Mitsubishi electric corporation (20240234260). POWER SEMICONDUCTOR DEVICE simplified abstract
Contents
POWER SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Keitaro Ichikawa of Tokyo (JP)
POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234260 titled 'POWER SEMICONDUCTOR DEVICE
The power semiconductor device described in the abstract consists of a conductor plate, an insulator, a lead frame, a first mold package with semiconductor elements, and a second mold package.
- The device has a unique structure with the lead frame having terminals protruding from one side of the first mold package.
- The terminals are arranged in a staggered pattern on the front surface of the second mold package.
- The device is resin-sealed to protect the semiconductor elements and ensure proper functioning.
Potential Applications: - Power electronics - Renewable energy systems - Electric vehicles
Problems Solved: - Ensures proper insulation and protection of semiconductor elements - Facilitates efficient power distribution
Benefits: - Enhanced durability and reliability - Improved performance in power applications
Commercial Applications: Title: Advanced Power Semiconductor Device for Enhanced Efficiency in Power Electronics This technology can be utilized in various industries such as renewable energy, electric vehicles, and industrial automation for improved power management and distribution.
Questions about the technology: 1. How does the unique structure of the device contribute to its efficiency in power applications? 2. What are the potential cost savings associated with using this power semiconductor device in industrial settings?
Original Abstract Submitted
a power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
