Micron technology, inc. (20240297149). STACKED SEMICONDUCTOR DEVICE simplified abstract
Contents
STACKED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Bharat Bhushan of Taichung (TW)
Akshay N. Singh of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
STACKED SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297149 titled 'STACKED SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device assembly that includes a logic die, a top memory die, and one or more intermediate memory dies positioned between the top memory die and the logic die. By arranging the intermediate memory dies in this manner, a cost-efficient and low-complexity semiconductor device can be assembled.
Key Features and Innovation:
- Semiconductor device assembly with logic die, top memory die, and intermediate memory dies.
- Intermediate memory dies positioned between the top memory die and logic die.
- Cost-efficient and low-complexity assembly process.
Potential Applications: The technology can be applied in various electronic devices such as smartphones, tablets, and computers.
Problems Solved: This technology addresses the need for cost-effective and simplified semiconductor device assembly processes.
Benefits:
- Cost savings in semiconductor device manufacturing.
- Streamlined assembly process.
- Improved efficiency in device production.
Commercial Applications: Potential commercial applications include consumer electronics manufacturing, semiconductor industry, and technology development companies.
Questions about the Technology: 1. How does the arrangement of the intermediate memory dies contribute to cost efficiency in the semiconductor device assembly process? 2. What are the specific advantages of having the intermediate memory dies positioned between the top memory die and logic die in terms of device performance and functionality?
Original Abstract Submitted
a semiconductor device assembly is provided. the semiconductor device assembly includes a logic die, a top memory die, and a one or more intermediate memory dies between the top memory die and the logic die. front sides of the one or more intermediate memory dies at which active circuitry is disposed face a front side of the top memory die. back sides of the one or more intermediate memory dies opposite the front sides face a back side of the logic die. in doing so, a cost-efficient, low-complexity semiconductor device can be assembled.
