Mitsubishi Electric Corporation patent applications on September 19th, 2024
Patent Applications by Mitsubishi Electric Corporation on September 19th, 2024
Mitsubishi Electric Corporation: 22 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L29/739 (2), F25B49/02 (2), H01L29/66 (1), G08G5/04 (1), G08G5/00 (1) H01L29/7397 (2), F25B49/02 (2), B29C65/002 (1), G08G5/045 (1), H02P29/0243 (1)
With keywords such as: layer, semiconductor, unit, refrigerant, value, current, device, information, object, and route in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Tatsuya KITAGAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B29C65/00, B29K61/00, B32B15/08, B32B17/10
CPC Code(s): B29C65/002
Abstract: a manufacturing method for a bonded body of different materials includes a coating process of coating a surface of a base material of an inorganic material including metal or glass with a coupling agent solution, an irradiation process of forming a binding layer in which the base material and coupling agent molecules in the coupling agent solution are bonded through covalent bond by irradiating the surface of the base material coated with the coupling agent solution with a laser while a position of the laser is sequentially changed, a cleaning process of cleaning the coupling agent solution that is not covalently bonded to the base material, and a resin bonding process of bonding the binding layer and a resin.
Inventor(s): Hisayuki MUKAE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B64G1/10, B64G1/24, H04B7/185
CPC Code(s): B64G1/1085
Abstract: there is provided a method for detecting flying object launching using a surveillance system and a communication system and transmitting flying object information to a coping system in quasi-real time.
Inventor(s): Hisayuki MUKAE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B64G1/10, B64G1/24, H04B7/185
CPC Code(s): B64G1/1085
Abstract: a plurality of satellite constellation business apparatuses () which manage individual satellite constellations, each having eight or more communication satellites () on one orbital plane (), are present. all of the individual satellite constellations form a satellite constellation () which is a unified satellite constellation with eight or more orbital planes. communication satellites () on a same orbital plane each form cross-links with communication satellites ahead and behind. communication satellites on adjacent orbital planes each form cross-links with communication satellites in left and right adjacent orbits. the plurality of satellite constellation business apparatuses () construct a total of n orbital planes () and form a mesh communication network in collaboration.
Inventor(s): Yusuke YOKOSUKA of Tokyo (JP) for mitsubishi electric corporation, Daisuke IIZAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/63, F24F11/52, F24F140/50
CPC Code(s): F24F11/63
Abstract: a factor identification device includes: an information acquiring unit that acquires, from an appliance control unit that determines a future control content with respect to an appliance to be controlled, physical quantity information indicating a physical quantity of an environment in which the appliance to be controlled is disposed, the physical quantity information being used in a final step of determining the control content among a plurality of steps included in a process of determining the control content; a determination factor identifying unit that identifies a determination factor of the control content determined by the appliance control unit on the basis of the physical quantity indicated by the physical quantity information acquired by the information acquiring unit; and a display data generating unit that generates display data for displaying the determination factor identified by the determination factor identifying unit and outputs the display data.
20240310092. REFRIGERATION CYCLE APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Soichiro KOSHI of Tokyo (JP) for mitsubishi electric corporation, Takuya MATSUDA of Tokyo (JP) for mitsubishi electric corporation, Hiroki ISHIYAMA of Tokyo (JP) for mitsubishi electric corporation, Yusuke TASHIRO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B41/22, F25B13/00
CPC Code(s): F25B41/22
Abstract: a refrigeration cycle apparatus includes a compressor, a first heat exchanger, a second heat exchanger, a third heat exchanger, an expansion device, a gas-liquid separator, a first flow rate control device, and a switch device configured to switch a route in which refrigerant circulates between a first route and a second route. in the first route, the refrigerant flows in order of the compressor, the first heat exchanger, the expansion device, the second heat exchanger, and the gas-liquid separator, and then, the refrigerant in liquid state discharged from the gas-liquid separator flows into the third heat exchanger. in the second route, the refrigerant flows in order of the compressor, the second heat exchanger, and the gas-liquid separator, and then, the refrigerant in gaseous state discharged from the gas-liquid separator flows through the first flow rate control device into the third heat exchanger.
