Micron technology, inc. (20240268077). MEMORY SUB-SYSTEM ENCLOSURE simplified abstract
Contents
- 1 MEMORY SUB-SYSTEM ENCLOSURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY SUB-SYSTEM ENCLOSURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Memory Sub-System Cooling
- 1.13 Original Abstract Submitted
MEMORY SUB-SYSTEM ENCLOSURE
Organization Name
Inventor(s)
Suresh Reddy Yarragunta of Bangalore (IN)
Deepu Narasimiah Subhash of Yeshwanthpu (IN)
Ravi Kumar Kollipara of Puppalaguda (IN)
MEMORY SUB-SYSTEM ENCLOSURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240268077 titled 'MEMORY SUB-SYSTEM ENCLOSURE
Simplified Explanation
The patent application describes a memory sub-system with isothermal cooling of components using a heat spreader, heat sink, and vapor chamber to efficiently transfer heat and avoid hot spots.
- Memory sub-system with isothermal cooling
- Heat spreader and heat sink for thermal coupling
- Vapor chamber for heat transfer between enclosures
- Efficient heat dissipation to prevent hot spots
Key Features and Innovation
- Memory sub-system with isothermal cooling - Efficient heat transfer using heat spreader, heat sink, and vapor chamber - Prevention of hot spots on the PCB assembly
Potential Applications
- Data centers - High-performance computing systems - Industrial applications requiring efficient cooling
Problems Solved
- Overheating of memory components - Uneven heat distribution on PCB assembly - Creation of hot spots leading to potential damage
Benefits
- Improved thermal management - Enhanced system reliability - Increased longevity of memory components
Commercial Applications
Potential commercial applications include: - Server farms - Supercomputers - Industrial control systems
Prior Art
Readers can explore prior art related to memory sub-system cooling, heat spreaders, heat sinks, and vapor chambers in the field of thermal management technologies.
Frequently Updated Research
Stay updated on the latest research in thermal management technologies, memory sub-system cooling, and heat dissipation methods to enhance system performance and reliability.
Questions about Memory Sub-System Cooling
How does isothermal cooling benefit memory components?
Isothermal cooling helps maintain a consistent temperature across memory components, preventing overheating and ensuring optimal performance.
What are the advantages of using a vapor chamber for heat transfer?
A vapor chamber efficiently transfers heat from one side of the PCB assembly to the other, preventing hot spots and improving overall thermal management.
Original Abstract Submitted
aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. a pcb assembly may be secured between a heat spreader and a heat sink that are thermally coupled. the heat sink radiates heat absorbed from both sides of the pcb assembly. by connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the pcb assembly not directly connected to the heat sink. the pcb assembly may be secured between a top enclosure and a bottom enclosure. the top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. the vapor chamber pumps heat from a higher-temperature side of the pcb assembly to a lower-temperature side of the pcb assembly. by using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.
