Micron technology, inc. (20240304371). SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR MAKING THE SAME simplified abstract
Contents
SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR MAKING THE SAME
Organization Name
Inventor(s)
Dustin L. Holloway of Meridian ID (US)
Jonathan S. Parry of Boise ID (US)
SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304371 titled 'SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR MAKING THE SAME
The abstract describes a semiconductor assembly consisting of a substrate and an inductor. The inductor has a magnetic core with two rows of bond pads on opposite sides, connected by wire bonds and electrical traces running over and under the core through the substrate.
- The semiconductor assembly includes a substrate and an inductor with a magnetic core.
- The inductor has two rows of bond pads on opposite sides.
- Wire bonds connect the bond pads on the top side, running over the magnetic core.
- Electrical traces connect the bond pads on the underside, running under the magnetic core and through the substrate.
Potential Applications: - This technology can be used in various electronic devices requiring inductors. - It can be applied in power supplies, RF circuits, and other electronic systems.
Problems Solved: - Provides a compact and efficient way to integrate inductors into semiconductor assemblies. - Ensures proper connectivity and functionality of inductors in electronic devices.
Benefits: - Saves space and improves performance in electronic devices. - Enhances the reliability and functionality of inductors in semiconductor assemblies.
Commercial Applications: - This technology can be utilized in the manufacturing of consumer electronics, telecommunications equipment, and automotive electronics. - It has the potential to impact the semiconductor industry by offering more efficient and reliable inductor integration solutions.
Questions about the Technology: 1. How does the design of this semiconductor assembly improve the performance of electronic devices? 2. What are the key advantages of using wire bonds and electrical traces in connecting the bond pads of the inductor?
Frequently Updated Research: - Stay updated on advancements in semiconductor assembly technology and inductor integration methods to enhance the efficiency and performance of electronic devices.
Original Abstract Submitted
a semiconductor assembly is provided. the assembly includes a substrate and an inductor. the inductor includes a magnetic core with a first row of first bond pads on a first side and a second row of second bonds pads on a second side, the second side being opposite to the first side. the inductor further includes a plurality of wire bonds, each wire bond connecting a topside of one of the first bond pads to a topside of one of the second bond pads by running over the magnetic core, and a plurality of electrical traces connecting an underside of one of the first bond pads to an underside of one of the second bond pads by running under the magnetic core and through the substrate.