Inventor(s): Atsushi TAKAHASHI of Tokyo (JP) for mitsubishi electric corporation, Satoru YANACHI of Tokyo (JP) for mitsubishi electric corporation, Hiroki ISHIYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B41/42, F28F1/02, F28F9/02
CPC Code(s): F25B41/42
Abstract: a refrigerant distributor includes: an outer tube to which a heat transfer tube is connected; and an inner tube accommodated in the outer tube and having a dispersion hole that allows refrigerant to flow to the outer tube. the inner tube has an inner wall on which a projection is formed to extend in an extending direction of the inner tube. a plurality of projections including the projection are formed on the inner wall of the inner tube and arranged in a circumferential direction of the inner tube.
20240310096. REFRIGERATION CYCLE APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Satoru YANACHI of Tokyo (JP) for mitsubishi electric corporation, Naoki BARADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B49/02, F25B41/31
CPC Code(s): F25B49/02
Abstract: a refrigeration cycle apparatus includes a compressor, a first heat exchanger, an expansion valve in which refrigerant flows from the first heat exchanger, a second heat exchanger having a plurality of heat transfer tubes and a header, a first refrigerant pipe connecting the expansion valve with a refrigerant inlet of the header, a second refrigerant pipe connecting the second heat exchanger with a refrigerant suction inlet of the compressor, a bypass circuit having a bypass inlet connected to the header at a position different from that of the refrigerant inlet of the header and a bypass outlet connected to the second refrigerant pipe, a bypass valve configured to make a pressure of the refrigerant in the bypass circuit lower than a pressure of the refrigerant in the header, and a refrigerant circuit auxiliary unit configured to deliver gas-phase refrigerant from the bypass circuit to the bypass outlet.
Inventor(s): Shun KATO of Tokyo (JP) for mitsubishi electric corporation, Hirotoshi YANO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B49/02, F24F11/30
CPC Code(s): F25B49/02
Abstract: an equipment management system includes: a plurality of equipments each having a refrigerant; an acquisition unit configured to acquire from each of the plurality of equipments, measurement information indicating a result of measuring a temperature of the refrigerant in the equipment, electrical characteristics of the equipment, and environmental information around the equipment; an estimation unit configured to estimate an amount of the refrigerant in each of the plurality of equipments, based on the measurement information acquired by the acquisition unit, equipment information on the equipment and equipment installation information on an installation environment of the equipment, the equipment information and the equipment installation information being preset; and a data management unit configured to cause a storage to store the amount of the refrigerant in each of the plurality of equipments estimated by the estimation unit in association with a refrigerant type.
Inventor(s): Shunya Osawa of Tokyo (JP) for mitsubishi electric corporation, Keigo Kawashima of Tokyo (JP) for mitsubishi electric corporation, Masato Tsuchiya of Tokyo (JP) for mitsubishi electric corporation, Satoru Furuta of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01C21/34, G01C21/36, G06Q10/0832
CPC Code(s): G01C21/3415
Abstract: an operation route updating device updates an operation route of a mobile object loaded with a package. a score calculation unit calculates a package score that quantifies fragility of the package based on package information representing a state of the package while the mobile object is traveling on the operation route. the score calculation unit further calculates a route score that quantifies a shaking degree of the mobile object on a scheduled operation route based on surrounding area information representing an environment and a road situation of a surrounding area of the scheduled operation route in the operation route. when the package score is equal to or greater than a first set value, a route updating unit creates the scheduled operation route with the route score of less than a second set value, and updates the operation route with the scheduled operation route that has been created.
20240310519. DISTANCE MEASURING APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Natsuki HONDA of Tokyo (JP) for mitsubishi electric corporation, Masayuki OMAKI of Tokyo (JP) for mitsubishi electric corporation, Shota NAKAHARA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01S17/08, G01S7/481
CPC Code(s): G01S17/08
Abstract: the distance measuring apparatus detects return light reflected off or scattered by an object and measures a distance to the object. the distance measuring apparatus includes a laser light source, an optical scanning unit to scan with outgoing light emitted from the laser light source, a light receiving unit to detect the return light, which is reflected off the object irradiated with the outgoing light from the optical scanning unit, reflected off the optical scanning unit, a light-path guiding unit to direct the outgoing light emitted from the laser light source toward the optical scanning unit, and a first aperture to make a diameter of the outgoing light small and disposed on an optical path, from the laser light source to the light-path guiding unit, of the outgoing light.
