Mitsubishi electric corporation (20240282650). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282650 titled 'SEMICONDUCTOR DEVICE
The patent application describes a board with a cavity region and a semiconductor chip mounted on a back-side conductor, covered by a mold material to prevent failures and reduce warpage.
- Board with a cavity region and opening on the front side
- Back-side conductor forming the bottom portion of the cavity region
- Semiconductor chip mounted on the back-side conductor
- Mold material covering the semiconductor chip and the board
- Mold material interconnected through at least one hole in the board to prevent failures and reduce warpage
Potential Applications: - Electronic devices - Semiconductor packaging - Integrated circuits
Problems Solved: - Preventing failures such as deformation and cracks in the board - Reducing warpage to prevent peeling of the mold material
Benefits: - Improved reliability of electronic devices - Enhanced durability of semiconductor packaging - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be used in the production of various electronic devices, such as smartphones, tablets, and computers, to improve their performance and longevity. It can also benefit semiconductor manufacturers looking to enhance the durability of their products in the market.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the reliability of electronic devices? This technology enhances the reliability of electronic devices by preventing failures such as deformation and cracks in the board, ensuring the longevity of the products. 2. What are the potential commercial applications of this semiconductor packaging technology? This semiconductor packaging technology can be applied in various industries, including consumer electronics, automotive, and telecommunications, to enhance the durability and performance of electronic devices.
Original Abstract Submitted
provided here are: a board; a cavity region therein having an opening created on a front side of a central portion of the board; a back-side conductor that is formed for the board to provide a bottom portion of the cavity region; a semiconductor chip mounted on the back-side conductor; and a mold material that covers the semiconductor chip and the board; wherein the mold material has a portion on the front side of the board and a portion on the back side thereof that are interconnected through at least one hole provided in the board, thereby to prevent failures such as a deformation, a crack, etc. of the board; and to reduce the warpage of the board to prevent the mold material from being peeled off therefrom.
