Mitsubishi electric corporation (20240266263). SEMICONDUCTOR APPARATUS simplified abstract
SEMICONDUCTOR APPARATUS
Organization Name
mitsubishi electric corporation
Inventor(s)
Kosuke Yamaguchi of Tokyo (JP)
SEMICONDUCTOR APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266263 titled 'SEMICONDUCTOR APPARATUS
The semiconductor apparatus described in the patent application consists of multiple integrated circuits mounted on an IC frame, along with a sealing material. The IC frame includes three protrusions: a first protrusion extending in the longitudinal direction of the frame, a second protrusion on the opposite side extending in the opposite direction, and a third protrusion perpendicular to the longitudinal direction incorporated in the sealing material.
- The semiconductor apparatus includes an IC frame with multiple integrated circuits and a sealing material.
- The IC frame features three protrusions: a first and second protrusion extending in opposite directions along the frame's length, and a third protrusion perpendicular to the frame's length.
- The third protrusion is integrated into the sealing material for added stability and protection.
Potential Applications: - This technology can be used in various electronic devices that require multiple integrated circuits to be securely mounted and sealed. - It can be applied in industries such as telecommunications, automotive, and consumer electronics for improved performance and durability.
Problems Solved: - Ensures the secure mounting and protection of multiple integrated circuits within the semiconductor apparatus. - Provides stability and reliability to electronic devices by incorporating the third protrusion into the sealing material.
Benefits: - Enhanced protection and stability for integrated circuits. - Improved performance and durability of electronic devices. - Simplified manufacturing process for semiconductor apparatus.
Commercial Applications: Title: "Enhanced Semiconductor Apparatus for Improved Electronic Device Performance" This technology can be commercially utilized in the production of various electronic devices, leading to enhanced performance, durability, and reliability. Industries such as telecommunications, automotive, and consumer electronics can benefit from the improved semiconductor apparatus.
Questions about the technology: 1. How does the incorporation of the third protrusion into the sealing material enhance the stability of the semiconductor apparatus? 2. What specific advantages does the IC frame with multiple integrated circuits offer compared to traditional semiconductor designs?
Original Abstract Submitted
according to the present disclosure, a semiconductor apparatus comprises a plurality of integrated circuits, an ic frame on which the plurality of integrated circuits are mounted, and a sealing material. the ic frame comprises a first protrusion extending in a longitudinal direction of the ic frame, a second protrusion positioned on the opposite side to the first protrusion in the ic frame and extending in an opposite direction to the first protrusion, and a third protrusion extending in a direction perpendicular to the longitudinal direction of the ic frame and incorporated in the sealing material.