Inventor(s): Tokiharu MIYOSHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G05B19/05
CPC Code(s): G05B19/058
Abstract: an engineering tool includes a current consumption information storage, a receiver, and a display. the current consumption information storage stores a value of a current consumed by a unit included in a programmable logic controller or plc and having a function that is capable of being disabled. the value of the current is a value of a current consumed by the unit with the function being disabled. the receiver receives an operation for disabling the function. the display acquires, from the current consumption information storage, the value of the current consumed by the unit with the function being disabled and displays the acquired value.
Inventor(s): Masashi FUKUNAGA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06T7/579, G01S7/495, G01S17/86, G01S17/89, G06T7/73
CPC Code(s): G06T7/579
Abstract: a slam device () performs slam using first three-dimensional point cloud data based on measurement point cloud data from a lidar sensor (). the slam device recognizes a feature object in an image indicated in image data from a camera (), and calculates a relative distance from the camera to the feature object. the slam device superimposes a three-dimensional point cloud indicated in second three-dimensional point cloud data based on the image data onto the generated map so as to calculate a comparative distance from an estimated location on the map to the feature object, and when a difference between the comparative distance and the relative distance is a value outside an allowable range, performs interpolation for the slam using the second three-dimensional point cloud data.
Inventor(s): Shoji YOSHIKAWA of Tokyo (JP) for mitsubishi electric corporation, Masanori KAWAMURA of Tokyo (JP) for mitsubishi electric corporation, Akihiko HONDA of Tokyo (JP) for mitsubishi electric corporation, Eiji YOKOYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06V20/13, G06V10/22, G06V10/60, G06V10/74
CPC Code(s): G06V20/13
Abstract: an image processing device includes a target image acquirer that acquires a target image, a target index value calculator that calculates a target index value for a subregion that is a portion of the target image, a material image acquirer that acquires material images arranged in chronological order, an index value calculator that calculates, in chronological order, an index value for a material subregion that is a portion of the material images, a cycle pattern generator that generates a cycle pattern fitting a chronological change in the calculated index value, and a change detector that calculates a correction index value that is a value in the-cycle pattern at a capturing date and time at which the target image is captured, and determines that a change occurs in the material subregion when a difference between the target index value and the correction index value is greater than a threshold.
Inventor(s): Jun MINAGAWA of Tokyo (JP) for mitsubishi electric corporation, Shohei SHINTA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G08G5/04, G08G5/00, G08G5/06
CPC Code(s): G08G5/045
Abstract: a display control device acquires a first predicted trajectory of a selected mobile object and a plurality of second predicted trajectories, estimates an abnormal approach mobile object as a mobile object having a period in which a distance from the selected mobile object is less than or equal to a predetermined reference value out of the plurality of relevant mobile objects and estimates the position of the abnormal approach mobile object in the abnormal approach period, and makes a display device display a two-dimensional coordinate system formed by a first coordinate axis representing a position in the first predicted trajectory by a distance from a start point and a second coordinate axis representing a time and a line indicating the first predicted trajectory and to make the display device display an enhanced display component that indicates the position of the abnormal approach mobile object in the abnormal approach period.
Inventor(s): Kyohei AKIYOSHI of Tokyo (JP) for mitsubishi electric corporation, Yosuke NAKANISHI of Tokyo (JP) for mitsubishi electric corporation, Masaru YAMADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L21/67, H01L21/683
CPC Code(s): H01L21/67092
Abstract: according to the present disclosure, a method for manufacturing a semiconductor apparatus bonds a ring-shaped frame to an outer peripheral portion of a wafer, and comprises the steps of installing one of the wafer and the frame on a stage, holding another of the wafer and the frame in a chuck part in a pressure-bonding mechanism, activating a surface layer of the outer peripheral portion of the wafer and a surface layer of the frame by atom irradiation, and sandwiching the wafer and the frame between the stage and the chuck part and pressure-bonding the activated surface layers of the wafer and the frame using the pressure-bonding mechanism. an amorphous layer is formed on a bonding interface between the wafer and the frame pressure-bonded to each other.
Inventor(s): Yusuke KUSAKABE of Tokyo (JP) for mitsubishi electric corporation, Yoshihisa UCHIDA of Tokyo (JP) for mitsubishi electric corporation, Tatsunori YANAGIMOTO of Tokyo (JP) for mitsubishi electric corporation, Kazutaka IKEDA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/495, H01L23/00, H01L23/053
CPC Code(s): H01L23/49544
Abstract: provided is a semiconductor device having a structure of directly bonding a lead electrode to a semiconductor element through a bonding layer, in which whether the bonding layer has a predetermined thickness can be checked through a visual inspection. the semiconductor device includes: a semiconductor element mounted on an insulating substrate or a lead frame; a bonding layer on the semiconductor element; and a lead electrode including a main body plate electrically connected to an external electrode, and a cantilevered plate having one end being connected to the main body plate as a connection part, and being cut from the main body plate, wherein the cantilevered plate is bent in a direction of the semiconductor element with respect to the main body plate, and has an other end embedded in the bonding layer, and the bonding layer covers at least a part of an upper surface of the cantilevered plate.
