Mitsubishi Electric Corporation patent applications on July 18th, 2024
Patent Applications by Mitsubishi Electric Corporation on July 18th, 2024
Mitsubishi Electric Corporation: 28 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H05K7/20 (2), H01L25/065 (2), H05K1/18 (2), H01L23/00 (2), F25B49/02 (2) B60Q1/04 (1), H01L23/49555 (1), H05K5/0004 (1), H05K1/184 (1), H04W72/40 (1)
With keywords such as: unit, control, heat, circuit, data, partition, electronic, device, direction, and voltage in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
20240239260. HEADLIGHT DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Masashige SUWA of Tokyo (JP) for mitsubishi electric corporation, Keisuke IGARASHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B60Q1/04
CPC Code(s): B60Q1/04
Abstract: a headlight device is a headlight device for a vehicle, including a light source unit to include a plurality of light-emitting units respectively emitting light having spectral distributions different from each other and to emit illuminating light having a combined spectral distribution as a combination of the spectral distributions of the plurality of light-emitting units, an acquisition unit to acquire environment information indicating a surrounding environment around an illumination region formed by the headlight device, and a control unit to control the spectral distributions of the plurality of light-emitting units based on the environment information acquired by the acquisition unit.
Inventor(s): Tomoki Uno of Tokyo (JP) for mitsubishi electric corporation, Takuji Morimoto of Tokyo (JP) for mitsubishi electric corporation, Taku Umeda of Tokyo (JP) for mitsubishi electric corporation, Yuta Takashima of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B60W30/18, B60W30/095
CPC Code(s): B60W30/18163
Abstract: to provide a vehicle control apparatus and a vehicle control method that makes it easy for the other vehicle to change lanes in back of the ego vehicle, by controlling the travel behavior of the ego vehicle, when the other vehicle is estimated to change lanes in back of the ego vehicle. a vehicle control apparatus acquires a periphery state of an ego vehicle, and a traveling state of an ego vehicle; estimates relative positions of one ore more other vehicles which travel on an adjacent lane adjacent to an ego lane where the ego vehicle is traveling, after a lane change to the ego lane, based on the periphery state and the traveling state; and increases a speed of the ego vehicle, when the relative position of the other vehicle after the lane change is in back of the ego vehicle.
Inventor(s): Hisayuki MUKAE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B64G1/10, B64G3/00
CPC Code(s): B64G1/1007
Abstract: a reserve satellite cluster () including a plurality of satellites () stands by at an orbit altitude lower than an orbit altitude of a steadily operated satellite cluster () in a satellite constellation (). in a case where a satellite () configuring the steadily operated satellite cluster () has been lost, a satellite (), existing around a lost orbital position that is an orbital position where a satellite () has been lost in the steadily operated satellite cluster (), among satellites () configuring the reserve satellite cluster () is injected into the lost orbital position in an orbit.
Inventor(s): Masakazu SATO of Tokyo (JP) for mitsubishi electric corporation, Yoshiyuki TADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F1/32, F25B31/00, F25B41/40, F25B49/02
CPC Code(s): F24F1/32
Abstract: an air conditioner has a refrigeration cycle in which a refrigerant circulates through a compressor, an indoor heat exchanger, an expansion valve, and an outdoor heat exchanger which are connected by pipes. the air conditioner includes: an operation frequency detector configured to detect an operation frequency of the compressor; an operation time measurer configured to, based on the operation frequency, measure a continuous time for which a low frequency operation in which the operation frequency of the compressor is equal to or lower than a reference frequency is continuously performed; a stop counter configured to, based on the continuous time, count a stop number of times the compressor is stopped without the continuous time continuing longer than a reference time; and an operation controller configured to, based on the stop number of times, perform a recovery operation that recovers a concentration of a refrigerating machine oil sealed inside the compressor.
