Mitsubishi Electric Corporation patent applications on August 1st, 2024
Patent Applications by Mitsubishi Electric Corporation on August 1st, 2024
Mitsubishi Electric Corporation: 25 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L23/00 (5), F25B41/31 (2), H01L23/495 (2), B23K26/146 (1), H01L29/06 (1) B23K26/146 (1), H01L23/49537 (1), H04B7/0626 (1), H03H7/09 (1), H02P27/06 (1)
With keywords such as: terminal, surface, layer, device, unit, semiconductor, data, direction, member, and connected in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Ryo KAMOSHIDA of Tokyo (JP) for mitsubishi electric corporation, Tamio MATSUMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B23K26/146, B23K26/14
CPC Code(s): B23K26/146
Abstract: a laser processing apparatus includes a stage having a wafer holding surface, a laser irradiation mechanism, and a nozzle. on the wafer holding surface, a semiconductor wafer having a first surface and a second surface opposite to the first surface is disposed such that the wafer holding surface faces the second surface. the laser irradiation mechanism applies a laser beam from a first surface side. the nozzle supplies a liquid from a second surface side.
Inventor(s): Daiji MORITA of Tokyo (JP) for mitsubishi electric corporation, Nobuhiro SHINOHARA of Tokyo (JP) for mitsubishi electric corporation, Takashi YUZAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): B23K26/342, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B23K26/342
Abstract: an additive manufacturing apparatus forming an inclined shaped object on an additive target surface of a base substrate, includes a material supply unit supplying the build material to a machining area of the additive target surface, an emission unit emitting laser beam to the machining area to melt the build material, and a control device controlling formation of the inclined shaped object by controlling the material supply unit and the emission unit. the control device causes a first inclination bead to be formed on a top surface of a lower inclination bead layer, and then causes a second inclination bead in contact with the top surface of the lower inclination bead layer and a side surface of the first inclination bead, to be formed at a position where part of the bottom surface of the second inclination bead has no contact with the lower inclination bead layer.
20240255199. AIR CONDITIONER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Ryuichi NAGATA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B41/31, F25B41/45
CPC Code(s): F25B41/31
Abstract: a refrigeration cycle apparatus includes a compressor, a four-way valve, an outdoor heat exchanger, an expansion valve, a gas-liquid separator, an indoor heat exchanger, and a refrigerant pipe that connects these components. the gas-liquid separator and a suction side of the compressor are connected by a bypass pipe. the refrigerant pipe includes a riser pipe, a curved pipe, and a down pipe sequentially connected from an upstream side to a downstream side of a flow of refrigerant. the bypass pipe is connected to the riser pipe located upstream of the curved pipe.
Inventor(s): Hiroki ISHIYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F25B43/00, F25B40/00, F25B41/31, F25B43/02
CPC Code(s): F25B43/006
Abstract: an accumulator includes a container where refrigerant is accumulated, an inflow pipe for flow of refrigerant into the container, an outflow pipe for flow of refrigerant out of the container, an oil return portion provided with an opening for suction of oil, and a decompressing pipe to decompress refrigerant. in the accumulator, the decompressing pipe and the oil return portion are arranged on the outflow pipe.
Inventor(s): Shigenobu TOCHIYAMA of Tokyo (JP) for mitsubishi electric corporation, Masayoshi TAMURA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): F28D9/00, B23K1/00, B23K20/02, B23K20/12, B23K101/00, B23P15/26
CPC Code(s): F28D9/0075
Abstract: a flowing direction of a cooling liquid introduced into a heat sink is a direction perpendicular to a stacking direction. each of the plates has a plurality of holes. in a state in which the plates are stacked in the stacking direction, flow paths formed by the holes of the plates being connected to each other in the stacking direction and the flowing direction have helical shapes toward the flowing direction. helix center axes at helix centers of the flow paths are formed in only one row in the stacking direction.
20240255278. SHAPE MEASURING DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yuya ARAI of Tokyo (JP) for mitsubishi electric corporation, Hiroyuki KAWANO of Tokyo (JP) for mitsubishi electric corporation, Keita MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01B11/25
CPC Code(s): G01B11/2545
Abstract: a shape measuring device includes: a first light radiating unit to radiate first line light and second line light: a first image capturing unit to capture an object; and a measuring unit to measure a shape of the object on a basis of a first image and second images.
