Mitsubishi Electric Corporation patent applications on July 11th, 2024
Patent Applications by Mitsubishi Electric Corporation on July 11th, 2024
Mitsubishi Electric Corporation: 51 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L23/00 (4), H02M7/5387 (3), H01L23/31 (3), H02M1/00 (3), H01L29/78 (3) F24F11/58 (2), F24F11/65 (2), B65G1/0492 (1), H02M1/325 (1), H01L29/7813 (1)
With keywords such as: semiconductor, device, unit, portion, air, control, element, side, direction, and surface in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Takuya TANIGUCHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B65G1/04, B65G43/08
CPC Code(s): B65G1/0492
Abstract: a conveyance system includes: a travel plan generating unit to generate a travel plan of the conveyance vehicle, the travel plan being used to execute conveyance of the trailer from the parking lot to a platform by the conveyance vehicle or conveyance of the trailer from the platform to the parking lot; and an extraneous vehicle determining unit to determine whether or not the extraneous vehicle is present in the site. when the extraneous vehicle determining unit determines that the extraneous vehicle is present in the site, the travel plan generating unit generates the travel plan in which the conveyance vehicle does not obstruct traveling of the extraneous vehicle. in this case, traveling of the extraneous vehicle such as a truck is not obstructed by the conveyance vehicle, so that operation efficiency of the delivery center can be improved.
Inventor(s): Masayuki SATO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B66B5/00, B66B1/34, B66B1/46, G06F21/31
CPC Code(s): B66B5/0018
Abstract: a remote monitoring system includes a registration accepting part and a setting part. the registration accepting part accepts registration information. the registration information represents registration of a second user as a child user of a first user being registered in a user management table. a first table associates a browsable monitoring range with each user. when the registration accepting part accepts registration information, the setting part sets a monitoring range which can be browsed by the second user as a child user of the first user to a range not exceeding a browsable monitoring range which is associated with the first user in the user management table.
20240230111. INDOOR UNIT AND AIR CONDITIONER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yuki UGAJIN of Tokyo (JP) for mitsubishi electric corporation, Koki MORO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F1/0073, F24F1/0047, F24F1/0063
CPC Code(s): F24F1/0073
Abstract: an indoor unit according to an aspect of the present disclosure is an indoor unit of an air conditioner and includes a heat exchanger, an air blower, a housing that internally accommodates the heat exchanger and the air blower, and an air purification filter accommodated inside the housing, in which the housing has an air inlet which is open in a first direction, at least a portion of the air inlet is disposed apart from the air blower in a second direction intersecting with the first direction, and the air purification filter is disposed to face the air inlet, and is disposed at a position biased to a side farther from the air blower in the second direction with respect to the air inlet.
Inventor(s): Yoshinori NAKAJIMA of Tokyo (JP) for mitsubishi electric corporation, Hiroaki SAKAGUCHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/32, F24F5/00, F24F11/54, F24F11/61, H05B47/16
CPC Code(s): F24F11/32
Abstract: an air-conditioning lighting control system includes air-conditioning control circuitry configured to control an air-conditioning apparatus on the basis of an air-conditioning map indicating an air-conditioning target space and the air-conditioning apparatus provided in the air-conditioning target space, lighting control circuitry configured to control a lighting device on the basis of a lighting map indicating an illuminating target space and the lighting device provided in the illuminating target space, centralized control circuitry configured to communicate with the air-conditioning control circuitry and the lighting control circuitry and make the air-conditioning apparatus and the lighting device work in conjunction with each other on the basis of linkage information, which is set in advance, and in which the air-conditioning apparatus and the lighting device are linked with each other, and detection circuitry configured to detect that there is a setting error in the air-conditioning map, the lighting map, or the linkage information.
20240230132. DEVICE CONTROL SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Makoto HIRANO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/58, F24F11/52
CPC Code(s): F24F11/58
Abstract: a device control system includes: a wireless device including a device to be controlled and external connector that is connected to the device to be controlled, transmits/receives information to/from the device to be controlled, and is wirelessly connected to a wireless lan router; a handheld operation terminal that includes a display unit for displaying information and operates the device to be controlled; and a wireless operation terminal that is a terminal different from the handheld operation terminal and operates the device to be controlled via the external connector. when the wireless device receives, from the handheld operation terminal, an information acquisition request for first information that is information necessary for connecting the wireless operation terminal to the external connector, the wireless device selectively transmits the first information to the handheld operation terminal, and the display unit displays the first information.
Inventor(s): Shuichiro SENDA of Tokyo (JP) for mitsubishi electric corporation, Tomoo NAKANO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/58, F24F11/30
CPC Code(s): F24F11/58
Abstract: a remote monitoring apparatus includes a processor and a flash memory. by executing an fw at a time of activation, processor connects to a server via a network and determines whether fw coincides with or does not coincide with a latest program stored in the server based on a version information, and continues executing fw when fw coincides with the latest program, and acquires the latest program from server and executes a program update process of replacing fw with the latest program when fw does not coincide with the latest program.
20240230137. AIR-CONDITIONING APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Kazuya HONDA of Tokyo (JP) for mitsubishi electric corporation, Naofumi TAKENAKA of Tokyo (JP) for mitsubishi electric corporation, Jumpei TAKAGI of Tokyo (JP) for mitsubishi electric corporation, Masafumi TOMITA of Tokyo (JP) for mitsubishi electric corporation, Mizuo SAKAI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/65, F24F11/00
CPC Code(s): F24F11/65
Abstract: an air-conditioning apparatus includes configured to, when a cooling operation mode is changed into one of multiple dehumidifying operation modes, select the one of the multiple dehumidifying operation modes on the basis of a value of a sensible heat ratio difference �shf that is a difference between a target sensible heat ratio acquired from an indoor temperature detected by an indoor temperature sensor, a target indoor temperature, and target indoor humidity and a theoretical minimum possible sensible heat ratio acquired from enthalpy of an indoor air, enthalpy of blown air from the indoor unit when relative humidity is 100%, and enthalpy of sensible heat.