Inventor(s): Atsushi KAWASHIMA of Tokyo (JP) for mitsubishi electric corporation, Genta YOSHIMURA of Tokyo (JP) for mitsubishi electric corporation, Takuji MORIMOTO of Tokyo (JP) for mitsubishi electric corporation, Keisuke SUGIURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/41
CPC Code(s): F24F11/41
Abstract: an inference device obtains an inference value of a time taken to melt frost for defrosting temperature information representing a temperature of an outdoor-side heat exchanger included by an outdoor unit of an air-conditioning apparatus or a state of change in the temperature. in the inference device, the time taken to melt frost is a period during which the temperature of the outdoor-side heat exchanger is stable within a first range. the inference device includes a first data acquisition unit that acquires the defrosting temperature information of the air-conditioning apparatus, and an inference unit that obtains, by using a trained model that infers a time taken to melt frost from the defrosting temperature information and in accordance with the defrosting temperature information acquired by the first data acquisition unit, an inference value of the time taken to melt frost for the defrosting temperature information.
20240240845. REFRIGERATION CYCLE APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shunya GYOTOKU of Tokyo (JP) for mitsubishi electric corporation, Kimitaka KADOWAKI of Tokyo (JP) for mitsubishi electric corporation, Masahiro ITO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B49/02, F25B39/02
CPC Code(s): F25B49/02
Abstract: a refrigeration cycle apparatus includes a refrigerant circuit and a non-azeotropic refrigerant that flows through a refrigerant pipe. when the non-azeotropic refrigerant passes through an outdoor heat exchanger, a temperature difference occurs between an inlet and an outlet of the outdoor heat exchanger. the outdoor heat exchanger includes: a group of fins that are stacked at intervals; and a heat transfer tube that extends through the group of fins in a stacking direction of the group of fins and allows the non-azeotropic refrigerant to flow inside the heat transfer tube. the group of fins includes: a first fin part to which frost can adhere in a humid environment; and a second fin part to which no frost adheres to ensure ventilation.
20240240880. HEAT EXCHANGE ELEMENT_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Satoshi WAKITA of Tokyo (JP) for mitsubishi electric corporation, Yuichiro IKEUCHI of Tokyo (JP) for mitsubishi electric corporation, Fumiyasu MIYAKE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F28F3/08, F28D9/00, F28F3/04
CPC Code(s): F28F3/08
Abstract: a heat exchange element is a heat exchange element formed by stacking a plurality of heat transfer plates. the heat transfer plate includes: a heat exchanger that allows air passing through one side in a stacking direction of a plurality of the heat transfer plates and air passing through another side in the stacking direction to pass through in directions facing to each other to cause heat exchange; a header provided on one side and another side with the heat exchanger interposed therebetween when viewed along the stacking direction; and a joining edge provided along a side of the heat exchanger not in contact with the header. joining edges of a plurality of the stacked heat transfer plates are in contact with each other and joined by ultrasonic welding, and the joining edge is formed with a first convex portion that protrudes along the stacking direction.
20240240951. PATH PLANNING APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yuki YOSHIDA of Tokyo (JP) for mitsubishi electric corporation, Shota KAMEOKA of Tokyo (JP) for mitsubishi electric corporation, Rin ITO of Tokyo (JP) for mitsubishi electric corporation, Hiroaki KITANO of Tokyo (JP) for mitsubishi electric corporation, Kenta TOMINAGA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01C21/34, B60W60/00
CPC Code(s): G01C21/3461
Abstract: the present disclosure relates to a path planning apparatus, and includes: a travelable region calculation unit configured to calculate a travelable region of a moving body, based on surrounding information of the moving body; a target state calculation unit configured to calculate target state quantity including at least a target position of the moving body; a state prediction unit configured to predict at least current state quantity of the moving body and state quantity of the moving body at one or more positions between a current position and the target position of the moving body, and thereby generate one or more path candidates; a predicted state evaluation unit configured to evaluate the one or more path candidates based on the target state quantity and the travelable region, and output evaluation results; and a path generation unit configured to generate a path from the one or more path candidates based on the evaluation results, and output the path to a motion controller configured to control the moving body based on the path.
Inventor(s): Yoshinao TATEI of Tokyo (JP) for mitsubishi electric corporation, Takeshi MUSHA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01D5/14
CPC Code(s): G01D5/145
Abstract: a position detector includes a position detection magnet unit installed at each of a plurality of carriers, and a position detection unit. the position detection magnet unit includes a plurality of magnets disposed such that different magnetic poles are arranged alternately in a transport direction of the carriers, and side magnetic shielding portions installed at the ends of the position detection magnet unit. the position detection unit includes: a processing substrate disposed in parallel to the transport direction of the carriers; a plurality of magnetic detection elements disposed side by side in the transport direction of the carriers on a front side of the processing substrate; and a substrate-side magnetic shielding portion opposite the magnetic detection elements, the substrate-side magnetic shielding portion being installed on a back side of the processing substrate.
