Mitsubishi electric corporation (20240234348). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Junichi Yamashita of Tokyo (JP)
Tomohide Terashima of Tokyo (JP)
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234348 titled 'SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract aims to improve reliability and extend the lifespan of the device while minimizing production costs.
- The semiconductor device consists of a semiconductor element, a top electrode on the upper surface of the semiconductor element, and a conductive metal plate solid-state diffusion bonded to the top electrode, containing copper as the main component.
Key Features and Innovation:
- Integration of a conductive metal plate containing copper as the main component to enhance reliability and lifespan of the semiconductor device.
- Solid-state diffusion bonding technique used to connect the metal plate to the top electrode of the semiconductor element.
- Cost-effective solution to suppress an increase in production costs.
Potential Applications:
- Power electronics
- Automotive industry
- Consumer electronics
Problems Solved:
- Enhances reliability and lifespan of semiconductor devices
- Minimizes production costs
Benefits:
- Improved reliability
- Extended lifespan
- Cost-effective solution
Commercial Applications:
- Power semiconductor devices
- Electronic components manufacturing
Questions about Semiconductor Device with Copper Metal Plate: 1. How does the integration of a copper metal plate improve the reliability of the semiconductor device? 2. What are the potential cost savings associated with using this technology?
Frequently Updated Research: Research on the use of copper in semiconductor devices for improved performance and reliability is ongoing. Stay updated on the latest advancements in this field for potential future applications.
Original Abstract Submitted
provided is a semiconductor device with higher reliability and longer life which can suppress an increase in production costs. a semiconductor device includes: a semiconductor element; a top electrode on an upper surface of the semiconductor element; and a conductive metal plate containing copper as a main component and solid-state diffusion bonded to the top electrode of the semiconductor element.
