Micron technology, inc. (20240289242). INPUT/OUTPUT (I/O) COMPONENT TESTING simplified abstract
Contents
INPUT/OUTPUT (I/O) COMPONENT TESTING
Organization Name
Inventor(s)
Ming-ta Hsieh of Woodbury MN (US)
Taylor Loftsgaarden of Eden Prairie MN (US)
INPUT/OUTPUT (I/O) COMPONENT TESTING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240289242 titled 'INPUT/OUTPUT (I/O) COMPONENT TESTING
Simplified Explanation:
The patent application discusses a method of testing input/output (i/o) components collectively by linking them together to transmit a test signal through the components in a single transmission.
- i/o components can be tested collectively
- Test signal is transmitted through linked i/o components
- Components are tested via a single transmission of the test signal
Key Features and Innovation:
- Collective testing of i/o components
- Linking components to transmit test signal
- Single transmission for testing multiple components
Potential Applications:
This technology can be applied in various industries such as electronics, telecommunications, and automation for efficient testing of i/o components.
Problems Solved:
This technology addresses the challenge of individually testing multiple i/o components, saving time and resources.
Benefits:
- Time-saving testing process
- Resource-efficient testing method
- Enhanced reliability of i/o components
Commercial Applications:
The technology can be utilized in manufacturing processes, quality control systems, and product development in various industries.
Questions about the Technology:
1. How does this technology improve the testing process for i/o components?
This technology streamlines the testing process by allowing multiple components to be tested collectively in a single transmission, saving time and resources.
2. What industries can benefit from the collective testing of i/o components?
Industries such as electronics, telecommunications, and automation can benefit from this technology by improving the efficiency of testing processes.
Original Abstract Submitted
i/o components can be tested in a collective manner. i/o components can be linked such that a test signal is transmitted through the i/o components (e.g., by being propagated from one i/o component to another i/o component) such that the i/o components are tested via a single transmission of the test signal.
