Micron technology, inc. (20240347525). APPARATUS INCLUDING STANDARD CELL simplified abstract
Contents
- 1 APPARATUS INCLUDING STANDARD CELL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS INCLUDING STANDARD CELL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Substrate Design
- 1.13 Original Abstract Submitted
APPARATUS INCLUDING STANDARD CELL
Organization Name
Inventor(s)
APPARATUS INCLUDING STANDARD CELL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347525 titled 'APPARATUS INCLUDING STANDARD CELL
Simplified Explanation
The patent application describes an apparatus with a semiconductor substrate containing different regions and wiring layers above them. The wiring layers connect transistors in the first and second regions.
- The apparatus includes a semiconductor substrate with distinct regions and wiring layers.
- The wiring layers connect transistors in the first and second regions.
- Different wiring layers serve specific functions in connecting the transistors.
Key Features and Innovation
- Utilizes multiple wiring layers to connect transistors of different conductivity types.
- Allows for efficient and effective connection of transistors within the semiconductor substrate.
Potential Applications
This technology can be applied in the semiconductor industry for the development of advanced electronic devices and integrated circuits.
Problems Solved
- Efficient connection of transistors in different regions of the semiconductor substrate.
- Improved performance and functionality of electronic devices.
Benefits
- Enhanced connectivity within the semiconductor substrate.
- Increased efficiency in electronic device manufacturing processes.
Commercial Applications
Advanced electronic devices, integrated circuits, and semiconductor components can benefit from this technology, leading to improved performance and functionality in various consumer electronics and industrial applications.
Prior Art
Readers can explore prior patents related to semiconductor substrate design and wiring layer configurations to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research
Researchers are continually exploring new methods to enhance the connectivity and efficiency of semiconductor devices, which may lead to further advancements in this technology.
Questions about Semiconductor Substrate Design
What are the key benefits of utilizing multiple wiring layers in semiconductor substrate design?
Multiple wiring layers allow for efficient connection of transistors of different conductivity types, enhancing the overall performance and functionality of electronic devices.
How does the configuration of wiring layers impact the connectivity within the semiconductor substrate?
The configuration of wiring layers determines how transistors in different regions are connected, influencing the efficiency and effectiveness of the semiconductor device.
Original Abstract Submitted
according to one or more embodiments of the disclosure, an apparatus comprises: a semiconductor substrate including a first region, a second region, and a third region between the first region and the second region; and a plurality of wiring layers, at least in part, above the third region. the first region includes first transistors of first conductivity-type. the second region includes second transistors of second conductivity-type. the wiring layers include a lower wiring layer, a middle wiring layer, and an upper wiring layer. one or more wirings in the middle wiring layer elongate through the third region in a first direction to connect ones of sources and drains of the first transistors and corresponding ones of sources and drains of the second transistors. one or more wirings in the lower wiring layer elongate in the third region in a second direction perpendicular to the first direction to connect ones of the wirings of the middle wiring layer and corresponding ones of the wirings of the middle wiring layer.
