Mitsubishi electric corporation (20240258188). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Seiichiro Inokuchi of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258188 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The patent application describes a technique to suppress a crack that reaches a semiconductor element in a semiconductor device.
Key Features and Innovation:
- Semiconductor device with a semiconductor element, lead electrode terminal, first sealing member, and intervening member.
- Lead electrode terminal bonded to the semiconductor element with an extending portion.
- First sealing member seals the lead electrode terminal.
- Intervening member placed between the extending portion and the semiconductor element to suppress cracks.
Potential Applications: This technology can be applied in various semiconductor devices to prevent cracks from reaching the semiconductor element, ensuring the device's reliability and longevity.
Problems Solved: The technology addresses the issue of cracks reaching the semiconductor element, which can lead to device failure and reduced performance.
Benefits:
- Enhanced reliability of semiconductor devices.
- Increased lifespan of semiconductor components.
- Improved overall performance of electronic devices.
Commercial Applications: The technology can be utilized in the manufacturing of various electronic devices, such as smartphones, computers, and automotive electronics, to enhance their durability and performance.
Prior Art: Researchers can explore prior patents related to semiconductor device packaging and crack suppression techniques to understand the existing knowledge in this field.
Frequently Updated Research: Researchers may find updated studies on semiconductor packaging materials and techniques to further improve crack suppression methods in semiconductor devices.
Questions about Semiconductor Crack Suppression: 1. What are the key components of the crack suppression technique described in the patent application? 2. How does the intervening member help in preventing cracks from reaching the semiconductor element?
Original Abstract Submitted
an object is to provide a technique capable of suppressing a crack that reaches a semiconductor element. a semiconductor device includes a semiconductor element, a lead electrode terminal, a first sealing member, and an intervening member. the lead electrode terminal has an extending portion separated from an upper surface of the semiconductor element, and is bonded to the semiconductor element. the first sealing member seals the lead electrode terminal. the intervening member is provided between an end portion of the extending portion in an extending direction and the semiconductor element. the intervening member has an interface with the first sealing member under the end portion.