Inventor(s): Harumi YAMAGUCHI of Tokyo (JP) for mitsubishi electric corporation, Shinichi ITO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/65, F24F11/77, F24F11/79
CPC Code(s): F24F11/65
Abstract: an air-sending device includes a fan configured to blow air into a space, an airflow direction adjusting unit configured to adjust an airflow direction of the air blown out from the fan, and a controller configured to control the fan and the airflow direction adjusting unit. the controller is configured to, when a predetermined condition is met, execute a forced swing mode regardless of a setting made by a user for the airflow direction. in the forced swing mode, a swing operation is forcibly performed in which the airflow direction adjusting unit is controlled to change the airflow direction over time.
Inventor(s): Shinya HIGASHIIUE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F11/74, F24F1/0018, F24F1/0063, F24F1/0073
CPC Code(s): F24F11/74
Abstract: a refrigeration cycle apparatus includes an indoor unit provided with a first air inlet and a second air inlet; a first heat exchange unit located in a first air flow passage connecting the first air inlet and an air outlet; a second heat exchange unit located in a second air flow passage connecting the second air inlet and the air outlet, the second heat exchange unit being connected to the first heat exchange unit such that the second heat exchange unit is positioned downstream of the first heat exchange unit during heating operation; a first damper capable of adjusting an amount of air entering from the first air flow passage to the second air flow passage; and a second damper provided at the second air inlet and capable of adjusting an amount of air to be sucked from the second air inlet.
Inventor(s): Masami YASUDA of Tokyo (JP) for mitsubishi electric corporation, Kohei HASEGAWA of Tokyo (JP) for mitsubishi electric corporation, Shigenori KOIZUMI of Tokyo (JP) for mitsubishi electric corporation, Yutaro HAYAMIZU of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24F12/00, F24F7/08, F24F11/00
CPC Code(s): F24F12/006
Abstract: the control unit causes a heater to operate when a temperature of a supply air flow is equal to or lower than a first temperature threshold, the temperature of the supply air flow being measured by an outdoor air temperature sensor while an air supply blower and an exhaust blower are in operation and the heater is stopped; and controls a protective operation mode when a temperature of the supply air flow is equal to or lower than a second temperature threshold, the protective operation mode being a mode in which the air supply blower is intermittently operated or is stopped and the exhaust blower continues operation, the temperature of the supply air flow being measured by the outdoor air temperature sensor after the heater is caused to operate.
Inventor(s): Kenta MURATA of Tokyo (JP) for mitsubishi electric corporation, Anna KOYANO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F24H4/04, F24H15/18
CPC Code(s): F24H4/04
Abstract: a storage type heat pump hot water supplying apparatus includes: control circuitry to control a compressor frequency and a pump rotational speed, the compressor frequency being an operating frequency of the compressor, the pump rotational speed being a rotational speed of a water pump. the control circuitry is configured to control, in a heat accumulating operation for accumulating hot water in the hot water storage tank, the pump rotational speed so that the actual hot water discharge temperature becomes equal to a target hot water discharge temperature. the heat accumulating operation includes a first operation and a second operation after the first operation. the compressor frequency in the first operation is higher than the compressor frequency in the second operation. the target hot water discharge temperature in the first operation is lower than the target hot water discharge temperature in the second operation.
20240230167. REFRIGERATION CYCLE APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Kosuke MIYAWAKI of Tokyo (JP) for mitsubishi electric corporation, Yuki MIZUNO of Tokyo (JP) for mitsubishi electric corporation, Soshi IKEDA of Tokyo (JP) for mitsubishi electric corporation, Jun NISHIO of Tokyo (JP) for mitsubishi electric corporation, Yuji MOTOMURA of Tokyo (JP) for mitsubishi electric corporation, Koji FURUYA of Tokyo (JP) for mitsubishi electric corporation, Hiroki WASHIYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B1/10
CPC Code(s): F25B1/10
Abstract: a refrigeration cycle apparatus includes a main circuit and a bypass circuit. the main circuit includes: a compressor; a first condenser; a first refrigerant-to-refrigerant heat exchanger; a first expansion device; a first branching portion; a first evaporator; a third branching; and a fourth branching portion. the bypass includes: a second expansion device; the first refrigerant-to-refrigerant heat exchanger; and a second branching portion. the second branching portion includes a liquid outflow pipe and a gas outflow pipe. the liquid outflow pipe defines one outlet for the refrigerant and is located below the gas outflow pipe. the gas outflow pipe defines another outlet for the refrigerant and is located above the liquid outflow pipe. the one outlet of the second branching portion communicates with the third branching portion. the other outlet of the second branching portion communicates with the fourth branching portion.
20240230181. REFRIGERATION CYCLE APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takanori KOIKE of Tokyo (JP) for mitsubishi electric corporation, Kazuyoshi SHINOZAKI of Tokyo (JP) for mitsubishi electric corporation, Kosuke TANAKA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B41/26, F25B13/00
CPC Code(s): F25B41/26
Abstract: a refrigeration cycle apparatus includes a heat source side unit, a relay unit, and a plurality of load side units, the heat source side unit and the relay unit are connected by using a low-pressure pipe and a high-pressure pipe, and the relay unit and each of the plurality of load side units are connected by using a corresponding liquid branch pipe and a corresponding gas branch pipe. the heat source side unit includes a compressor configured to compress refrigerant, at least one flow switching valve configured to change a passage of refrigerant based on an operation mode, and at least one heat source side heat exchanger, and the relay unit includes six-way valves or pairs of four-way valves.
