Mitsubishi electric corporation (20240258134). SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS
Organization Name
mitsubishi electric corporation
Inventor(s)
Masayuki Nishiyama of Tokyo (JP)
Naoki Yoshimatsu of Tokyo (JP)
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258134 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS
The semiconductor manufacturing apparatus described in the patent application includes a semiconductor module with a semiconductor device, a sealing material to seal the module, and a second terminal located outside the sealing material. The semiconductor module also features a first terminal connected to the semiconductor device and extending outside the sealing material, with the first terminal being joined to the second terminal outside the sealing material. The thickness of the second terminal is greater than the thickness of the first terminal.
- The semiconductor module contains a semiconductor device and a sealing material for protection.
- The first terminal is electrically connected to the semiconductor device and extends outside the sealing material.
- The second terminal is located outside the sealing material and is thicker than the first terminal.
- The first terminal is joined to the second terminal outside the sealing material.
- This design ensures proper electrical connections and protection for the semiconductor device.
Potential Applications: - Semiconductor manufacturing industry - Electronics manufacturing - Research and development in semiconductor technology
Problems Solved: - Ensures proper electrical connections in semiconductor modules - Provides protection for semiconductor devices - Enhances overall reliability of semiconductor manufacturing processes
Benefits: - Improved electrical connectivity - Enhanced protection for semiconductor devices - Increased reliability in semiconductor manufacturing
Commercial Applications: Title: "Advanced Semiconductor Manufacturing Apparatus for Enhanced Reliability" This technology can be used in semiconductor manufacturing plants to improve the quality and reliability of semiconductor devices. It can also be utilized in electronics manufacturing companies to enhance the performance of electronic components.
Questions about the technology: 1. How does the thickness of the second terminal impact the overall performance of the semiconductor module? 2. What are the specific advantages of having the first terminal joined to the second terminal outside the sealing material?
Original Abstract Submitted
a semiconductor manufacturing apparatus of the present disclosure includes a semiconductor module having a semiconductor device, a sealing material adapted to seal the semiconductor module, and a second terminal to be arranged outside the sealing material. the semiconductor module includes a first terminal electrically connected to the semiconductor device and extending to the outside of the sealing material. the first terminal is joined to the second terminal outside the sealing material. the thickness of the second terminal in a direction perpendicular to a joined face of the first terminal and the second terminal is defined as the thickness of the second terminal. the thickness of the first terminal at a portion extending from the sealing material in the direction perpendicular to the joined face is defined as the thickness of the first terminal. the thickness of the second terminal is greater than the thickness of the first terminal.
