Micron technology, inc. (20240302433). APPARATUS AND TEST ELEMENT GROUP simplified abstract
Contents
APPARATUS AND TEST ELEMENT GROUP
Organization Name
Inventor(s)
FUMIE Uchida of Kyoto-shi (JP)
APPARATUS AND TEST ELEMENT GROUP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240302433 titled 'APPARATUS AND TEST ELEMENT GROUP
The patent application describes an apparatus with multiple active regions on a semiconductor substrate, an active bridge region connecting two of these active regions, and test circuit elements on the active bridge region and the two active regions.
- The apparatus includes a plurality of active regions on a semiconductor substrate.
- An active bridge region connects two of the active regions.
- Test circuit elements are located on the active bridge region and the two active regions.
Potential Applications: - This technology could be used in the development of advanced semiconductor devices. - It may find applications in the field of integrated circuits and microelectronics.
Problems Solved: - Provides a more efficient way to test circuit elements on semiconductor substrates. - Enhances the connectivity between active regions on the substrate.
Benefits: - Improved testing capabilities for semiconductor devices. - Enhanced functionality and connectivity in semiconductor designs.
Commercial Applications: - This technology could be valuable for semiconductor manufacturers looking to improve testing processes and overall device performance.
Questions about the Technology: 1. How does this innovation impact the efficiency of testing semiconductor devices? 2. What are the potential cost savings associated with using this technology in semiconductor manufacturing processes?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor testing methodologies and circuit element connectivity.
Original Abstract Submitted
according to one or more embodiments of the disclosure, an apparatus comprising a plurality of active regions on a semiconductor substrate, an active bridge region connecting two active regions among the plurality of active regions, and a plurality of test circuit elements on the active bridge region and the two active regions.