20240230196. AIR-CONDITIONING APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Komei NAKAJIMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B49/02, F25B13/00
CPC Code(s): F25B49/022
Abstract: an air-conditioning apparatus includes a controller that has: a first determination value obtained by multiplying by a first constant, a time constant which is a response value required until heating and cooling capacity in refrigeration circulation in a refrigeration cycle circuit is stabilized, and which is a value at a rise of a waveform representing the heating and cooling capacity calculated from a measured value; and a second determination value obtained by multiplying the time constant by a second constant smaller than the first constant. the controller increases the lowest frequency for a subsequent operation of the compressor, when in the intermittent operation, an intermittent operation time from the start to stop of the compressor is longer than the first determination value, and deceases the lowest frequency for the above subsequent operation, when in the intermittent operation, the intermittent operation time is shorter than the second determination value.
Inventor(s): Takamichi NAKAMIZO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Ikuya KAKIMOTO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Tomoya MATSUDA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Masahiro HAGIO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01S7/02, G01S13/87
CPC Code(s): G01S7/0236
Abstract: a radar system, a radar device, and an interference avoidance method are obtained that can utilize frequency effectively even in three or more radar devices. a radar system includes three or more radar devices and a schedule management controller. schedule management controller predicts an interference time period that is a time period during which the overlapping scanning/radiation range is generated, determines a first interference avoidance measure that is a measure to cause radar devices to use respective different use frequencies while keeping a restriction on the number of frequency channels, in the predicted interference time period, and determines a second interference avoidance measure to be performed by a radar device that is unable to avoid interference by the first interference avoidance measure.
Inventor(s): Masakazu TAKABAYASHI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yosuke SUZUKI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Satoshi NISHIKAWA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Koichi AKIYAMA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G02F1/225, G02F1/21
CPC Code(s): G02F1/2257
Abstract: a semiconductor optical phase modulator includes an optical phase modulation element, a first semiconductor optical amplifier to amplify light input to the optical phase modulation element, and a second semiconductor optical amplifier to amplify modulated signal light output from the optical phase modulation element. a light input end of the semiconductor optical phase modulator is a light input end face of the first semiconductor optical amplifier. a light output end of the semiconductor optical phase modulator is a light output end face of the second semiconductor optical amplifier.
Inventor(s): Yasuhiro MATSUO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G03F7/20, H01L21/027, H01L21/67, H01L21/68, H01L23/544
CPC Code(s): G03F7/2039
Abstract: there is provided a semiconductor device manufacturing method which includes: a step of radiating an x-ray to a semiconductor wafer on which two alignment marks are formed and then detecting an intensity of a diffracted x-ray of the x-ray coming from the semiconductor wafer, to thereby determine a direction of a predetermined crystal plane of the semiconductor device, viewed from a direction perpendicular to a surface of the semiconductor wafer; a step of calculating an angle � created between the direction of the predetermined crystal plane and a straight line connecting these two alignment marks; a step of adjusting a position of the semiconductor wafer so that an angle created between a predetermined reference direction and the straight line is matched with the angle �; and a step of transferring a pattern onto the semiconductor wafer with reference to the predetermined reference direction.
Inventor(s): Seiji UOZUMI of Tokyo (JP) for mitsubishi electric corporation, Nobuyuki SUMI of Tokyo (JP) for mitsubishi electric corporation, Shun KAYASHIMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G05B19/4099, G05B19/18
CPC Code(s): G05B19/4099
Abstract: an nc device includes an additive manufacturing execution unit that controls an additive manufacturing process for producing a shaped object by stacking layers of a material melted, a subtractive manufacturing execution unit that controls a subtractive manufacturing process for cutting the shaped object using a tool, a status analysis unit that analyzes a machining status of the shaped object based on sensor data obtained by monitoring of the machining status of the shaped object produced by a combination of the additive and subtractive manufacturing processes, a production process change unit that outputs, to the additive and subtractive manufacturing execution units, a switching command that commands switching a production process, based on the analysis of the machining status, and a process condition generation unit that determines a process condition to be used in a production process after switching, based on a process condition used before the switching.
Inventor(s): Shaoxiang MA of Tokyo (JP) for mitsubishi electric corporation, Kiyoyasu MARUYAMA of Tokyo (JP) for mitsubishi electric corporation, Masahide KOIKE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G05B19/418
CPC Code(s): G05B19/4184
Abstract: a production line monitoring apparatus is an apparatus for monitoring a process in a factory production line. the production line monitoring apparatus includes an anomaly detection processing unit that detects an anomalous condition in the production line, based on videos acquired by a plurality of image-capturing units disposed in different positions outside the production line monitoring apparatus to capture images of the state of the production line, an anomaly tracking processing unit that, when an anomalous condition has been detected by the anomaly detection processing unit, creates a recorded video in which, of the videos captured by the plurality of image-capturing units, videos in which an anomalous condition identical to the detected anomalous condition is captured are connected in a time series manner, and a storage unit that stores the recorded video and accompanying information which accompanies the detected anomalous condition in association with each other.
Inventor(s): Kohei KAMADA of Tokyo (JP) for mitsubishi electric corporation, Hideki FUKUHARA of Tokyo (JP) for mitsubishi electric corporation, Masahiro NAKATSUKASA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06V20/56, G06V10/25, G06V10/74
CPC Code(s): G06V20/56
Abstract: a data extraction device, which extracts an image for transmission from images obtained by capturing surroundings outside a vehicle with an imaging device mounted on the vehicle each time the vehicle travels an extraction distance, includes: processing circuitry configured to acquire an image obtained by capturing the surroundings outside the vehicle; determine, as an object to be analyzed, an image captured at a position advanced by the extraction distance from a position at which a previously extracted image has been captured, and calculate an obstruction distance which indicates an actual distance from an imaging start position of the image having been determined as the object to be analyzed to a position of an obstruction included in the determined image; output the calculated obstruction distance as a next extraction distance; and extract the image that has been determined as the object to be analyzed.