Inventor(s): Tomohito TANIUCHI of Nagasaki (JP) for mitsubishi electric corporation
IPC Code(s): G01R31/26, G01R1/067
CPC Code(s): G01R31/2601
Abstract: a plurality of electrodes () are provided on tip ends of a plurality of blocks () respectively. the plurality of lead terminals () are sandwiched by the plurality of blocks () and the plurality of wires () to correct positions of the plurality of lead terminals (). the plurality of electrodes () are brought into contact with the plurality of lead terminals () to inspect an electrical characteristic of the optical semiconductor device ().
Inventor(s): Weihau LEE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G05B19/418
CPC Code(s): G05B19/41815
Abstract: a control system includes a camera including a first synchronous counter, a plc including a second synchronous counter, and a control network connecting the camera and the plc. the control network repeatedly synchronizes the first synchronous counter and the second synchronous counter with high precision by measuring durations of a plurality of transmission delays between the camera and the plc. the camera adds, to a captured image obtained by image capturing, a count value of the first synchronous counter at the image capturing, and transmits the captured image to the plc through the control network. the plc stores, into a storage device included in the plc, a count value of the second synchronous counter, internal data or data of a connected control target, the count value from the first synchronous counter, and image data.
Inventor(s): Harunori KOIKE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06T7/00, G06V10/764, G06V10/776, G06V20/50, H04N7/18
CPC Code(s): G06T7/0002
Abstract: an inspection support device includes: a transmission/reception unit acquiring image data captured by a camera installed on an inspection robot capable of traveling inside a generator; a classification unit using a classification model, which is a trained model for determining class indicating degree of anomaly from the image data, and the image data to determine the class corresponding to the image data; an object detection unit using an object detection model, which is a trained model for identifying foreign substance in the generator from image data, and the image data to determine which object is the foreign substance in an image; a result integration unit using results of determination by the classification unit and the object detection unit to select, from the image data, image data to be checked; and a result presentation unit presenting the image data to be checked and the results of determination to the inspection worker.
20240242907. VACUUM CIRCUIT BREAKER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Masashi UEDA of Tokyo (JP) for mitsubishi electric corporation, Yasunori NAKAMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01H33/668, H01H33/662
CPC Code(s): H01H33/668
Abstract: a vacuum circuit breaker includes a grounded tank in which an insulating gas is sealed, a vacuum valve, a movable-side electrode, a fixed-side electrode, a bellows fixed to the movable-side electrode allowed to pass therethrough, to expand and contract in the vacuum valve, a pressure valve regulating gas pressure between a first area enclosed by the bellows and a movable-side frame and a second area enclosed by the grounded tank outside the first area, a pressure release valve releasing the insulating gas from the first area to the outside of the grounded tank, and an anomaly determination unit determining leak of the insulating gas from the grounded tank, based on a gas pressure in the second area measured by a pressure sensor.
Inventor(s): Yoshiyuki KAMO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/29, H01L23/10
CPC Code(s): H01L23/293
Abstract: an object of the present disclosure is to enhance thermal stress resistance of an electronic substrate on which electronic components are mounted. a stress relief structure according to the present disclosure includes an electronic substrate, a metal pattern formed on an upper surface of the electronic substrate, an electronic component formed on an upper surface of the metal pattern, a porous layer provided at least any of covers of the metal pattern, corners of the resist when the resist covers the corners of the metal pattern, in a front layer of the electronic substrate in an outer peripheral portion, and on the upper surface of the electronic substrate in the outer peripheral portion, and a sealing resin sealing the upper surface of the electronic substrate, the metal pattern, and the electronic component.
Inventor(s): Katsuhiko OMAE of Tokyo (JP) for mitsubishi electric corporation, Kensuke TAKEUCHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/34, H01L23/00, H01L23/433, H01L25/065
CPC Code(s): H01L23/345
Abstract: an electronic device includes: a substrate having a circuit pattern; heating elements disposed on a top of the substrate, and that have upper surface heat dissipating portions that are located on an opposite side of the substrate; thermal conductive members that are disposed on a top of the upper surface heat dissipating portions; metallic plates that are disposed on a top of the thermal conductive members; thermal conductive insulators that are disposed on a top of the metallic plates, and a heat sink that is disposed on a top of the thermal conductive insulators.
