Micron technology, inc. (20240282730). INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES simplified abstract
Contents
INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES
Organization Name
Inventor(s)
Kishan Chanumolu of Bengaluru (IN)
Sandeep Dwivedi of Bengaluru (IN)
INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282730 titled 'INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES
The patent application describes an apparatus with a die that has multiple faces, including I/O cells for bonding to a package, and a bond area with decoupling capacitors.
- Die with multiple faces, including I/O cells for bonding to a package
- I/O cells can be selectively bonded to a package by wirebonded interconnections or flip-chip interconnections
- Bond area between I/O cells and the die with decoupling capacitors
- First pitch for wirebonded interconnections, second pitch for flip-chip interconnections
- Decoupling capacitors in the bond area for improved performance
Potential Applications: - Semiconductor packaging - Integrated circuits - Electronic devices
Problems Solved: - Efficient bonding of I/O cells to a package - Improved performance with decoupling capacitors - Flexibility in interconnection options
Benefits: - Enhanced electrical performance - Increased reliability - Versatile bonding options
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in various industries such as telecommunications, consumer electronics, and automotive for high-performance electronic devices.
Prior Art: Researchers can explore existing patents related to semiconductor packaging, interconnection technologies, and decoupling capacitors for further insights.
Frequently Updated Research: Researchers are constantly developing new methods for semiconductor packaging and interconnection technologies to improve performance and reliability.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the reliability of electronic devices? This technology enhances reliability by providing efficient bonding options and decoupling capacitors for improved performance.
2. What are the potential cost implications of implementing this advanced semiconductor packaging technology? Implementing this technology may initially have higher costs due to the use of advanced interconnection methods and decoupling capacitors, but the long-term benefits in performance and reliability outweigh the costs.
Original Abstract Submitted
an apparatus includes a die with a first face, a second face opposite the first face, and a third face located between the first face and the second face, i/o cells coupled to the first face of a die, where the i/o cells are configured to be selectively bonded to a package by wirebonded interconnections at a first pitch or flip-chip interconnections at a second pitch that is larger than the first pitch, and a bond area including decoupling capacitors that is located between each i/o cell and the third face of the die.