Inventor(s): Taro KUMAGAI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06V20/59, B60R16/023
CPC Code(s): G06V20/593
Abstract: there is provided an occupant detection device with a reduced processing load.
Inventor(s): Taro KUMAGAI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06V20/59, B60R16/023
CPC Code(s): G06V20/593
Abstract: an occupant detection device includes an image obtainer to obtain a captured image from an imaging device including, in an imaging range, a driver present in a driver seat of a vehicle and a passenger present in a passenger seat or a rear seat of the vehicle, an occupant detector to obtain the captured image from the image obtainer, the occupant detector being capable of detecting the driver and the passenger in the captured image, and a detection target determiner to determine whether a detection target of the occupant detector is one of occupants of the driver and the passenger or both of the occupants of the driver and the passenger.
20240234057. VACUUM CIRCUIT BREAKER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Motohiro SATO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01H33/53, H01H33/66
CPC Code(s): H01H33/53
Abstract: a vacuum circuit breaker includes: a plurality of vacuum valves each of which includes: a cylindrical vacuum container; a fixed electrode fixed inside the vacuum container; a movable conductor that protrudes from the inside of the vacuum container to the outside of the vacuum container and is movable in a direction of a center axis of the vacuum container; and a movable electrode that moves together with the movable conductor inside the vacuum container to be capable of being separated from the fixed electrode and coming into contact with the fixed electrode, the plurality of vacuum valves being connected in series with each other; and a cylindrical tank that accommodates the plurality of vacuum valves. the plurality of vacuum valves include at least two vacuum valves adjacent to each other in a direction intersecting a center axis of the tank.
20240234059. VACUUM INTERRUPTER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Masashi KAWADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01H33/664, H01H33/662
CPC Code(s): H01H33/664
Abstract: a fixed side power feeding plate having a fixed side circular arc shaped power feeding portion, a fixed side coil electrode having a fixed side circular arc shaped coil portion, a movable side power feeding plate having a movable side circular arc shaped power feeding portion, wherein a fixed side cavity is formed between a fixed side contact and the fixed side circular arc shaped power feeding portion, a movable side cavity is formed between a movable side contact and the movable side circular arc shaped power feeding portion, a fixed side air gap is formed between the fixed side circular arc shaped coil portion and the fixed side circular arc shaped power feeding portion, and a movable side air gap is formed between the movable side circular arc shaped coil portion and the movable side circular arc shaped power feeding portion.
Inventor(s): Mamoru MATSUO of Tokyo (JP) for mitsubishi electric corporation, Kenta NAKAHARA of Tokyo (JP) for mitsubishi electric corporation, Keiichi NAKAMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L21/66
CPC Code(s): H01L22/12
Abstract: a method for manufacturing a substrate according to the first disclosure includes immersing a substrate on which a plurality of circuit patterns are formed in pure water or a corrosive solution, applying voltage between the plurality of circuit patterns in a state in which the substrate is immersed in the pure water or the corrosive solution and determining the substrate to be a defective product when a tree is generated in the plurality of circuit patterns due to the voltage application and determining the substrate to be a non-defective product when the tree is not generated.
Inventor(s): Nobuyoshi KIMOTO of Fukuoka (JP) for mitsubishi electric corporation, Mitsunori AIKO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/373, H01L21/48, H01L23/10, H01L23/31, H01L23/48, H01L25/07
CPC Code(s): H01L23/373
Abstract: provided is a power semiconductor device with high heat dissipation from a semiconductor element. the power semiconductor device includes a semiconductor device, a heat sink, grease, an adhesive, and a terminal block, the semiconductor device including the semiconductor element, a sealant sealing the semiconductor element, and a power terminal electrically connected to the semiconductor element, wherein a first area as a selective area of a lower surface of the semiconductor device is bonded to the heat sink through the adhesive, the semiconductor device is in contact with the heat sink through the grease in a second area that is an area other than the selective area of the lower surface of the semiconductor device, the terminal block includes an electrode on an upper surface of the terminal block, and the power terminal is fastened to the terminal block, and is electrically connected to the electrode of the terminal block.
20240234260. POWER SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takuya SAKAMOTO of Tokyo (JP) for mitsubishi electric corporation, Keitaro ICHIKAWA of Tokyo (JP) for mitsubishi electric corporation, Yuji SHIKASHO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/495, H01L23/00, H01L23/31, H01L25/07
CPC Code(s): H01L23/4952
Abstract: a power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
20240234271. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Norikazu SAKAI of Tokyo (JP) for mitsubishi electric corporation, Fumihito KAWAHARA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49811
Abstract: an object is to provide a technique that suppresses peeling of a sealing resin that seals a semiconductor element by a simple method. a semiconductor device includes an insulating substrate provided with a front surface metal pattern a front surface thereof, a semiconductor element mounted on the front surface metal pattern, a wiring wire connected to the front surface electrode of the semiconductor element, a sealing resin that seals the insulating substrate and the semiconductor element, and at least one metal wire arranged around the semiconductor elements on and along the front surface metal pattern. the distance between the semiconductor element and the at least one metal wire is greater than the thickness of the semiconductor element.
Inventor(s): Tetsunari SAITO of Tokyo (JP) for mitsubishi electric corporation, Seiichi TSUJI of Tokyo (JP) for mitsubishi electric corporation, Hiroaki MINAMIDE of Tokyo (JP) for mitsubishi electric corporation, Ko KANAYA of Tokyo (JP) for mitsubishi electric corporation, Shunichi ABE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/552, H01L23/00, H01L23/48, H01L23/498
CPC Code(s): H01L23/552
Abstract: an input feedthrough () and an output feedthrough () provided on the substrate () are wire-connected to an input pad () and an output pad () of the semiconductor chip () respectively. a metal seal ring () is provided on the substrate () is electrically connected to the metal plate () by a through-hole (). a conductive cap () is bonded to the metal seal ring () and covers a place above the semiconductor chip (). both ends of an isolation metal wire () are electrically connected to the metal plate () and a loop comes into contact with a lower surface of the conductive cap (). the isolation metal wire () constitutes an isolation wall partitioning an inner space into a region including the input feedthrough () and a region including the output feedthrough ().