Inventor(s): Koichiro NISHIZAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/532, H01L21/768
CPC Code(s): H01L23/53238
Abstract: the present disclosure relates to a semiconductor device and a method for manufacturing the same, and an object thereof is to provide a semiconductor and a method for manufacturing the same, the semiconductor device not diffusing a material of a metal layer to a semiconductor substrate. a semiconductor device of the present disclosure includes a semiconductor substrate which is formed of gaas, a first barrier layer which is formed of an alloy containing ni on the semiconductor substrate, a second barrier layer which is formed of co or an alloy containing co on the first barrier layer, and a metal layer which is formed on the second barrier layer. a ni concentration in the first barrier layer is 80 at % or lower.
Inventor(s): Ayanori GATTO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/739, H01L21/265, H01L29/66
CPC Code(s): H01L29/7397
Abstract: a semiconductor device includes: a semiconductor substrate; a first semiconductor layer and a second semiconductor layer located in a surface layer of the semiconductor substrate to be excluded from each other; a third semiconductor layer located on an opposite side of the first semiconductor layer and the second semiconductor layer from the semiconductor substrate; a fourth semiconductor layer and a fifth semiconductor layer located on an opposite side of the third semiconductor layer from the semiconductor substrate to be excluded from each other; and a first electrode, a second electrode, and a third electrode each having an insulating surface, and the first electrode extends through the fifth semiconductor layer, and the third semiconductor layer to reach the first semiconductor layer.
20240313095. RC-IGBT_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shinya SONEDA of Tokyo (JP) for mitsubishi electric corporation, Koichi NISHI of Tokyo (JP) for mitsubishi electric corporation, Kazuya KONISHI of Tokyo (JP) for mitsubishi electric corporation, Kohei EBIHARA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/739, H01L27/06, H01L29/06, H01L29/08, H01L29/10
CPC Code(s): H01L29/7397
Abstract: an rc-igbt includes a semiconductor substrate having a cell region, a wiring region, and a termination region. the semiconductor substrate includes a diffusion layer of a second conductivity type provided on a first main surface side of a drift layer in an igbt region, a diode region, the wiring region, and the termination region. the diffusion layer includes a base layer in the igbt region, an anode layer in the diode region, a wiring well layer in the wiring region, and a termination well layer in the termination region. a depth of the base layer is less than depths of a plurality of trench gates, and is equal to or more than depths of the anode layer, the wiring well layer, and the termination well layer.
20240313543. DIRECT CURRENT CIRCUIT BREAKER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takashi INAGAKI of Tokyo (JP) for mitsubishi electric corporation, Sho TOKOYODA of Tokyo (JP) for mitsubishi electric corporation, Kenji KAMEI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02J3/36
CPC Code(s): H02J3/36
Abstract: a direct current circuit breaker includes a first breaking unit and a second breaking unit. the first breaking unit includes: a first circuit breaker inserted in a direct current line; and a resonance circuit unit that generates a resonance current. the first breaking unit forms a current zero point by superimposing the resonance current on a direct current flowing through the direct current line, and breaks the direct current by opening the first circuit breaker. the second breaking unit includes a semiconductor element, allows the direct current to flow when energization of the semiconductor element is on, and breaks the direct current by switching energization of the semiconductor element from on to off.
Inventor(s): Guilherme BUENO MARIANI of RENNES Cedex 7 (FR) for mitsubishi electric corporation, Nicolas VOYER of RENNES Cedex 7 (FR) for mitsubishi electric corporation, Gianmario PELLEGRINO of TORINO (IT) for mitsubishi electric corporation, Anantaram VARATHARAJAN of TORINO (IT) for mitsubishi electric corporation
IPC Code(s): H02P21/14, H02P6/18, H02P21/18
CPC Code(s): H02P21/141
Abstract: a method and a device inject a high frequency current vector which has a fixed angle with the measured current vector flowing in the machine. the method: measures the motor current vector, determines a projection value of the motor current on an axis that is orthogonal to a direction having the fixed angle with the measured current vector, demodulates the high frequency variations of the projection value using a first high frequency demodulation signal, determines at least a first angle from the demodulated high frequency variation, determines the injection voltage vector at least from the first angle, a predetermined voltage and a second high frequency modulating signal, the second high frequency modulating signal having the same frequency as the first high frequency demodulating signal and a phase difference with the first high frequency demodulating signal that is equal to �/2.