Inventor(s): Yukihiko WADA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G01R31/26
CPC Code(s): G01R31/2642
Abstract: a service life diagnostic device includes a vce amplifier, a vee amplifier, and a service life diagnostic unit. the vce amplifier measures a voltage between a collector main terminal connected to a collector electrode of a semiconductor element mounted on a semiconductor device, and an emitter main terminal connected to an emitter electrode of the semiconductor element. the vee amplifier measures a voltage vee between the emitter main terminal and an emitter reference terminal connected to the emitter electrode. the service life diagnostic unit diagnoses a service life of the semiconductor device using a correlation value between a temporal change of the voltage vce and a temporal change of the voltage vee.
Inventor(s): Yosuke NAKAYAMA of Tokyo (JP) for mitsubishi electric corporation, Hiroe TAKENAGA of Tokyo (JP) for mitsubishi electric corporation, Ai KOSHI of Tokyo (JP) for mitsubishi electric corporation, Shuhei FUJITA of Tokyo (JP) for mitsubishi electric corporation, Nobutoshi TODOROKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G05D1/243, G05D1/223, G05D105/80, G06F3/01, G06T19/00
CPC Code(s): G05D1/243
Abstract: an object is to provide a technique to provide appropriate assistance for inspection work. an inspection work assistance apparatus includes a determination unit, an extraction unit, and a route creation unit. the determination unit determines whether any of the plurality of devices subject to inspection is a device with abnormality based on the inspection result. the extraction unit extracts an additional device for inspection related to the device with abnormality from the plurality of devices based on the related information related information that allows the plurality of devices to be related. the creation unit creates an inspection route passing through at least one of the plurality of devices subject to inspection and the additional device for inspection.
Inventor(s): Ikumi MORI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06F21/62, G06F21/60
CPC Code(s): G06F21/6218
Abstract: in a secret search system based on probabilistic encryption, a registration client device () registers data () to be searched for in secrecy and a keyword () corresponding to the data () in a secret search server device, and discloses disclosure bits, which are data to be externally disclosed and are part of data calculated deterministically using each keyword () registered in the secret search server device and a salt corresponding to each keyword () registered in the secret search server device. the registration client device () includes a disclosure bit calculation unit () to determine, as a determined salt, a salt corresponding to a registration keyword, which is the keyword () to be registered in the secret search server device. the disclosure bit calculation unit () determines the determined salt, taking into consideration a size of a bias in a distribution composed of disclosure bits already disclosed by the registration client device () and disclosure bits calculated using the registration keyword and the determined salt.
Inventor(s): Daishin ITO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): G06Q50/40, G06N5/022, G08G1/01
CPC Code(s): G06Q50/40
Abstract: a congestion prediction device includes a correction-model generating unit that generates a correction model that is a learning model for predicting, from values detected by one or more sensors, congestion-related information of a time point at which the one or more sensors perform detection; and a model learning unit that generates a prediction model that is a learning model for predicting a future congestion level from the congestion-related information, by using the congestion-related information of a first time point indicated by the past congestion-area data as input data and using the congestion level in the congestion-related information of a second time point indicated by the past congestion-area data as correct data, the second time point being a time point after the first time point.
Inventor(s): Masayuki NISHIYAMA of Tokyo (JP) for mitsubishi electric corporation, Naoki YOSHIMATSU of Tokyo (JP) for mitsubishi electric corporation, Rei YONEYAMA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L21/67, B23K26/402, B23K26/53, H01L21/268, H01L23/00
CPC Code(s): H01L21/67126
Abstract: a semiconductor manufacturing apparatus of the present disclosure includes a semiconductor module having a semiconductor device, a sealing material adapted to seal the semiconductor module, and a second terminal to be arranged outside the sealing material. the semiconductor module includes a first terminal electrically connected to the semiconductor device and extending to the outside of the sealing material. the first terminal is joined to the second terminal outside the sealing material. the thickness of the second terminal in a direction perpendicular to a joined face of the first terminal and the second terminal is defined as the thickness of the second terminal. the thickness of the first terminal at a portion extending from the sealing material in the direction perpendicular to the joined face is defined as the thickness of the first terminal. the thickness of the second terminal is greater than the thickness of the first terminal.
