Micron technology, inc. (20240295975). CONFIGURABLE MEMORY DIE CAPACITANCE simplified abstract
Contents
CONFIGURABLE MEMORY DIE CAPACITANCE
Organization Name
Inventor(s)
Jingwei Cheng of Shanghai (CN)
CONFIGURABLE MEMORY DIE CAPACITANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240295975 titled 'CONFIGURABLE MEMORY DIE CAPACITANCE
Simplified Explanation: The patent application describes methods, systems, and devices for configurable memory die capacitance. A memory device includes a capacitive component with capacitors and switching components that can be selectively coupled with an input/output pad.
- Memory device includes a capacitive component with capacitors and switching components.
- Capacitors can be selectively coupled with an input/output pad via switching components.
- Switching components can be activated individually or in coordination.
- Configuration of the capacitive component can be based on signaling from a host device.
- Capacitive component, input/output pad, and input buffer are included in the same die of the memory device.
Potential Applications: This technology can be applied in various memory devices, such as DRAM, to optimize capacitance configurations based on different requirements.
Problems Solved: This technology addresses the need for configurable memory die capacitance to enhance memory device performance and efficiency.
Benefits: - Improved memory device performance - Enhanced efficiency in memory operations - Flexibility in configuring capacitance based on requirements
Commercial Applications: Optimizing memory die capacitance can lead to more efficient and high-performance memory devices, benefiting industries such as consumer electronics, data centers, and telecommunications.
Prior Art: Prior art related to configurable memory die capacitance can be found in research papers and patents related to memory device design and optimization.
Frequently Updated Research: Stay updated on advancements in memory device technology, particularly in the area of configurable capacitance for improved performance and efficiency.
Questions about Configurable Memory Die Capacitance: 1. How does configurable memory die capacitance impact memory device performance? 2. What are the potential challenges in implementing configurable capacitance in memory devices?
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Original Abstract Submitted
methods, systems, and devices for configurable memory die capacitance are described. a memory device may include a capacitive component, which may include one or more capacitors and associated switching components. the capacitive component may be coupled with an input/output (i/o) pad and an associated input buffer, and the one or more capacitors of the capacitive component may be selectively couplable with the i/o pad via the switching components. switching components may be activated individually, in coordination, or not at all, such that one, multiple, or none of the capacitors may be coupled with the i/o pad. the capacitive component, i/o pad, and input buffer may be included in a same die of the memory device. in some cases, a configuration of the capacitive component may be based on signaling received from a host device.
