Micron technology, inc. (20240303157). MEMORY DIE FAULT DETECTION USING A CALIBRATION PIN simplified abstract

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MEMORY DIE FAULT DETECTION USING A CALIBRATION PIN

Organization Name

micron technology, inc.

Inventor(s)

Scott E. Schaefer of Boise ID (US)

Paul A. Laberge of Shoreview MN (US)

MEMORY DIE FAULT DETECTION USING A CALIBRATION PIN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240303157 titled 'MEMORY DIE FAULT DETECTION USING A CALIBRATION PIN

Simplified Explanation: The patent application describes methods, systems, and devices for detecting memory die faults using a calibration pin. A memory device can calibrate resistors in memory dies using the pin and identify fault conditions based on the calibration results.

  • Memory device performs calibration on memory dies using a calibration pin.
  • Pin is coupled with the memory module to calibrate resistors in memory dies.
  • Fault conditions in memory dies are identified based on calibration results.
  • Memory device can execute commands from a host device to address fault conditions.
  • Indication of faulty memory dies can be provided to the host device.

Key Features and Innovation:

  • Calibration pin used for detecting memory die faults.
  • Identification of fault conditions in memory dies through calibration.
  • Execution of commands to address fault conditions.
  • Communication between memory device and host device for fault detection.
  • Efficient and accurate fault detection process.

Potential Applications: This technology can be applied in:

  • Computer memory systems
  • Data centers
  • Embedded systems
  • Industrial automation
  • Telecommunications equipment

Problems Solved:

  • Quick and accurate detection of memory die faults.
  • Improved reliability of memory modules.
  • Enhanced performance of memory devices.
  • Reduction in downtime due to memory failures.
  • Cost-effective maintenance of memory systems.

Benefits:

  • Increased reliability and performance of memory modules.
  • Minimized risk of data loss due to memory faults.
  • Efficient troubleshooting and maintenance of memory devices.
  • Enhanced user experience with reliable memory systems.
  • Cost savings through proactive fault detection.

Commercial Applications: Title: Memory Die Fault Detection Technology for Enhanced Reliability This technology can be utilized in various commercial applications such as:

  • Memory module manufacturing industry
  • Data center management companies
  • Electronics and semiconductor companies
  • IT infrastructure providers
  • Telecommunication equipment manufacturers

Prior Art: Readers can explore prior art related to memory die fault detection technologies in the field of semiconductor testing and memory module diagnostics.

Frequently Updated Research: Researchers are constantly working on improving memory fault detection techniques, exploring new calibration methods, and enhancing the efficiency of memory diagnostic tools.

Questions about Memory Die Fault Detection: 1. How does the calibration pin help in detecting memory die faults? 2. What are the potential implications of this technology in the semiconductor industry?


Original Abstract Submitted

methods, systems, and devices for memory die fault detection using a calibration pin are described. a memory device may perform a calibration procedure on a first resistor of each of a set of memory dies of a memory module using a pin coupled with the memory module. the memory device may couple the pin to a second resistor of a memory die of the set of memory dies based on the memory die identifying a fault condition for the memory die executing one or more of multiple commands from the host device. the memory device may receive, from the host device, a command to read a register of one or more memory dies of the set of memory dies and may output, to the host device, an indication of the memory die that identified the fault condition based on coupling the pin to the second resistor.