Mitsubishi electric corporation (20240234271). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Fumihito Kawahara of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234271 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a technique to prevent peeling of a sealing resin used to seal a semiconductor element in a semiconductor device. The distance between the semiconductor element and surrounding metal wires is greater than the thickness of the semiconductor element.
- The patent application focuses on preventing peeling of a sealing resin in semiconductor devices.
- It involves maintaining a specific distance between the semiconductor element and surrounding metal wires.
- The technique is simple yet effective in ensuring the integrity of the sealing resin.
Potential Applications: The technology described in this patent application can be applied in various semiconductor devices where sealing resins are used to protect semiconductor elements.
Problems Solved: This technology addresses the issue of peeling of sealing resins in semiconductor devices, which can lead to damage and malfunction of the semiconductor elements.
Benefits: The benefits of this technology include improved reliability and longevity of semiconductor devices by preventing peeling of the sealing resin.
Commercial Applications: Potential commercial applications of this technology include the manufacturing of more reliable and durable semiconductor devices for various industries such as electronics, automotive, and telecommunications.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of semiconductor packaging and reliability.
Frequently Updated Research: Researchers in the field of semiconductor packaging and reliability may have ongoing studies related to preventing peeling of sealing resins in semiconductor devices.
Questions about Semiconductor Device Sealing: 1. How does the distance between the semiconductor element and surrounding metal wires affect the peeling of the sealing resin? 2. What are the key factors to consider in preventing peeling of sealing resins in semiconductor devices?
Original Abstract Submitted
an object is to provide a technique that suppresses peeling of a sealing resin that seals a semiconductor element by a simple method. a semiconductor device includes an insulating substrate provided with a front surface metal pattern a front surface thereof, a semiconductor element mounted on the front surface metal pattern, a wiring wire connected to the front surface electrode of the semiconductor element, a sealing resin that seals the insulating substrate and the semiconductor element, and at least one metal wire arranged around the semiconductor elements on and along the front surface metal pattern. the distance between the semiconductor element and the at least one metal wire is greater than the thickness of the semiconductor element.
