Mitsubishi Electric Corporation patent applications on October 17th, 2024
Patent Applications by Mitsubishi Electric Corporation on October 17th, 2024
Mitsubishi Electric Corporation: 20 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L23/00 (2), H01L21/66 (2), H01L23/31 (2), H02M7/487 (1), F04D25/06 (1) B60L9/24 (1), H02K1/185 (1), H04W4/023 (1), H03K3/013 (1), H03F1/0288 (1)
With keywords such as: terminal, information, signal, semiconductor, portion, device, contact, unit, connected, and power in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
20240343121. DRIVE DEVICE FOR RAILWAY VEHICLE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takuya SUGIYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B60L9/24, B60L13/00
CPC Code(s): B60L9/24
Abstract: a drive device for a railway vehicle operates by receiving power supply from an alternating-current overhead contact line or a three-phase generator. the drive device for a railway vehicle is configured such that a voltage output from a main transformer is applied to alternating-current input ends in a converter circuit via a first switch. a first phase voltage among voltages output from the three-phase generator is applied to an alternating-current input end in a first leg of a brake chopper circuit via a second switch. second and third phase voltages among the voltages output from the three-phase generator are applied to the alternating-current input ends, respectively, via the second switch.
Inventor(s): Takuya YOSHIMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01R31/28, H01L21/66
CPC Code(s): G01R31/2881
Abstract: provided is a test apparatus for a semiconductor device which enhances the reliability of a test on electrical characteristics. the test apparatus includes a stage, a probe holder, probes, a wind protection wall, and a gas supply part. the stage is capable of holding a semiconductor wafer in which the semiconductor device is formed. the probe holder is disposed above the stage. the probes each include a tip contactable with the semiconductor device, and are held by the probe holder. the wind protection wall circumferentially surrounds the probes. the gas supply part is disposed outside the wind protection wall. the gas supply part supplies gas in a direction toward the stage. each of the probes includes an inner part closer to a base end than to the tip. the inner parts are contained in a wind protection space surrounded by the wind protection wall.
Inventor(s): Kohei KURIHARA of Tokyo (JP) for mitsubishi electric corporation, Yoshitaka TOYODA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01W1/00
CPC Code(s): G01W1/00
Abstract: an inundated area dividing unit divides an inundated area into one or more divided areas based on a boundary indicated in inundation estimation data indicating the boundary where a water level changes when inundation occurs. for each of the one or more divided areas, a water level calculation unit calculates the water level in a subject divided area, from an elevation of a boundary area of the subject divided area. a depth calculation unit calculates a flood depth at a subject point, from the elevation at the subject point and the water level in the divided area including the subject point.
Inventor(s): Susumu KOSEKI of Tokyo (JP) for mitsubishi electric corporation, Satoru TANAKA of Tokyo (JP) for mitsubishi electric corporation, Satoshi KAEDE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06F16/21, G06F16/2455
CPC Code(s): G06F16/214
Abstract: a data migration device () extracts, from a migration source database () in which node information managed in a target record and link information representing a link to another record are managed together in the same table, a record that can be traced based on the link information using origin data as a starting point, and writes the record to an intermediate table (). the data migration device () reads the record from the intermediate table, and separates data of the record into the node information and the link information. the data migration device () registers the node information and the link information that have been separated in a migration destination database () in which the node information and the link information are managed separately.
Inventor(s): Koki UENO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06V20/59, G06V10/70, G06V40/16
CPC Code(s): G06V20/597
Abstract: a reference value creating device includes processing circuitry configured to; vehicle-related information related to a vehicle; determine a road type of a road on which the vehicle is traveling on a basis of the acquired vehicle-related information; acquire feature amount information regarding a feature amount of an occupant of the vehicle calculated on a basis of a captured image including a range in which at least a face of the occupant of the vehicle is present; and create a reference value of the feature amount for estimating an alertness level of the occupant on a basis of the acquired feature amount information, and create, when the determined road type has changed, the reference value of the feature amount corresponding to the changed road type.
