Micron technology, inc. (20240282751). SUBSTRATES WITH DOWNSET simplified abstract
Contents
SUBSTRATES WITH DOWNSET
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
Chong C. Hui of Singapore (SG)
SUBSTRATES WITH DOWNSET - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282751 titled 'SUBSTRATES WITH DOWNSET
- Simplified Explanation:**
The patent application describes a system with packaged electronic devices containing multiple dies arranged on a substrate with a downset design. This design includes an upper portion, a lower portion, and a downset portion that connects the two. The downset portion features through vias for conductive paths between the upper and lower portions, with walls defining regions for positioning dies. A non-conductive film covers the dies in these regions, allowing for additional dies to be placed on top. This design helps raise the neutral axis of the packaged electronic device to near the top surface of the dies.
- Key Features and Innovation:**
- System with packaged electronic devices containing multiple dies - Substrate with a downset design featuring upper, lower, and downset portions - Through vias in the downset portion for conductive paths - Non-conductive film covering dies in defined regions - Ability to position additional dies on top of the non-conductive film - Raises the neutral axis of the packaged electronic device to near the top surface of the dies
- Potential Applications:**
- Consumer electronics - Automotive systems - Aerospace technology - Medical devices - Industrial equipment
- Problems Solved:**
- Efficient arrangement of multiple dies on a substrate - Providing conductive paths between upper and lower portions - Protecting dies with a non-conductive film - Raising the neutral axis of the packaged electronic device
- Benefits:**
- Improved performance of electronic devices - Enhanced reliability and durability - Space-saving design - Facilitates thermal management - Enables higher integration levels
- Commercial Applications:**
Title: Advanced Packaging Solutions for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, medical, and industrial sectors. Companies can benefit from improved product performance, reliability, and space-saving design, leading to competitive advantages in the market.
- Questions about the Technology:**
1. How does the downset design help in raising the neutral axis of the packaged electronic device? 2. What are the potential challenges in implementing a system with packaged electronic devices containing multiple dies arranged on a substrate with a downset design?
Original Abstract Submitted
a variety of applications can include systems with packaged electronic devices having multiple dies arranged on a substrate with a downset design. a substrate with a downset design can include an upper portion and a lower portion with a downset portion connecting the upper portion to the lower portion. the downset portion can include through vias to provide conductive paths between the lower portion and the upper portion. dies can be positioned with a region defined by walls of the downset portion with a non-conductive film covering the dies in the region defined by walls of the downset portion. additional dies can be positioned on the non-conductive film and the upper portion of the substrate. a packaged electronic device having a substrate with a downset design can be implemented to raise the neutral axis of the packaged electronic device to near the top surface of the dies.
