Micron technology, inc. (20240282733). SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Bong Woo Choi of Singapore (SG)
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282733 titled 'SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
The patent application relates to a device with a delamination reduction mechanism between a solder resist layer and a contact pad on a substrate, with the mechanism having greater bonding strengths than direct contact between the layers.
- The device includes a delamination reduction mechanism between the solder resist layer and the contact pad.
- The mechanism has bonding strengths higher than direct contact between the layers.
- A solder opening in the solder resist layer is positioned over the contact pad.
- The delamination reduction mechanism prevents delamination between the layers.
Potential Applications: - Electronics manufacturing - Circuit board assembly - Semiconductor packaging
Problems Solved: - Delamination between solder resist layer and contact pad - Improved reliability and durability of electronic devices
Benefits: - Enhanced bonding strength - Reduced risk of delamination - Increased longevity of electronic components
Commercial Applications: Title: "Advanced Delamination Reduction Mechanism for Electronics Manufacturing" This technology can be used in various industries such as consumer electronics, automotive electronics, and telecommunications for improved product reliability and performance.
Questions about the technology: 1. How does the delamination reduction mechanism improve the reliability of electronic devices? - The delamination reduction mechanism enhances the bonding strength between the solder resist layer and the contact pad, reducing the risk of separation and improving the overall durability of the device.
2. What are the potential cost savings associated with implementing this delamination reduction mechanism in electronics manufacturing? - By preventing delamination issues, manufacturers can reduce the need for costly repairs and replacements, ultimately saving money in the long run.
Original Abstract Submitted
methods, apparatuses, and systems related to a device having a delamination reduction mechanism disposed between a solder resist layer and a contact pad of a substrate. the substrate may include a solder opening in the solder resist layer over the contact pad. the delamination reduction mechanism may have bonding strengths relative to the solder resist layer and the contact pad that are greater than a bonding strength associated with a direct contact between the solder resist layer and the contact pad.