20240347294. VACUUM CIRCUIT BREAKER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shinpei NAKA of Tokyo (JP) for mitsubishi electric corporation, Yasunori NAKAMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01H33/42, H01H33/662, H01H33/666
CPC Code(s): H01H33/42
Abstract: a vacuum circuit breaker includes: a tank having a tubular shape; a vacuum valve including a movable contact, a stationary contact, a movable lead electrically connected to the movable contact, and a stationary lead electrically connected to the stationary contact, and accommodated in the tank; and a contact driver that opens and closes the movable contact and the stationary contact by moving the movable contact by a driving force transmitted from a manipulator. the contact driver includes a torsion bar spring that generates contact pressure that presses the movable contact against the stationary contact by being twisted by the driving force in a state where the movable contact and the stationary contact are in contact with each other.
20240347403. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takeshi HIGASHIHATA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/16, H01L23/00, H01L23/10, H01L23/14, H01L23/31, H01L23/36, H01L25/065, H01L29/16, H01L29/20
CPC Code(s): H01L23/16
Abstract: an insulation substrate () is provided on a beat dissipation plate (). a semiconductor chip () is mounted on the insulation substrate (). a case () is adhered to a peripheral portion of the heat dissipation plate () with a silicone adhesive () to surround the insulation substrate () and the semiconductor chip (). a wire bond () is provided on the heat dissipation plate () between an outer periphery of an insulation layer () in the insulation substrate () and an inner wall of the case ().
20240347420. HEATSINK AND SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Hiromichi MIURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/40
CPC Code(s): H01L23/4006
Abstract: a heatsink of the present disclosure includes a base having a heat dissipation surface that is thermally coupled to a heating element and dissipates heat from the heating element and a screw hole provided on the heat dissipation surface, and a screw screwed into the screw hole. a semiconductor device of the present disclosure includes the heatsink and a semiconductor module as the heating element.
Inventor(s): Toshifumi NAKAMURA of Tokyo (JP) for mitsubishi electric corporation, Akihiro SAWADA of Tokyo (JP) for mitsubishi electric corporation, Makoto MATSUMOTO of Tokyo (JP) for mitsubishi electric corporation, Kimihiko TANAYA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/495, H01L21/48, H02M1/00, H02M1/14
CPC Code(s): H01L23/49575
Abstract: this power conversion device includes cast resin provided at least between an inner wall of a storage portion and a smoothing capacitor and between the inner wall of the storage portion and a resistor, so as to be formed integrally, and heat dissipation and vibration protection for the smoothing capacitor and the resistor can be made by the cast resin. thus, a dedicated assembly process for a structure for heat dissipation and vibration protection for the resistor is not needed, so that the cost is reduced. in addition, reliability of heat dissipation and vibration protection for the discharge circuit is ensured more easily as compared to a conventional method of pressing only one surface of the resistor to the housing by means such as screw fastening.
20240347492. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shin CHAKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/00, H01L21/66, H01L23/29, H01L23/31, H01L23/367, H01L23/498
CPC Code(s): H01L24/16
Abstract: a semiconductor device includes: a multi-layer substrate; and a semiconductor chip mounted on the multi-layer substrate by flip-chip mounting and having an internal circuit, wherein plural pads are formed on a front surface of the semiconductor chip, plural pillars are respectively formed on the plural pads, plural upper-surface electrodes are formed on an upper surface of the multi-layer substrate, plural lower-surface electrodes are formed on a lower surface of the multi-layer substrate and are respectively connected with the plural upper-surface electrodes via through holes, the plural pillars are joined to the plural upper-surface electrodes by solder, the plural pads include an electrode pad connected with the internal circuit and plural inspection pads formed in at least three parts in four corners on the front surface of the semiconductor chip and not connected with the internal circuit, and a line connects the adjacent inspection pads with each other.
20240347924. ANTENNA DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shunichi Ikeda of Tokyo (JP) for mitsubishi electric corporation, Narihiro Nakamoto of Tokyo (JP) for mitsubishi electric corporation, Hiromasa Nakajima of Tokyo (JP) for mitsubishi electric corporation, Tomohiro Takahashi of Tokyo (JP) for mitsubishi electric corporation, Toru Fukasawa of Tokyo (JP) for mitsubishi electric corporation, Naoya Noguchi of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01Q15/24, H01Q1/52
CPC Code(s): H01Q15/24
Abstract: in a conventional antenna device, transmission radio waves transmitted from a transmitting antenna traveling directly to a receiving antenna are blocked by a shield wall disposed between the receiving antenna and the transmitting antenna. however, some of the transmission radio waves are diffracted at the edge of the shield wall and enter the receiving antenna as diffracted waves, affecting the reception of the reception radio waves. in view of this, the shield wall and a polarized wave converter unit are disposed between the transmitting antenna unit and the receiving antenna unit. as a result, vertically polarized wave components of the diffracted waves are converted by the polarized wave converter unit to circularly polarized wave components that are less affecting the reception of the reception radio waves in the receiving antenna, and the diffracted waves are prevented from affecting the receiving operation of the receiving antenna.