Inventor(s): Yasunari HINO of Tokyo (JP) for mitsubishi electric corporation, Junichi YAMASHITA of Tokyo (JP) for mitsubishi electric corporation, Koji TANAKA of Tokyo (JP) for mitsubishi electric corporation, Tomohide TERASHIMA of Tokyo (JP) for mitsubishi electric corporation, Shinichi IZUO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/00, H01L23/49, H02M7/44
CPC Code(s): H01L24/05
Abstract: provided is a semiconductor device with higher reliability and longer life which can suppress an increase in production costs. a semiconductor device includes: a semiconductor element; a top electrode on an upper surface of the semiconductor element; and a conductive metal plate containing copper as a main component and solid-state diffusion bonded to the top electrode of the semiconductor element.
Inventor(s): Seiya SUGIMACHI of Tokyo (JP) for mitsubishi electric corporation, Kazufumi OKI of Tokyo (JP) for mitsubishi electric corporation, Okinori INOUE of Tokyo (JP) for mitsubishi electric corporation, Kazuhiro KAWAHARA of Tokyo (JP) for mitsubishi electric corporation, Kosuke YAMAGUCHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/06, H01L29/739, H01L29/78, H02M7/5387
CPC Code(s): H01L29/0696
Abstract: the object is to provide a technology that can shorten a routing length of a gate wire connecting a control ic that controls driving first and second semiconductor elements that are connected in parallel with each other, to a gate pad of one of the first and second semiconductor elements disposed distant from the control ic. a first semiconductor element and a second semiconductor element are disposed so that a long side of the first semiconductor element faces a side of the second semiconductor element, and a hvic or a lvic, the first semiconductor element, and the second semiconductor element are disposed in this order in a direction orthogonal to a first direction, the gate pad is disposed on the first semiconductor element on one side in the first direction, and the gate pad is disposed on the second semiconductor element on the other side in the first direction.
Inventor(s): Tetsuo TAKAHASHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/78, H01L29/40, H01L29/423
CPC Code(s): H01L29/7813
Abstract: a semiconductor device includes a trench formed in a semiconductor layer of an active region, a gate insulating film and a gate electrode formed in the trench, a gate pad formed on a field insulating film, and a gate lead-out wiring line connecting the gate pad and the gate electrode. a shoulder portion, a sidewall portion, and a bottom portion of the trench are covered with the field insulating film in a gate pull-up portion which is an end portion of the trench corresponding to a place where the gate lead-out wiring line and the gate electrode in the trench are connected. the thickness of the field insulating film covering the shoulder portion, the sidewall portion, and the bottom portion of the trench in the gate pull-up portion is equivalent to or larger than the thickness of the field insulating film under the gate pad.
Inventor(s): Yuki TAKIGUCHI of Tokyo (JP) for mitsubishi electric corporation, Eiji YAGYU of Tokyo (JP) for mitsubishi electric corporation, Kunihiko NISHIMURA of Tokyo (JP) for mitsubishi electric corporation, Hisashi SAITO of Tokyo (JP) for mitsubishi electric corporation, Takahiro YAMADA of Tokyo (JP) for mitsubishi electric corporation, Daisuke TSUNAMI of Tokyo (JP) for mitsubishi electric corporation, Marika NAKAMURA of Tokyo (JP) for mitsubishi electric corporation, Masanao ITO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L29/78, H01L29/417, H01L29/423, H01L29/66
CPC Code(s): H01L29/7853
Abstract: a semiconductor device includes a substrate, a semiconductor layer, an element region, and fin transistors. the substrate includes a principal surface. the semiconductor layer is formed as a surface layer or on the principal surface of the substrate, the surface layer being the principal surface of the substrate. the semiconductor layer has a crystal structure in which an angle between two of crystal orientations with equivalent relationships on a crystal plane having a correspondence with the principal surface of the substrate is 60 degrees or 120 degrees. the element region includes unit element regions formed on the principal surface of the substrate. the fin transistors are formed in the semiconductor layer, in the respective unit element regions. the fin transistors radially extend from a center toward an outer periphery of the element region. adjacent two of the fin transistors have a spacing with a 60� angle or a 120� angle.
20240235152. OPTICAL SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Koichi NAKAMURA of Tokyo (JP) for mitsubishi electric corporation, Keita MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01S5/026, H01S5/02325
CPC Code(s): H01S5/0262
Abstract: an optical semiconductor device comprises a semiconductor laser mounted on a bottom portion of a package, a receiving unit that receives a signal light from an outside using local oscillator light output from the laser, and a receiving-unit-mounted substrate on which the receiving unit including a semiconductor light receiving element is mounted. the receiving unit is disposed on a surface on the side opposite to the laser. the light receiving-unit-mounted substrate is a non-transmissive substrate, has a light passing portion through which the local oscillator light output from the laser passes, and covers the bottom portion surrounded by an outer peripheral portion of the package.
20240235285. MOTOR, FAN, AND AIR CONDITIONER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yuji HIROSAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K1/14, H02K1/16, H02K3/34, H02K3/48, H02K7/14
CPC Code(s): H02K1/148
Abstract: a motor includes a rotor and a stator. the rotor has a rotor core having an annular shape about an axis, and a permanent magnet attached to the rotor core. the permanent magnet forms a magnet magnetic pole, and a part of the rotor core forms a virtual magnetic pole. the stator has a stator core surrounding the rotor core in a radial direction about the axis, and a coil wound on the stator core. the stator core has a slot in which the coil is housed. the stator core has a first core part located at a center of the stator core in an axial direction, and a second core part located at an end of the stator core in the axial direction. an area of the slot in the second core part is larger than an area of the slot in the first core part.
