Micron technology, inc. (20240268131). OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES simplified abstract
Contents
OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES
Organization Name
Inventor(s)
Timothy M. Hollis of Meridian ID (US)
Eric J. Stave of Meridian ID (US)
OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240268131 titled 'OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES
The abstract describes methods, systems, and devices for near memory photonics, including memory devices with optical interfaces to convert between electrical and optical signaling.
- Memory devices may include an array of optical emitters and receivers for this purpose.
- Optical signaling can be transmitted over one or more optical channels to a host device, which converts it back to electrical signaling.
- The optical interface may be positioned above or below a vertical stack of memory dies, or extend horizontally beyond the stack.
- In some cases, the optical interface may be distributed across a porch section of the interface component.
Potential Applications: - High-speed data transfer in memory devices - Improved energy efficiency in data processing systems - Enhanced performance in computing applications
Problems Solved: - Addressing the limitations of traditional electrical signaling in memory devices - Increasing data transfer speeds and efficiency - Integrating photonics technology into memory systems
Benefits: - Faster data transfer rates - Reduced power consumption - Enhanced computing performance
Commercial Applications: Title: Near Memory Photonics for High-Speed Data Processing This technology could be utilized in data centers, supercomputers, and other high-performance computing systems to improve data processing speeds and efficiency.
Questions about Near Memory Photonics: 1. How does the optical interface in memory devices improve data transfer speeds? 2. What are the potential challenges in implementing near memory photonics in commercial applications?
Frequently Updated Research: Researchers are continually exploring new materials and designs for optical interfaces in memory devices to further enhance data processing capabilities.
Original Abstract Submitted
methods, systems, and devices for near memory photonics are described. a memory device may include an optical interface, which may include an array of optical emitters and optical receivers, to convert between electrical signaling and optical signaling. for example, a vertical stack of memory dies may be coupled with an interface component which includes the optical interface. optical signaling may be carried over one or more optical channels to a host device, and the host device may include an optical interface to convert the optical signaling back to electrical signaling. in some examples, the interface component may be positioned above the vertical stack of memory dies. alternatively, the interface component may be positioned below the stack of memory dies, and may extend horizontally beyond the stack of memory dies, forming a porch section. in such cases, the optical interface may be distributed across the porch section.