Inventor(s): Tatsunori YANAGIMOTO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Tsuyoshi URAJI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yasuhiro SAKAI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/495, H01L23/00
CPC Code(s): H01L23/49555
Abstract: a power semiconductor apparatus includes an insulating substrate, a power semiconductor device, and an electrode terminal. the insulating substrate includes a conductive circuit pattern. the electrode terminal is ultrasonically bonded to the conductive circuit pattern. the electrode terminal includes a strip conductor and a conductive film. the conductive film is solid-phase diffusion bonded to the conductive circuit pattern. a first vickers hardness of the conductive film is higher than a second vickers hardness of the conductive circuit pattern.
20240243071. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shota YAMAMOTO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/538, H01L25/065, H01L25/18
CPC Code(s): H01L23/5386
Abstract: a semiconductor device includes a conductive pattern and a plurality of semiconductor chips. the conductive pattern is provided on an insulating substrate. the plurality of semiconductor chips is mounted on the conductive pattern. the plurality of semiconductor chips includes a first semiconductor chip and two or more second semiconductor chips electrically connected in parallel to each other. the first semiconductor chip is more likely to be affected by thermal interference than the two or more second semiconductor chips. a thickness of the conductive pattern immediately below the first semiconductor chip is larger than a thickness of the conductive pattern immediately below each of the two or more second semiconductor chips.
20240243166. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tatsuo HARADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/06, H01L21/225, H01L21/265, H01L27/06, H01L29/10, H01L29/66, H01L29/739, H01L29/861
CPC Code(s): H01L29/063
Abstract: a trench gate type semiconductor device is provided with an active region that is a region where an n-type emitter layer is provided adjacent to a trench and a thinned region that is a region where the n-type emitter layer is not provided adjacent to the trench. in the active region, a first n-type carrier accumulation layer is provided as a carrier accumulation layer. in the thinned region, a second n-type carrier accumulation layer having a lower impurity concentration than the first n-type carrier accumulation layer is provided as the carrier accumulation layer. a p-type contact layer in the thinned region has a portion in contact with an emitter electrode.
Inventor(s): Mitsuhiro TAKADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Ryotaro HARADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/156
CPC Code(s): H02M3/156
Abstract: a control device includes a target voltage outputter that outputs a target voltage that is a target value of output voltage of a power conversion circuit and an element controller that controls a switching element in accordance with the target voltage. upon acquisition of an operation command that provides an instruction for startup of the power conversion circuit, the target voltage outputter raises the target voltage to a startup voltage that is below a rated voltage range of the power conversion circuit. in a case where at least one of the load devices has started up after acquisition of the operation command, the target voltage outputter raises the target voltage to an operating voltage that is greater than the startup voltage and is within the rated voltage range of the power conversion circuit.
Inventor(s): Yusuke HIGAKI of Tokyo (JP) for mitsubishi electric corporation, Takushi JIMICHI of Tokyo (JP) for mitsubishi electric corporation, Takuya KAJIYAMA of Tokyo (JP) for mitsubishi electric corporation, Akito NAKAYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/158, H02M1/08
CPC Code(s): H02M3/158
Abstract: a main circuit power feeder device for supplying control power from a main circuit power storage element to a main circuit control device includes: a plurality of voltage-division power storage elements connected in series; a voltage adjustment circuitry which is connected to the voltage-division power storage elements and adjusts voltages of the voltage-division power storage elements by mutual transfer of power among the voltage-division power storage elements; and a control circuitry which outputs control command values in two patterns that are a voltage-division control command value for dividing voltage of the main circuit power storage element among the voltage-division power storage elements and a bypass control command value for bypassing at least one voltage-division power storage element, in order to control the voltage adjustment circuitry, and which adjusts input voltage to the dc/dc converter.