Inventor(s): Taichi TOKUHISA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Ryo NABIKA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takeshi YAGI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Hiroki ASO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takanori WATANABE of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Akiko TATEBE of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Kazuya HARADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K1/276, H02K15/03, H02K15/12
CPC Code(s): H02K1/276
Abstract: a rotor includes a first resin portion formed the periphery of a main shaft; a first core disposed the outer circumferential portion of the first resin portion; a magnet attached to the radial outside of the first core; and a second core disposed the radially outside end face of the magnet, wherein a plurality of structures in each of which the magnet is sandwiched between the first and second cores are disposed circumferentially around the main shaft, and a second resin portion is formed between the circumferential end faces of adjacent second cores and between the circumferential end faces of adjacent magnets, wherein the first core has a division surface on which the circumferential end faces of itself and an adjacent first core are in surface contact with each other, and wherein the second core is not in contact with an adjacent second core.
20240235294. ROTATING ELECTRICAL MACHINE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Hidenori SASAKI of Tokyo (JP) for mitsubishi electric corporation, Kenta MOTOYOSHI of Tokyo (JP) for mitsubishi electric corporation, Yu HIROTANI of Tokyo (JP) for mitsubishi electric corporation, Hiroko IKEDA of Tokyo (JP) for mitsubishi electric corporation, Shohei FUJIKURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K1/278
CPC Code(s): H02K1/278
Abstract: a rotating electrical machine includes a stator and a rotor, the rotor includes a rotor core and a plurality of magnetic poles, the plurality of magnetic poles includes a plurality of magnet poles formed by permanent magnets, and a plurality of dummy poles, the magnet poles and the dummy poles are alternately disposed in both an axial direction and a circumferential direction, non-magnetic holes are provided between the magnet poles and the dummy poles that are adjacent in the axial direction, and when a length of each magnet pole in the axial direction is tm, a length of each dummy pole in the axial direction is tc, a length of each non-magnetic hole in the axial direction is ta, and a length of the rotor core in the axial direction is lc, the rotating electrical machine satisfies tm>tc and lc<(2�tm)+ta.
Inventor(s): Wataru YAMASHITA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Tatsuya OKUDA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K3/50, H02K3/34
CPC Code(s): H02K3/50
Abstract: a metal support structural body is provided on the radially outer side of a phase ring for connecting a rotating electric machine armature winding at a stator end. an insulator ensuring an insulation distance to the ground is interposed between the phase ring and the metal support structural body. thus, long-term reliability improves as compared to a conventional insulation-to-ground structure. since the insulation distance to the ground is ensured by the insulator, the phase ring and the metal support structural body are configured with an insulation thickness smaller than needed for insulation to the ground, thereby improving cooling performance for the phase ring and the metal support structural body. occurrence of induced current in the metal support structural body is suppressed, thus allowing application of a simple fastening structure such as metal bolts to a stator frame.
Inventor(s): Yoshikuni TOMIOKA of Tokyo (JP) for mitsubishi electric corporation, Takashi NAGAO of Tokyo (JP) for mitsubishi electric corporation, Katsuhiko OMAE of Tokyo (JP) for mitsubishi electric corporation, Takahiro OKANOUE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K11/33, B62D5/04, H02K11/21, H02K11/27
CPC Code(s): H02K11/33
Abstract: a control device that includes a circuit board, a plurality of heating elements that generate heat that accompanies driving the motor, and a rotation angle sensor that detects a rotation angle of the motor. the circuit board has a power supply input portion to which a driving current of the motor is supplied, a heating element mounting region where the plurality of the heating elements are mounted, and a controller mounting region where the rotation angle sensor is mounted. the power supply input portion, the heating element mounting region, and the controller mounting region are disposed in such an order. the circuit board, as seen from an axial direction of the rotating shaft, protrudes to an outside of a projection region that projects an outer surface of a cylindrical portion of a motor case that surrounds the motor. the power supply input portion is located on a portion out of portions of the circuit board that are on the outside of the projection region.
20240235357. BEARINGLESS MOTOR_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Masahito MIYOSHI of Tokyo (JP) for mitsubishi electric corporation, Yusuke SAKAMOTO of Tokyo (JP) for mitsubishi electric corporation, Shinichi FURUTANI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K41/06, H02K11/21
CPC Code(s): H02K41/065
Abstract: a bearingless motor includes a rotor, a stator for applying support force and torque to the rotor, and a first displacement sensor and a second displacement sensor for detecting a radial position of the rotor. the stator includes a motor winding for generating a magnetic flux having p poles to produce the torque, and a support winding for generating a magnetic flux having p�2 poles or two poles to produce the support force. the first displacement sensor and the second displacement sensor are disposed at positions axially different from each other.
Inventor(s): Hiroya NATSUHARA of Tokyo (JP) for mitsubishi electric corporation, Isao KEZOBO of Tokyo (JP) for mitsubishi electric corporation, Tatsuya MORI of Tokyo (JP) for mitsubishi electric corporation, Chiaki FUJIMOTO of Tokyo (JP) for mitsubishi electric corporation, Atsushi ITO of Kobe-shi (JP) for mitsubishi electric corporation, Yusuke TAKARADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M1/32, H02M1/00, H02M1/084, H02M7/537
CPC Code(s): H02M1/325
Abstract: a power converter includes: a multiphase inverter circuit including a plurality of switching elements; a plurality of current sensors each configured to detect a current of the inverter circuit and output a value of the current detected; a terminal voltage detector configured to detect a voltage of each terminal of a load connected to the inverter circuit and output a value of the voltage detected; a switching element drive circuit configured to control the plurality of switching elements of the inverter circuit according to a switching pattern given; a fault detector configured to detect a fault in the inverter circuit or the plurality of current sensors; and a fault identifier configured to, after the fault detector detects the fault, switch the switching pattern to be given to the switching element drive circuit according to types of faults detectable by the fault detector, and perform identification processing of identifying a type and a location of the fault in the inverter circuit or the plurality of current sensors based on the value of the current detected by the plurality of current sensors or the value of the voltage detected by the terminal voltage detector during the control according to the switching pattern.
