Micron technology, inc. (20240260281). MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract
Contents
- 1 MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Molded Memory Device Assemblies
- 1.13 Original Abstract Submitted
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240260281 titled 'MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY
Simplified Explanation
The patent application describes a molded memory device with multiple stacked NAND dies connected by wire bonds and enclosed in a molded casing with copper contacts for system integration.
Key Features and Innovation
- Molded memory device with multiple stacked NAND dies
- Electrical coupling via multiple wire bonds
- Molded casing encapsulating NAND dies and wire bonds
- Copper contacts for system integration
- First mold surrounding first portion of NAND die, second mold partially surrounding additional NAND dies
Potential Applications
The technology can be used in various semiconductor device assemblies requiring compact memory solutions with efficient electrical connections.
Problems Solved
The technology addresses the need for compact and reliable memory devices with multiple stacked NAND dies and secure electrical connections for system integration.
Benefits
- Compact design
- Efficient electrical connections
- Secure system integration
- Reliable memory performance
Commercial Applications
The technology can be applied in the development of advanced memory modules for various electronic devices, such as smartphones, tablets, and computers, enhancing their performance and storage capacity.
Prior Art
Readers can explore prior patents related to semiconductor device assemblies, stacked NAND dies, wire bonding techniques, and molded memory devices to gain a deeper understanding of the technology landscape.
Frequently Updated Research
Researchers are constantly exploring new materials and manufacturing techniques to improve the performance and reliability of semiconductor device assemblies, which may impact the development of similar technologies in the future.
Questions about Molded Memory Device Assemblies
What are the key features of molded memory device assemblies?
Molded memory device assemblies consist of multiple stacked NAND dies connected by wire bonds and enclosed in a molded casing with copper contacts for system integration.
How do molded memory device assemblies benefit electronic devices?
Molded memory device assemblies provide compact design, efficient electrical connections, secure system integration, and reliable memory performance for enhanced electronic device functionality.
Original Abstract Submitted
implementations described herein relate to various semiconductor device assemblies. in some implementations, a molded memory device may include multiple stacked nand dies electrically coupled to one another via multiple wire bonds. the molded memory device may include a molded casing surrounding the multiple stacked nand dies and encapsulating the multiple wire bonds, with the molded casing including a first mold surrounding a first portion of a first nand die, of the multiple stacked nand dies, and a second mold partially surrounding a second portion of the first nand die and each additional nand die, of the multiple nand dies. the molded memory device may include multiple copper contacts configured to couple the molded memory device to a substrate associated with a system in package, with the plurality of copper contacts being disposed in the first mold.