20240243671. POWER CONVERSION DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Hajime TOYODA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M7/5395, H02M1/084, H02M1/14
CPC Code(s): H02M7/5395
Abstract: a power conversion device includes a converter, an inverter and a control circuit that controls them. the control circuit generates: first control signals that control the converter, on the basis of a first carrier wave; and second control signals that control the inverter, on the basis of a second carrier wave having a frequency and a phase that are different from those of the first carrier wave. the frequency of the first carrier wave and the frequency of the second carrier wave have a predetermined relationship therebetween based on a current of a capacitor connected in between the converter and the inverter.
Inventor(s): Guilherme BUENO MARIANI of Rennes Cedex 7 (FR) for mitsubishi electric corporation, Nicolas VOYER of Rennes Cedex 7 (FR) for mitsubishi electric corporation, Gianmario PELLEGRINO of Torino (IT) for mitsubishi electric corporation, Anantaram VARATHARAJAN of Torino (IT) for mitsubishi electric corporation
IPC Code(s): H02P21/13, H02P21/14, H02P21/18, H02P21/26
CPC Code(s): H02P21/13
Abstract: the present invention concerns a device and a method for controlling a motor using a maximum torque per ampere field module and a direct flux vector control module. the invention: —determines by the direct flux vector control module reference voltages in a ft framework, —drives the motor with the summed voltages, —measures a motor current vector, —determines a high frequency injection voltage so that the high frequency current response of the motor to the high frequency injection voltages is perpendicular to the measured motor current vector, —determines an estimated flux from the measured motor currents and the voltage references, —determines, from the estimated flux and the high frequency sinewave signal, the reference flux so that the high frequency flux response to the injected voltage is aligned with the measured current vector.
Inventor(s): VINCENT CORLAY of RENNES Cedex 7 (FR) for mitsubishi electric corporation, NICOLAS GRESSET of RENNES Cedex 7 (FR) for mitsubishi electric corporation
IPC Code(s): H04L27/04, H04L1/00
CPC Code(s): H04L27/04
Abstract: a method for transmitting binary data using a m-ask constellation divided into m/2 sets of two symbols is disclosed. each set of index i comprises the iand i+m/2 symbols of the constellation and is associated with a probability pi of transmitting the first symbol of the set. first, m−1 bits are obtained from an equiprobable binary source where m=logm. a binary source is then selected in a plurality of binary sources responsive to said m−1 bits, each binary source of index i being associated with a probability of outputting a bit zero equal to pi. a symbol of the m-ask constellation is obtained that is associated with the binary word formed by the m−1 bits as less significant bits and a bit obtained from the selected source as most significant bit. the symbol is finally transmitted to a receiver over a communication channel.
Inventor(s): Masaharu HATTORI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04N25/671, G01J5/48, G01J5/70, H04N23/20, H04N25/21, G01J5/00
CPC Code(s): H04N25/671
Abstract: provided here are: an infrared imaging element that receives infrared light to capture a thermal image; an element temperature sensor that detects a temperature of the infrared imaging element; an fpn memory that stores therein fpn data at each of the temperatures; a frame memory that saves a plurality of pieces of frame data composed of thermal images captured by the infrared imaging element in a fixed period of time; and an fpn data generation unit that, when an imaging target is determined not to have changed on the basis of the frame data, acquires from the fpn memory, the fpn data corresponding to the temperature of the infrared imaging element at which said frame data were obtained; and performs averaging processing between average values af of the plurality of pieces of frame data and the thus-acquired fpn data, to thereby regenerate the fpn data in an updated manner.
Inventor(s): Fumiki HASEGAWA of Tokyo (JP) for mitsubishi electric corporation, Tetsushi MATSUDA of Tokyo (JP) for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation, Tadahiro SHIMODA of Tokyo (JP) for mitsubishi electric corporation, Shinya MAKINO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04W72/40
CPC Code(s): H04W72/40
Abstract: in a case where a relay terminal () exists inside an area () where radio waves from a base station () reach while a remote terminal () exists outside the area () where the radio waves from the base station () reach, when receiving emergency warning information which is information for notification of an emergency situation from the base station (), the relay terminal () transmits the emergency warning information to the remote terminal () by using a connection that has been established between the relay terminal and the remote terminal () for one-to-one communication using a physical sidelink shared channel (pssch).