20240258188. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shoji SAITO of Tokyo (JP) for mitsubishi electric corporation, Seiichiro INOKUCHI of Tokyo (JP) for mitsubishi electric corporation, Taishi SASAKI of Tokyo (JP) for mitsubishi electric corporation, Hiroya SANNAI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/31, H01L23/00, H01L23/29, H01L23/498
CPC Code(s): H01L23/3135
Abstract: an object is to provide a technique capable of suppressing a crack that reaches a semiconductor element. a semiconductor device includes a semiconductor element, a lead electrode terminal, a first sealing member, and an intervening member. the lead electrode terminal has an extending portion separated from an upper surface of the semiconductor element, and is bonded to the semiconductor element. the first sealing member seals the lead electrode terminal. the intervening member is provided between an end portion of the extending portion in an extending direction and the semiconductor element. the intervening member has an interface with the first sealing member under the end portion.
20240258209. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Kazuo FUNAHASHI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/495
CPC Code(s): H01L23/49537
Abstract: a semiconductor device includes: a plurality of lead frames; a plurality of semiconductor elements mounted to the plurality of lead frames; a heat sink disposed below the plurality of lead frames; and an insulating sheet interposed between the plurality of lead frames and the heat sink. the insulating sheet and the heat sink are each divided into two or more portions, and all the plurality of semiconductor elements are arranged at positions overlapping the insulating sheet and the heat sink in plan view.
Inventor(s): Yuki TERADO of Tokyo (JP) for mitsubishi electric corporation, Kazuya HOKAZONO of Tokyo (JP) for mitsubishi electric corporation, Hongbo ZHANG of Tokyo (JP) for mitsubishi electric corporation, Shiori UOTA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/00, H01L23/495, H01L25/16
CPC Code(s): H01L24/05
Abstract: the bonding pad includes a surface electrode layer that has a first surface; a resistance layer that has a second surface; a stress buffer layer that is disposed between the surface electrode layer and the resistance layer in the first direction; and a connecting member that connects the surface electrode layer and the stress buffer layer in the first direction. the connecting member includes an insulator that is in contact with the each of the surface electrode layer and the stress buffer layer in the first direction, and a plurality of plugs that are in contact with the insulator in the direction orthogonal to the first direction and electrically connect the surface electrode layer and the stress buffer layer. in the first direction, a thickness of the stress buffer layer is larger than a thickness of the surface electrode layer.
Inventor(s): Naoki YOSHIMATSU of Tokyo (JP) for mitsubishi electric corporation, Norikazu SAKAI of Tokyo (JP) for mitsubishi electric corporation, Hiroyuki MASUMOTO of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L23/00
CPC Code(s): H01L24/83
Abstract: a method of manufacturing a semiconductor device includes a transfer molding step and a mold package mounting step. the mold package mounting step includes steps of disposing a semiconductor module on an upper surface of a metal base plate with a second bonding member therebetween, heating the metal base plate, the second bonding member, and the semiconductor module to melt the second bonding member, and then cooling the metal base plate, the second bonding member, and the semiconductor module to cure the second bonding member. during the cooling of the metal base plate, the second bonding member, and the semiconductor module, a difference between an upper surface temperature of the metal base plate and a lower surface temperature of a first metal plate at a solid phase line of the second bonding member is 5� c. or less.
Inventor(s): Munenori IKEDA of Tokyo (JP) for mitsubishi electric corporation, Tetsuya NITTA of Tokyo (JP) for mitsubishi electric corporation, Kenji HARADA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01L27/06, H01L21/225, H01L21/265, H01L21/266, H01L27/07, H01L29/06, H01L29/08, H01L29/10, H01L29/66, H01L29/739, H01L29/861
CPC Code(s): H01L27/0664
Abstract: an igbt region includes: an n-type carrier accumulation layer provided to be in contact with the n-type drift layer on the first main surface side of the n-type drift layer and having a higher n-type impurity concentration than the n-type drift layer, a p-type base layer provided between the n-type carrier accumulation layer and the first main surface, an n-type emitter layer selectively provided in a surface layer portion of the p-type base layer, and a gate electrode provided to face the n-type emitter layer and the p-type base layer with an interposition of an insulating film. a diode region includes a p-type anode layer provided between the n-type drift layer and the first main surface and provided to a position deeper from the first main surface than a boundary between the n-type carrier accumulation layer and the n-type drift layer.