20240348112. ELECTRIC MOTOR, AND BLOWER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Kazuchika TSUCHIDA of Tokyo (JP) for mitsubishi electric corporation, Ryogo TAKAHASHI of Tokyo (JP) for mitsubishi electric corporation, Daisuke MORISHITA of Tokyo (JP) for mitsubishi electric corporation, Takaya SHIMOKAWA of Tokyo (JP) for mitsubishi electric corporation, Takanori WATANABE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K1/18, F04D25/06, F04D29/26, H02K1/14, H02K7/08, H02K21/16
CPC Code(s): H02K1/185
Abstract: a stator includes a stator core including a plurality of teeth, a plurality of magnetic flux capture members, and a resin to fix the magnetic flux capture members to end surfaces in an axial direction of the teeth respectively. the magnetic flux capture members, which are adjacent in a circumferential direction of the stator core, of the plurality of magnetic flux capture members are disposed in the circumferential direction with a first gap in between, and the first gap is filled with the resin.
Inventor(s): Hiroki IWATA of Tokyo (JP) for mitsubishi electric corporation, Tomoki MASUKO of Tokyo (JP) for mitsubishi electric corporation, Atsushi MATSUOKA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K1/276, F25B31/02, H02K21/14
CPC Code(s): H02K1/276
Abstract: a rotor core has a magnet insertion hole. the magnet insertion hole has a first hole portion located at a center thereof, and two second hole portions extending from both ends of the first hole portion toward the outer circumference of the rotor core. a first permanent magnet is disposed in the first hole portion, and a second permanent magnet is disposed in each second hole portion. the rotor core has a first slit formed between each second hole portion and the magnetic pole center line and having a length in the circumferential direction, and a second slit formed between the first slit and the magnetic pole center line and having a length in the radial direction. the shortest distance c [mm] from the first slit to the magnet insertion hole and the shortest distance s [mm] from the first slit to the outer circumference satisfy s≤−0.7517 c+0.2021 c+1.1395.
20240348174. POWER CONVERTER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yuya TAKAHASHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/335, H02M3/00
CPC Code(s): H02M3/33573
Abstract: this power converter includes: a board having a power supply terminal portion; a power module; a control circuit; and a transformer having a winding. the power module has an input terminal, an output terminal, and a control terminal. the power supply terminal portion and the input terminal are connected via the board, the control circuit and the control terminal are connected via the board, and the winding and the output terminal are connected not via the board. the winding has a wound portion, and a lead portion connected to the output terminal. a length in the lead portion from a body portion of the transformer in which the wound portion is stored to a connection portion between the output terminal and the lead portion is greater than a length in the output terminal from a body portion of the power module to the connection portion.
20240348181. POWER CONVERSION DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Mitsuru ISHIZUKA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M7/487, H02M1/36
CPC Code(s): H02M7/487
Abstract: a controlling circuitry of a power converter has a 3-level operation mode of outputting ac voltage composed of 3-level voltages of a dc circuit by performing on/off control of semiconductor elements, and a 2-level operation mode of outputting ac voltage composed of 2-level voltages of the dc circuit by performing on/off control of the semiconductor elements. the controlling circuitry executes first switchover control for switching between the 2-level operation mode and the 3-level operation mode, at a timing when, among the semiconductor elements, a set semiconductor element according to a polarity of a voltage command for controlling the power converter is continuing to be on.
20240348182. POWER CONVERSION DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Chiharu MORISAKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M7/5387, H02M1/088, H02M1/32, H02M7/217
CPC Code(s): H02M7/53871
Abstract: this power conversion device having a semiconductor switching element having a first main electrode, a second main electrode, and a gate includes: a first diode having a cathode connected to the first main electrode; a second diode having an anode and a cathode respectively connected to an anode of the first diode and the gate; and a current source which supplies current through a connection point between the anode of the first diode and the anode of the second diode, in a direction from each of the anode of the first diode and the anode of the second diode toward the corresponding cathode. when a voltage of the connection point between the first diode and the second diode is higher than a threshold voltage, short-circuit is determined to have occurred in the semiconductor switching element, and the gate is set to have an off voltage.
