Micron technology, inc. (20240347418). MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER simplified abstract
Contents
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
Organization Name
Inventor(s)
Pengyuan Zheng of Boise ID (US)
David Ross Economy of Boise ID (US)
Yongjun J. Hu of Boise ID (US)
Kent H. Zhuang of Boise ID (US)
Robert K. Grubbs of Boise ID (US)
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347418 titled 'MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
The patent application describes methods, systems, and devices related to a memory device with a thermal barrier. The thermal barrier, such as a low-density thermal barrier, is positioned between an access line and a cell component to thermally insulate the cell component from thermal energy generated in the memory device.
- The thermal barrier is formed on the surface of a barrier material by applying a plasma treatment.
- The thermal barrier has a lower density than the barrier material.
- The thermal barrier is configured to provide thermal insulation to the cell component.
Potential Applications: - Memory devices in electronic devices - Data storage systems - Semiconductor manufacturing
Problems Solved: - Preventing thermal damage to cell components in memory devices - Improving the efficiency and reliability of memory devices
Benefits: - Enhanced thermal management in memory devices - Increased longevity of memory components - Improved performance of memory devices
Commercial Applications: Title: "Enhanced Thermal Management for Memory Devices" This technology could be used in various electronic devices, data storage systems, and semiconductor manufacturing processes to improve thermal management and overall performance.
Questions about the technology: 1. How does the thermal barrier improve the efficiency of memory devices? - The thermal barrier insulates the cell component from thermal energy, preventing damage and improving overall performance. 2. What are the potential long-term benefits of implementing this technology in memory devices? - The technology could lead to increased longevity of memory components and improved reliability in various applications.
Original Abstract Submitted
methods, systems, and devices related to a memory device with a thermal barrier are described. the thermal barrier (e.g., a low density thermal barrier) may be positioned between an access line (e.g., a digit line or a word line) and a cell component. the thermal barrier may be formed on the surface of a barrier material by applying a plasma treatment to the barrier material. the thermal barrier may have a lower density than the barrier material and may be configured to thermally insulate the cell component from thermal energy generated in the memory device, among other benefits.