20240258691. ANTENNA DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shingo YAMAURA of Tokyo (JP) for mitsubishi electric corporation, Saki WADA of Tokyo (JP) for mitsubishi electric corporation, Kengo NISHIMOTO of Tokyo (JP) for mitsubishi electric corporation, Toru FUKASAWA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H01Q1/52, H01Q1/12, H01Q1/50, H01Q7/00
CPC Code(s): H01Q1/52
Abstract: an antenna device includes; a metal housing in which at least one surface thereof is open; a display unit provided inside the metal housing and configured to perform a display from the one surface of the metal housing toward outside; a first transparent conductor plate present in the display unit; a second transparent conductor plate provided to be spaced apart from the first transparent conductor plate in an outside or inside direction, the second transparent conductor plate to define a gap between the second transparent conductor plate and the metal housing; and a feed unit provided between the metal housing and the second transparent conductor plate.
Inventor(s): Hidehito YOSHIDA of Tokyo (JP) for mitsubishi electric corporation, Tomokazu SAKASHITA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02J50/10, H02J50/40
CPC Code(s): H02J50/10
Abstract: a power reception coil of a non-contact power supply device includes a plurality of power reception coil windings arranged along a movement direction of a moving object, and the adjacent power reception coil windings are disposed so as to partially overlap each other. accordingly, even if a power transmission coil is positioned at a boundary between the power reception coil windings, power supply performance does not decrease. in addition, one power reception coil winding is not opposed to two power transmission coils at a time, and thus a cancellation phenomenon of magnetic fields can be prevented and power can be stably supplied.
Inventor(s): Junya SUZUKI of Tokyo (JP) for mitsubishi electric corporation, Yoshihiko ONISHI of Tokyo (JP) for mitsubishi electric corporation, Isao SONODA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02K5/22, H01R12/58
CPC Code(s): H02K5/225
Abstract: a circuit connection device includes a connector having press-fit terminals, a circuit board that has terminal through holes formed, and the press-fit terminals are press-inserted into the terminal through holes, a terminal alignment member having a terminal guide that has guide through holes formed, where the guide through holes guide the press-fit terminals towards the terminal through holes, and a heat sink that has an opening which houses the terminal guide on an inside. first positioning protrusions are formed on one of the connector or the heat sink, and first positioning recesses are formed on the other thereof. second positioning protrusions are formed on one of the circuit board or the terminal alignment member, and second positioning recesses are formed on the other thereof. third positioning protrusions are formed on one of the heat sink or the terminal alignment member, and third positioning recesses are formed on the other thereof.
Inventor(s): Hidenori SUZUKI of Tokyo (JP) for mitsubishi electric corporation, Ryotaro HARADA of Tokyo (JP) for mitsubishi electric corporation, Yoshinobu KOJI of Hyogo (JP) for mitsubishi electric corporation
IPC Code(s): H02M3/335
CPC Code(s): H02M3/33584
Abstract: a power converter includes an inverter circuit, a variable reactor, a transformer, and a converter circuit. the inverter circuit includes a plurality of switching elements and snubber capacitors each connected in parallel to a corresponding one of the switching elements, and converts a first dc voltage into a first ac voltage. the variable reactor is disposed on the output side of the inverter circuit and configured to be variable in inductance value. the transformer insulates the primary side and the secondary side from each other, and converts the first ac voltage applied via the variable reactor into a second ac voltage. the converter circuit converts the second ac voltage into a second dc voltage.
Inventor(s): Yuki YOSHIDA of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation, Michio OTSUBO of Chiyoda-ku, Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H02P27/06
CPC Code(s): H02P27/06
Abstract: a control device controls a switching element that is connected to a conductor and that executes a switching operation for causing the conductor to switch between conductive and non-conductive states. the control device includes an element controller and a current value measurer. when a target conduction ratio is a positive value lower than 1, the element controller controls the switching element to be in an on-state during a period defined by a switching cycle and a detective conduction ratio than the target conduction ratio and equal to or lower than 1, in at least one cycle that is each the switching cycle. the current value measurer measures a value of direct current flowing in the conductor, based on a detected current value that is digital data generated in every sampling cycle independent from the switching cycle by detection of a current sensor signal output from a current sensor.