Inventor(s): Takuma TORII of Tokyo (JP) for mitsubishi electric corporation, Yuji KOMATSUZAKI of Tokyo (JP) for mitsubishi electric corporation, Ao YAMASHITA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H03F1/02, H03F3/21
CPC Code(s): H03F1/0288
Abstract: an amplifier includes a signal acquiring unit that acquires an input signal, which is a digital signal, a signal generation unit that generates an in-phase signal, an orthogonal signal, and an envelope signal by using the input signal, and a signal distribution unit that generates a first signal and a second signal by using the in-phase signal, the orthogonal signal, and the envelope signal, a differential value of a function representing either or both an amplitude ratio and a phase difference is continuous during transition of the envelope signal from a minimum value to a maximum value.
20240348237. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Hajime TAKAHASHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H03K3/013, H03K3/012
CPC Code(s): H03K3/013
Abstract: the semiconductor device includes: a first power module having a first reference potential terminal and a first control signal input terminal; a second power module, connected in parallel to the first power module, having a second reference potential terminal and a second control signal input terminal; a first capacitor connected between the first control signal input terminal and the first reference potential terminal; and a first filter connected in series to the first capacitor, on an inter-control terminal path extending from the first control signal input terminal through the first capacitor to the second control signal input terminal. the first filter has a frequency characteristic that an impedance thereof increases as a frequency increases.
Inventor(s): Takanori KYOYA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04W4/02, H04W72/566
CPC Code(s): H04W4/023
Abstract: a wireless communicator receives location information items transmitted from a plurality of information terminals associated with a user. a selector selects, when a distance between the plurality of information terminals that is based on the location information items received by the wireless communicator is less than or equal to a threshold, a location information item corresponding to an information terminal having a highest priority level of priority levels assigned to the plurality of information terminals. a display indicates a current location of the user based on the location information item selected by the selector.
Inventor(s): Daichi UCHINO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04W72/04, H04W72/51
CPC Code(s): H04W72/04
Abstract: a resource allocation device includes: an information acquisition unit that acquires information regarding a slice requested by a target terminal which is a terminal as a target to which a slice is to be allocated, information regarding a base station to which the target terminal is to be connected, and information regarding a time at which a slice request is received from the target terminal, and stores the information in a storage unit; a data analysis unit that specifies a communication environment of the target terminal on the basis of information stored in the storage unit; and a slice allocation unit that allocates a slice to the target terminal on the basis of the communication environment of the target terminal.
Mitsubishi Electric Corporation patent applications on October 17th, 2024
- Mitsubishi Electric Corporation
- B60L9/24
- B60L13/00
- CPC B60L9/24
- Mitsubishi electric corporation
- G01R31/28
- H01L21/66
- CPC G01R31/2881
- G01W1/00
- CPC G01W1/00
- G06F16/21
- G06F16/2455
- CPC G06F16/214
- G06V20/59
- G06V10/70
- G06V40/16
- CPC G06V20/597
- H01H33/42
- H01H33/662
- H01H33/666
- CPC H01H33/42
- H01L23/16
- H01L23/00
- H01L23/10
- H01L23/14
- H01L23/31
- H01L23/36
- H01L25/065
- H01L29/16
- H01L29/20
- CPC H01L23/16
- H01L23/40
- CPC H01L23/4006
- H01L23/495
- H01L21/48
- H02M1/00
- H02M1/14
- CPC H01L23/49575
- H01L23/29
- H01L23/367
- H01L23/498
- CPC H01L24/16
- H01Q15/24
- H01Q1/52
- CPC H01Q15/24
- H02K1/18
- F04D25/06
- F04D29/26
- H02K1/14
- H02K7/08
- H02K21/16
- CPC H02K1/185
- H02K1/276
- F25B31/02
- H02K21/14
- CPC H02K1/276
- H02M3/335
- H02M3/00
- CPC H02M3/33573
- H02M7/487
- H02M1/36
- CPC H02M7/487
- H02M7/5387
- H02M1/088
- H02M1/32
- H02M7/217
- CPC H02M7/53871
- H03F1/02
- H03F3/21
- CPC H03F1/0288
- H03K3/013
- H03K3/012
- CPC H03K3/013
- H04W4/02
- H04W72/566
- CPC H04W4/023
- H04W72/04
- H04W72/51
- CPC H04W72/04
