Micron technology, inc. (20240312890). SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract
Contents
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
See Hiong Leow of Singapore (SG)
Chin Hui Chong of Singapore (SG)
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312890 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS
Simplified Explanation: The semiconductor device assembly described in the patent application includes a cross-stack substrate with multiple semiconductor dies in electric communication with an assembly substrate. A passive semiconductor component is carried by the cross-stack substrate and is in electric communication with the assembly substrate and a semiconductor die exclusively via the assembly substrate.
- The semiconductor device assembly comprises a cross-stack substrate with multiple semiconductor dies in electric communication with an assembly substrate.
- A passive semiconductor component is carried by the cross-stack substrate and is in electric communication with the assembly substrate and a semiconductor die exclusively via the assembly substrate.
Potential Applications: This technology could be applied in the development of advanced semiconductor devices, particularly in the field of integrated circuits and electronic components.
Problems Solved: This technology addresses the challenge of efficiently integrating passive semiconductor components with semiconductor dies in a compact and effective manner.
Benefits: The benefits of this technology include improved functionality and performance of semiconductor devices, enhanced integration of passive components, and potentially reduced size and complexity of electronic systems.
Commercial Applications: The semiconductor device assembly could have commercial applications in various industries such as consumer electronics, telecommunications, automotive, and industrial automation.
Prior Art: Prior art related to this technology may include research on advanced packaging techniques for semiconductor devices and integrated circuits.
Frequently Updated Research: Researchers may be exploring new materials and manufacturing processes to further enhance the performance and efficiency of semiconductor device assemblies.
Questions about Semiconductor Device Assembly: 1. How does the integration of passive semiconductor components with semiconductor dies improve the overall functionality of electronic systems? 2. What are the potential challenges in scaling up the production of semiconductor device assemblies for mass commercial use?
Original Abstract Submitted
at least one embodiment of a semiconductor device assembly include a cross-stack substrate can comprise an assembly substrate including an upper surface, a first and second die stack at the upper surface, and a cross-stack substrate spaced from the upper surface. the first and second die stacks can each include multiple semiconductor dies in electric communication with the assembly substrate, and the cross-stack substrate can be coupled to and extending between a first and a second semiconductor die of the first and second die stacks, respectively. a passive semiconductor component can be carried by the cross-stack substrate, and can be in electric communication with the assembly substrate. further, the passive semiconductor component can be in electric communication with the first semiconductor die of the first die stack exclusively via the assembly substrate.
