout optimization.

Frequently Updated Research

Researchers in the field of power electronics and semiconductor devices may be conducting studies on further optimizing component layouts for improved efficiency and performance. Stay updated on relevant publications and conferences in this area.

Questions about Power Semiconductor Device

How does the layout optimization in the power semiconductor device contribute to downsizing the module?

The layout optimization ensures efficient use of space within the device, allowing for a more compact design and ultimately reducing the overall size of the module.

What are the potential applications of the power semiconductor device in different industries?

The power semiconductor device can be utilized in various industries such as automotive, renewable energy, and industrial sectors for applications requiring compact and efficient power electronics solutions.


Original Abstract Submitted

an object of the present invention is to provide a power semiconductor device enabling a downsizing of a module. a power semiconductor device according to the present invention includes: emitter main electrodes each provided in each of a plurality of semiconductor chips; and main electrode emitter sense terminals directly connected to each of the emitter main electrodes and partially exposed outside a module, wherein each of the main electrode emitter sense terminals is located diagonally to each other, and a distance from each of the main electrode emitter sense terminals to each of the emitter main electrodes connected to each of the main electrode emitter sense terminals is smaller than a distance between the main electrode emitter sense terminals in a plan view outside the module.