20240244754. Circuit Device_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yoshimichi SAITO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yoshikazu TSUNODA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Kenta FUJII of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takashi KUMAGAI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Tomohito FUKUDA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yuji SHIRAKATA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H05K1/18, H05K3/00
CPC Code(s): H05K1/184
Abstract: a circuit device includes: a heat sink having an upper surface orthogonal to a first direction; a plurality of first partition plates attached to the upper surface and extending in a second direction orthogonal to the first direction; a plurality of second partition plates attached to the upper surface and extending in a third direction orthogonal to the first direction and the second direction; a circuit component; a substrate electrically connected to the circuit component; and a first heat transfer member. the circuit component is housed in a space surrounded by two adjacent first partition plates, two adjacent second partition plates, and the upper surface. the first heat transfer member is disposed between the first partition plate and the circuit component.
20240244765. ELECTRONIC DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takahiro MASUYAMA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Hirokazu TAKABAYASHI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H05K5/00, H05K7/14, H05K7/20
CPC Code(s): H05K5/0004
Abstract: an electronic device includes a housing accommodating a plurality of electronic components, a base to which at least two of the plurality of electronic components are attached, and a partition assembly separating at least one electronic component of the at least two electronic components attached to the base from another electronic component of the at least two electronic components attached to the base. the partition assembly includes a first partition and a second partition. the first partition separates the at least one electronic component of the at least two electronic components from the other electronic component of the at least two electronic components. the second partition is located adjacent to the first partition and closes at least a part of a gap between the first partition and the housing.
20240244796. CIRCUIT DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yoshikazu TSUNODA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takashi KUMAGAI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Tomohito FUKUDA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yuji SHIRAKATA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Kenta FUJII of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H05K7/20, H05K1/18
CPC Code(s): H05K7/2039
Abstract: a circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. a normal direction of the first upper surface is along a first direction. the first partition plates extend in a second direction orthogonal to the first direction. the second partition plates extend in a third direction orthogonal to the first direction and the second direction. the sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. the first circuit component is disposed in the sealing material. the printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.
Mitsubishi Electric Corporation patent applications on July 18th, 2024
- Mitsubishi Electric Corporation
- B60Q1/04
- CPC B60Q1/04
- Mitsubishi electric corporation
- B60W30/18
- B60W30/095
- CPC B60W30/18163
- B64G1/10
- B64G3/00
- CPC B64G1/1007
- F24F1/32
- F25B31/00
- F25B41/40
- F25B49/02
- CPC F24F1/32
- F24F11/41
- CPC F24F11/41
- F25B39/02
- CPC F25B49/02
- F28F3/08
- F28D9/00
- F28F3/04
- CPC F28F3/08
- G01C21/34
- B60W60/00
- CPC G01C21/3461
- G01D5/14
- CPC G01D5/145
- G01R31/26
- G01R1/067
- CPC G01R31/2601
- G05B19/418
- CPC G05B19/41815
- G06T7/00
- G06V10/764
- G06V10/776
- G06V20/50
- H04N7/18
- CPC G06T7/0002
- H01H33/668
- H01H33/662
- CPC H01H33/668
- H01L23/29
- H01L23/10
- CPC H01L23/293
- H01L23/34
- H01L23/00
- H01L23/433
- H01L25/065
- CPC H01L23/345
- H01L23/495
- CPC H01L23/49555
- H01L23/538
- H01L25/18
- CPC H01L23/5386
- H01L29/06
- H01L21/225
- H01L21/265
- H01L27/06
- H01L29/10
- H01L29/66
- H01L29/739
- H01L29/861
- CPC H01L29/063
- H02M3/156
- CPC H02M3/156
- H02M3/158
- H02M1/08
- CPC H02M3/158
- H02M7/5395
- H02M1/084
- H02M1/14
- CPC H02M7/5395
- H02P21/13
- H02P21/14
- H02P21/18
- H02P21/26
- CPC H02P21/13
- H04L27/04
- H04L1/00
- CPC H04L27/04
- H04N25/671
- G01J5/48
- G01J5/70
- H04N23/20
- H04N25/21
- G01J5/00
- CPC H04N25/671
- H04W72/40
- CPC H04W72/40
- H05K1/18
- H05K3/00
- CPC H05K1/184
- H05K5/00
- H05K7/14
- H05K7/20
- CPC H05K5/0004
- CPC H05K7/2039