Inventor(s): Kento OGIWARA of Tokyo (JP) for mitsubishi electric corporation, Chiaki FUJIMOTO of Tokyo (JP) for mitsubishi electric corporation, Seiji SAWADA of Tokyo (JP) for mitsubishi electric corporation, Yuta MAEDA of Kobe-shi (JP) for mitsubishi electric corporation, Motohiro NORIKAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02P29/024, B62D5/04, H02P29/028
CPC Code(s): H02P29/0243
Abstract: a motor control device includes: a motor driver configured to supply electric power to a motor having windings of a plurality of phases, the motor driver including, for each phase of the plurality of phases, an upper drive element and a lower drive element which are connected in series; a motor terminal voltage detector configured to detect a motor terminal voltage value based on a voltage of a motor terminal for each phase of the motor; a drive element fault determinator configured to perform fault determination for the upper drive elements and the lower drive elements, based on a voltage value across each drive element, and output a result of the fault determination; and a short/open-circuit fault determinator configured to, when the result of the fault determination output by the drive element fault determinator indicates that there is a fault, determine whether the fault is a short-circuit fault or an open-circuit fault, for the upper drive elements and the lower drive elements, based on the motor terminal voltage value detected by the motor terminal voltage detector.
20240314943. SUBSTRATE JOINING STRUCTURE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Hiromitsu ITAMOTO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H05K3/46, H05K1/14, H05K3/36
CPC Code(s): H05K3/4691
Abstract: solder () joins together a second conductive pattern () of a flexible substrate () and a third conductive pattern () of a print substrate () and joins together a second gnd pattern () of the flexible substrate () and a third gnd pattern () of the print substrate (). a through hole () passes through the flexible substrate () and connects the first and second gnd patterns () together. in an extension direction in which the second conductive pattern () extends, an end portion of a solder joint portion between the second conductive pattern () and the third conductive pattern () is in a position corresponding to the through hole () and is shifted from an end portion of the through hole ().
Mitsubishi Electric Corporation patent applications on September 19th, 2024
- Mitsubishi Electric Corporation
- B29C65/00
- B29K61/00
- B32B15/08
- B32B17/10
- CPC B29C65/002
- Mitsubishi electric corporation
- B64G1/10
- B64G1/24
- H04B7/185
- CPC B64G1/1085
- F24F11/63
- F24F11/52
- F24F140/50
- CPC F24F11/63
- F25B41/22
- F25B13/00
- CPC F25B41/22
- F25B41/42
- F28F1/02
- F28F9/02
- CPC F25B41/42
- F25B49/02
- F25B41/31
- CPC F25B49/02
- F24F11/30
- G01C21/34
- G01C21/36
- G06Q10/0832
- CPC G01C21/3415
- G01S17/08
- G01S7/481
- CPC G01S17/08
- G05B19/05
- CPC G05B19/058
- G06T7/579
- G01S7/495
- G01S17/86
- G01S17/89
- G06T7/73
- CPC G06T7/579
- G06V20/13
- G06V10/22
- G06V10/60
- G06V10/74
- CPC G06V20/13
- G08G5/04
- G08G5/00
- G08G5/06
- CPC G08G5/045
- H01L21/67
- H01L21/683
- CPC H01L21/67092
- H01L23/495
- H01L23/00
- H01L23/053
- CPC H01L23/49544
- H01L23/532
- H01L21/768
- CPC H01L23/53238
- H01L29/739
- H01L21/265
- H01L29/66
- CPC H01L29/7397
- H01L27/06
- H01L29/06
- H01L29/08
- H01L29/10
- H02J3/36
- CPC H02J3/36
- H02P21/14
- H02P6/18
- H02P21/18
- CPC H02P21/141
- H02P29/024
- B62D5/04
- H02P29/028
- CPC H02P29/0243
- H05K3/46
- H05K1/14
- H05K3/36
- CPC H05K3/4691