Inventor(s): Kenji HIROSE of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H03H7/09, H03H7/01, H05K9/00
CPC Code(s): H03H7/09
Abstract: disclosed is electrical and electronic apparatus that is configured in such a way as to include: a case which is a conductor; a terminal mounted to the case; a conductor wire whose one end is connected to the terminal and whose other end is connected to a circuit accommodated in the case; a capacitor whose one end is connected to the conductor wire; a case connection portion whose one end is connected to the other end of the capacitor and whose other end is connected to the case; and a wall whose peripheral part is in space enclosed by the case, the conductor wire, and the case connection portion, and is connected to the case in a state in which the wall is not in contact with the conductor wire.
20240259062. COMMUNICATION SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tadahiro SHIMODA of Tokyo (JP) for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation, Naofumi IWAYAMA of Tokyo (JP) for mitsubishi electric corporation, Tatsuya TOKUDA of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04B7/06, H04B7/0417, H04B17/391, H04L1/00, H04W28/18
CPC Code(s): H04B7/0626
Abstract: a communication system includes: a communication terminal that encodes transmission data by using an encoding model that encodes and outputs data that has been input; and a base station that decodes data encoded with the encoding model by using a decoding model that, when encoded data is input, decodes and outputs the data, the encoding model performs encoding on channel state-related data that is data on a channel state between the communication terminal and the base station, and the base station executes machine learning using learning data including the channel state-related data in an un-encoded state to generate the encoding model and the decoding model, and notifies the communication terminal of a learning result of the encoding model.
Inventor(s): Tadahiro SHIMODA of Tokyo (JP) for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo (JP) for mitsubishi electric corporation
IPC Code(s): H04W76/15, H04W8/26, H04W40/22, H04W88/08
CPC Code(s): H04W76/15
Abstract: a communication system is configured with a central unit and a distributed unit, includes a first base station that operates as a donor for integrated access and backhaul and one or more second base stations that operate as nodes for the integrated access and backhaul, and the central unit performs address configuration for multicasting data from a central unit toward a communication terminal in a backhaul adaptation layer in which data transmitted and received by the communication terminal is routed, on the distributed unit and the second base stations.
Mitsubishi Electric Corporation patent applications on August 1st, 2024
- Mitsubishi Electric Corporation
- B23K26/146
- B23K26/14
- CPC B23K26/146
- Mitsubishi electric corporation
- B23K26/342
- B33Y10/00
- B33Y30/00
- B33Y50/02
- CPC B23K26/342
- F25B41/31
- F25B41/45
- CPC F25B41/31
- F25B43/00
- F25B40/00
- F25B43/02
- CPC F25B43/006
- F28D9/00
- B23K1/00
- B23K20/02
- B23K20/12
- B23K101/00
- B23P15/26
- CPC F28D9/0075
- G01B11/25
- CPC G01B11/2545
- G01R31/26
- CPC G01R31/2642
- G05D1/243
- G05D1/223
- G05D105/80
- G06F3/01
- G06T19/00
- CPC G05D1/243
- G06F21/62
- G06F21/60
- CPC G06F21/6218
- G06Q50/40
- G06N5/022
- G08G1/01
- CPC G06Q50/40
- H01L21/67
- B23K26/402
- B23K26/53
- H01L21/268
- H01L23/00
- CPC H01L21/67126
- H01L23/31
- H01L23/29
- H01L23/498
- CPC H01L23/3135
- H01L23/495
- CPC H01L23/49537
- H01L25/16
- CPC H01L24/05
- CPC H01L24/83
- H01L27/06
- H01L21/225
- H01L21/265
- H01L21/266
- H01L27/07
- H01L29/06
- H01L29/08
- H01L29/10
- H01L29/66
- H01L29/739
- H01L29/861
- CPC H01L27/0664
- H01Q1/52
- H01Q1/12
- H01Q1/50
- H01Q7/00
- CPC H01Q1/52
- H02J50/10
- H02J50/40
- CPC H02J50/10
- H02K5/22
- H01R12/58
- CPC H02K5/225
- H02M3/335
- CPC H02M3/33584
- H02P27/06
- CPC H02P27/06
- H03H7/09
- H03H7/01
- H05K9/00
- CPC H03H7/09
- H04B7/06
- H04B7/0417
- H04B17/391
- H04L1/00
- H04W28/18
- CPC H04B7/0626
- H04W76/15
- H04W8/26
- H04W40/22
- H04W88/08
- CPC H04W76/15