20240235403. POWER CONVERSION DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takuya NAKANISHI of Tokyo (JP) for mitsubishi electric corporation, Satoshi OJIKA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/335, H02M1/00
CPC Code(s): H02M3/33569
Abstract: in a power conversion device including an llc converter and a controller, the controller performs drive control of an inverter circuit in the llc converter, to perform output control of the llc converter. the controller performs control calculation for a value za of a manipulated variable z so that output voltage comes close to target voltage, and acquires a combination of a phase shift amount � and a frequency f corresponding to the value za of the manipulated variable z, to perform drive control of the inverter circuit.
Inventor(s): Kenichi FUKUNO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takaharu ISHIBASHI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takato TOI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/335, H02M1/32
CPC Code(s): H02M3/33584
Abstract: an electric power conversion apparatus according the present disclosure includes: voltage detection means which detects the voltages of both bridge circuits, and a control device which controls the semiconductor switching elements of both bridge circuits. the control device includes a phase difference operation part which calculates a phase difference between the output of the first bridge circuit and the output of the second bridge circuit, based on the voltage values of both bridge circuits which are detected by the voltage detection means and an electric power command value; a compensation amount operation part which calculates a compensation amount which compensates an error due to the phase difference; and a pwm signal generation part which generates gate signals of the semiconductor switching elements, from a first operation result of the phase difference operation part and a second operation result of the compensation amount operation part.
Inventor(s): Toshikazu Takagi of Tokyo (JP) for mitsubishi electric corporation, Chiharu Morisaki of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02M7/5387, B60L50/51, H02M1/00, H02M1/088
CPC Code(s): H02M7/53873
Abstract: an electric-power conversion apparatus includes a driving circuit that performs switching control of semiconductor switching devices, a short-circuit control means that performs short-circuit control of an electric-power conversion circuit, an excessive-current detection means that detects whether or not an abnormality caused by an excessive current exists in the semiconductor switching device, and a gate-drive-abnormality detection means that detects whether or not an abnormality exists in a gate voltage of the semiconductor switching device; based on a result of the abnormality detection by the excessive-current detection means and a result of the abnormality detection by the gate-drive-abnormality detection means, the short-circuit control means turns on all the semiconductor switching devices in any one of the upper arm and the lower arm so as to perform the short-circuit control.
20240235451. POWER CONVERSION DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tomonori YAMADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02P27/06, B60L15/20, H02P29/024, H02P29/60
CPC Code(s): H02P27/06
Abstract: a loss in each of a converter, an inverter, and a motor changes according to operation based on the rotation speed of the motor or the like. thus, in order to efficiently perform operation, appropriate control needs to be performed according to the voltage of a dc power supply and operation of the motor. the present disclosure is characterized by including a controller which controls a switching element of a converter according to the torque and the rotation speed of a motor on the basis of a loss in at least one of the motor, an inverter, and the converter.
20240235529. FILTER CIRCUIT_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takaya MARUYAMA of Tokyo (JP) for mitsubishi electric corporation, Sho IKEDA of Tokyo (JP) for mitsubishi electric corporation, Koji TSUTSUMI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H03H11/04
CPC Code(s): H03H11/04
Abstract: a filter circuit includes: a filter unit which is connected to a signal line and which has transistors and capacitors which constitute paths for n phases, and in which the transistors to which clock signals of n phases are applied electrically connect the capacitors to the signal line; and a dummy unit which has transistors and impedance parts which constitute dummy paths corresponding, respectively, to the paths for the n phases, and in which the transistors to which inverted signals of n phases are applied electrically connect the impedance parts to the signal line.
Inventor(s): Yasutaka IMAMURA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yohei MITSUI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Yukihiko WADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Takayoshi MIKI of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H03K17/082, H02M1/08, H02M7/5387, H03K17/16
CPC Code(s): H03K17/0822
Abstract: a semiconductor device is subjected to on/off control by controlling a gate voltage according to a drive control signal (ssw). in a turn-on operation for charging a gate in response to transition of drive control signal (ssw) from a first level () to a second level (), a drive signal (sdr) is set to first level () to discharge the gate at a first time (t) after end of a miller period () of a gate voltage (vg), thereby providing a voltage drop period () in which gate voltage (vg) temporarily drops. at a second time (t), drive signal (sdr) is again set to second level () to start charging the gate.
Inventor(s): Christophe MANGIN of RENNES Cedex 7 (FR) for mitsubishi electric corporation
IPC Code(s): H04L47/56, H04L47/22, H04L47/28, H04L47/62, H04L47/6275, H04L47/6295
CPC Code(s): H04L47/564
Abstract: the present invention relates to a method implemented in a packet-switched network for scheduling transmission of ethernet frames, comprising the steps of:
Inventor(s): ROMAIN ROLLET of RENNES Cedex 7 (FR) for mitsubishi electric corporation
IPC Code(s): H04L49/253, H04L45/00, H04L47/6275, H04L49/25
CPC Code(s): H04L49/254
Abstract: the present disclosure relates to a method for performing switching functions by a processing circuit of a switching device, the communication over the communication channel being organized according to successive first time slices and a second time slices, the processing circuit implementing a rtos which in normal operation comprises a rtos scheduler for scheduling a plurality of tasks having different priorities, said method comprising:
Inventor(s): QIANRUI LI of RENNES Cedex 7 (FR) for mitsubishi electric corporation, HERVE BONNEVILLE of RENNES Cedex 7 (FR) for mitsubishi electric corporation, NICOLAS GRESSET of RENNES Cedex 7 (FR) for mitsubishi electric corporation, AKL CHARAF of RENNES (FR) for mitsubishi electric corporation
IPC Code(s): H04W28/24, H04L45/12, H04W28/02, H04W28/06
CPC Code(s): H04W28/24
Abstract: a method for learning qos performance inter-dependence of a plurality of communication links in a network managed by a central node, wherein the plurality of wireless links interface with a common application applying a joint figure of merit, comprising:
Inventor(s): Tadahiro SHIMODA of Tokyo (JP) for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04W36/06, H04L1/1812, H04W24/10, H04W28/02
CPC Code(s): H04W36/06
Abstract: a communication system includes: a base station conforming to new radio access technology; and a communication terminal capable of performing multicast communication with the base station. while executing the multicast communication, the communication terminal transmits reception status information to the base station in communication with the communication terminal, the reception status information being information related to a data reception status, and the base station performs control of retransmission of data to the communication terminal on the basis of the reception status information.
Inventor(s): REMI PERRIN of RENNES Cedex 7 (FR) for mitsubishi electric corporation, JULIO BRANDELERO of RENNES Cedex 7 (FR) for mitsubishi electric corporation
IPC Code(s): H05K1/11, H05K3/00
CPC Code(s): H05K1/113
Abstract: power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating layer comprises vias filled with conductive material to provide connecting pads between said metallized connection surface of said die and said conductive path, and wherein said vias are arranged with a decreasing density from at least one hot spot position of said metallized connection surface when the die is in operation to a peripheral area of said metallized connection surface.
Mitsubishi Electric Corporation patent applications on July 11th, 2024
- Mitsubishi Electric Corporation
- B65G1/04
- B65G43/08
- CPC B65G1/0492
- Mitsubishi electric corporation
- B66B5/00
- B66B1/34
- B66B1/46
- G06F21/31
- CPC B66B5/0018
- F24F1/0073
- F24F1/0047
- F24F1/0063
- CPC F24F1/0073
- F24F11/32
- F24F5/00
- F24F11/54
- F24F11/61
- H05B47/16
- CPC F24F11/32
- F24F11/58
- F24F11/52
- CPC F24F11/58
- F24F11/30
- F24F11/65
- F24F11/00
- CPC F24F11/65
- F24F11/77
- F24F11/79
- F24F11/74
- F24F1/0018
- CPC F24F11/74
- F24F12/00
- F24F7/08
- CPC F24F12/006
- F24H4/04
- F24H15/18
- CPC F24H4/04
- F25B1/10
- CPC F25B1/10
- F25B41/26
- F25B13/00
- CPC F25B41/26
- F25B49/02
- CPC F25B49/022
- G01S7/02
- G01S13/87
- CPC G01S7/0236
- G02F1/225
- G02F1/21
- CPC G02F1/2257
- G03F7/20
- H01L21/027
- H01L21/67
- H01L21/68
- H01L23/544
- CPC G03F7/2039
- G05B19/4099
- G05B19/18
- CPC G05B19/4099
- G05B19/418
- CPC G05B19/4184
- G06V20/56
- G06V10/25
- G06V10/74
- CPC G06V20/56
- G06V20/59
- B60R16/023
- CPC G06V20/593
- H01H33/53
- H01H33/66
- CPC H01H33/53
- H01H33/664
- H01H33/662
- CPC H01H33/664
- H01L21/66
- CPC H01L22/12
- H01L23/373
- H01L21/48
- H01L23/10
- H01L23/31
- H01L23/48
- H01L25/07
- CPC H01L23/373
- H01L23/495
- H01L23/00
- CPC H01L23/4952
- H01L23/498
- CPC H01L23/49811
- H01L23/552
- CPC H01L23/552
- H01L23/49
- H02M7/44
- CPC H01L24/05
- H01L29/06
- H01L29/739
- H01L29/78
- H02M7/5387
- CPC H01L29/0696
- H01L29/40
- H01L29/423
- CPC H01L29/7813
- H01L29/417
- H01L29/66
- CPC H01L29/7853
- H01S5/026
- H01S5/02325
- CPC H01S5/0262
- H02K1/14
- H02K1/16
- H02K3/34
- H02K3/48
- H02K7/14
- CPC H02K1/148
- H02K1/276
- H02K15/03
- H02K15/12
- CPC H02K1/276
- H02K1/278
- CPC H02K1/278
- H02K3/50
- CPC H02K3/50
- H02K11/33
- B62D5/04
- H02K11/21
- H02K11/27
- CPC H02K11/33
- H02K41/06
- CPC H02K41/065
- H02M1/32
- H02M1/00
- H02M1/084
- H02M7/537
- CPC H02M1/325
- H02M3/335
- CPC H02M3/33569
- CPC H02M3/33584
- B60L50/51
- H02M1/088
- CPC H02M7/53873
- H02P27/06
- B60L15/20
- H02P29/024
- H02P29/60
- CPC H02P27/06
- H03H11/04
- CPC H03H11/04
- H03K17/082
- H02M1/08
- H03K17/16
- CPC H03K17/0822
- H04L47/56
- H04L47/22
- H04L47/28
- H04L47/62
- H04L47/6275
- H04L47/6295
- CPC H04L47/564
- H04L49/253
- H04L45/00
- H04L49/25
- CPC H04L49/254
- H04W28/24
- H04L45/12
- H04W28/02
- H04W28/06
- CPC H04W28/24
- H04W36/06
- H04L1/1812
- H04W24/10
- CPC H04W36/06
- H05K1/11
- H05K3/00
- CPC H05K1/113
